公开(公告)号：US20060125042A1

公开(公告)日：2006-06-15

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L29/00

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。

公开(公告)号：US20060027905A1

公开(公告)日：2006-02-09

申请号：US11196497

申请日：2005-08-04

申请人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

发明人： Michael Bauer ,  Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Holger Woerner

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L29/82 ,  G01N33/48

CPC分类号： G01N33/48785 ,  B01L3/502715 ,  B01L9/52 ,  B01L2200/027 ,  B01L2300/0819 ,  B01L2300/0877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

公开(公告)号：US06949405B2

公开(公告)日：2005-09-27

申请号：US10679086

申请日：2003-10-02

申请人： Robert-Christian Hagen

发明人： Robert-Christian Hagen

IPC分类号： G01L9/00 ,  G01P1/02 ,  H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L29/84 ,  H01L31/0203

CPC分类号： G01L19/141 ,  G01P1/02 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic component is produced by incorporating a sacrificial part in a plastic housing shape. After molding, the sacrificial part is etched out or otherwise removed from the completed plastic housing. As a result, channels and/or cavities can be formed in the plastic housing in order to allow access to sensor areas on the semiconductor chip.

摘要翻译： 通过将牺牲部件结合成塑料壳体形状来制造电子部件。 在模制之后，牺牲部分被蚀刻掉或者从完成的塑料外壳中去除。 结果，可以在塑料外壳中形成通道和/或空腔，以便允许访问半导体芯片上的传感器区域。

公开(公告)号：US20050184375A1

公开(公告)日：2005-08-25

申请号：US11114766

申请日：2005-04-26

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Christian Stuempfl ,  Stefan Wein ,  Holger Woerner

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L23/495

CPC分类号： H01L24/96 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/48 ,  H01L24/82 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semiconductor chip on a rewiring substrate.

摘要翻译： 作为多芯片模块，电子设备具有集成到引线框架中的两个或更多个半导体芯片，使得引线框架的放置侧和电路芯片的有源顶侧齐平并具有公共的精细布线平面。 引线框架被布置为在重新布线基板上的扩展半导体芯片。

公开(公告)号：US06867471B2

公开(公告)日：2005-03-15

申请号：US10652362

申请日：2003-08-29

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Wörner

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/04 ,  H01L21/4763 ,  H01L29/72

CPC分类号： H01L23/498 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of a metal-clad base plate. Ideally, a panel having a number of component positions is provided for receiving a number of such an electronic component.

摘要翻译： 电子元件具有带芯片触点的半导体芯片。 芯片触点机械地固定在布线结构上并与布线结构电连接。 布线结构形成为结构化金属板的区域或者作为金属包覆基板的结构化金属层的区域。 理想地，具有多个分量位置的面板被提供用于接收多个这样的电子部件。

公开(公告)号：US08659135B2

公开(公告)日：2014-02-25

申请号：US11572873

申请日：2005-07-21

申请人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

发明人： Michael Bauer ,  Ulrich Bachmaier ,  Robert-Christian Hagen ,  Jens Pohl ,  Rainer Steiner ,  Hermann Vllsmeler ,  Holger Woerner ,  Bernhard Zuhr

IPC分类号： H01L23/488

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate, which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

摘要翻译： 公开了一种具有布线基板和半导体器件堆叠的中间布线板的半导体堆叠和半导体基底器件。 在一个实施例中，半导体芯片布置在中间布线板和布线基板之间，其一方面通过布线基板与布线基板的下侧上的外部触点电连接，另一方面与布线基板 接线基板的边缘区域的端子区域。 中间布线板具有成角度的外部扁平导体，其电连接在布线板的接触端子区域中。 此外，在中间布线板的上侧，布置在内部扁平导体的自由端上的是外部接触端子区域，其尺寸和布置对应于要堆叠的半导体器件的外部触点。

公开(公告)号：US07700956B2

公开(公告)日：2010-04-20

申请号：US10561819

申请日：2004-06-04

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L27/15

CPC分类号： H04N5/2253 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0411 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01032 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H04N5/2254 ,  H04N5/2257

摘要： A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

摘要翻译： 公开了用于生产传感器部件和面板。 除了具有传感器区域的传感器芯片之外，传感器部件还具有后侧和无源部件。 它们共同地嵌入塑料组合物中，使得它们各自的电极可以从塑料板的整个顶侧布线。

公开(公告)号：US07554196B2

公开(公告)日：2009-06-30

申请号：US11247068

申请日：2005-10-11

申请人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen

发明人： Ulrich Bachmaier ,  Michael Bauer ,  Robert-Christian Hagen

IPC分类号： H01L23/06 ,  H01L23/522

CPC分类号： H01L23/49805 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.

摘要翻译： 公开了一种塑料封装件和包括这种塑料封装件的半导体元件，以及其生产方法。 在一个实施例中，塑料封装包括塑料外表面，其包括在塑料封装的下侧上的下外接触面和上侧的上外接触面，其通过外部导体轨迹连接在一起。 导体轨迹包括形成在塑料封装中暴露的导电沉积物上的导电路径。

公开(公告)号：US07391103B2

公开(公告)日：2008-06-24

申请号：US10928458

申请日：2004-08-27

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Holger Woerner ,  Peter Strobel

IPC分类号： H01L23/02

CPC分类号： H01L24/82 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/49855 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2224/96 ,  H01L2224/82

摘要： The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

摘要翻译： 本发明涉及一种具有插头触点的电子模块，其具有嵌入塑料组合物中的半导体芯片，其后侧及其边缘侧。 半导体芯片的有源顶侧与塑料组合物一起形成整个顶侧，其上布置有具有插头接触区域的重新布线层和将插头接触区域连接到顶侧的接触区域的重新布线 的半导体芯片。

公开(公告)号：US20060258046A1

公开(公告)日：2006-11-16

申请号：US11491746

申请日：2006-07-24

申请人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

发明人： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

IPC分类号： H01L21/00

CPC分类号： H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

摘要： An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.