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21.发明申请公开(公告)号：US20140268607A1
公开(公告)日：2014-09-18
申请号：US13829921
申请日：2013-03-14
Inventor： Ryan B. Wicker , Francisco Medina , Eric MacDonald , Danny W. Muse , David Espalin
CPC classification number: H05K3/103 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/4813 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/85238 , H01L2224/85801 , H01L2924/00014 , H01L2924/12042 , H01L2924/1301 , H01L2924/181 , H05K1/0284 , H05K1/0296 , H05K3/321 , H05K3/328 , H05K3/34 , H05K2201/0129 , H05K2201/09036 , H05K2201/09681 , H05K2201/10977 , H05K2203/0195 , H05K2203/0285 , H05K2203/049 , Y10T29/49155 , Y10T29/5193 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Abstract translation: 本发明提供用于在三维结构，结构部件或结构电子，电磁或机电部件/装置内使用细丝创建层间机械或电连接或连接的系统和方法。
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公开(公告)号：US11203165B2
公开(公告)日：2021-12-21
申请号：US16459325
申请日：2019-07-01
Inventor： Chi Yen Kim , Ryan Wicker , David Espalin , Charlie Sullivan
IPC: B29C65/44 , B29C65/00 , B29C64/188
Abstract: A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.
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23.发明授权公开(公告)号：US10569464B2
公开(公告)日：2020-02-25
申请号：US15426344
申请日：2017-02-07
Inventor： Eric MacDonald , David Espalin , Isaac Varela , Ryan Wicker
IPC: B29C70/68 , B29C70/70 , B29C64/118 , B33Y10/00 , B33Y70/00 , B29C64/106 , B29C70/88 , B29C69/00 , B33Y80/00 , B33Y30/00 , B29K101/12 , B29K705/00 , B29L31/34 , B29C35/08
Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.
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公开(公告)号：US10259081B2
公开(公告)日：2019-04-16
申请号：US15426379
申请日：2017-02-07
Inventor： Eric MacDonald , David Espalin , Ryan Wicker
IPC: B33Y10/00 , B23K20/00 , B29C64/00 , B23K31/02 , B23K20/10 , B33Y40/00 , B33Y80/00 , B33Y70/00 , H05K1/02 , H05K3/46 , H05K3/34 , B29C70/88 , B29C39/10 , H05K3/40 , B29C64/106 , B29K705/00 , B23K101/36
Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.
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25.发明申请公开(公告)号：US20180354189A1
公开(公告)日：2018-12-13
申请号：US15426344
申请日：2017-02-07
Inventor： Eric MacDonald , David Espalin , Isaac Varela , Ryan Wicker
IPC: B29C64/118 , B33Y10/00 , B33Y80/00
Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.
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Patent Agency Ranking
公开(公告)号：US20180070453A1
公开(公告)日：2018-03-08
申请号：US15695828
申请日：2017-09-05
Inventor： David Espalin , Ryan Wicker , Alfonso Fernandez , Jorge Ramirez , Jose Motta
CPC classification number: H05K3/103 , B29C70/82 , B33Y10/00 , B33Y30/00 , B33Y50/02 , H05K1/0284 , H05K1/119 , H05K3/0014 , H05K2201/026 , H05K2201/0323 , H05K2203/0195 , H05K2203/1105 , H05K2203/163
Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
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27.发明授权公开(公告)号：US09777380B2
公开(公告)日：2017-10-03
申请号：US15202936
申请日：2016-07-06
Inventor： Eric MacDonald , David Espalin , Ryan Wicker
CPC classification number: C23C18/1641 , B29C64/00 , B29K2995/0006 , B29L2031/3425 , B33Y80/00 , C23C18/1608 , C23C18/1612 , H05K3/105 , H05K3/422 , H05K3/426 , H05K3/429 , H05K2203/072 , H05K2203/0759 , H05K2203/107
Abstract: A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
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28.发明申请MULTI-LAYERED 3D PRINTED LASER DIRECT STRUCTURING FOR ELECTRICAL INTERCONNECT AND ANTENNAS 有权多层3D打印激光直接结构电气互连和天线公开(公告)号：US20170013712A1
公开(公告)日：2017-01-12
申请号：US15202936
申请日：2016-07-06
Inventor： Eric MacDonald , David Espalin , Ryan Wicker
CPC classification number: C23C18/1641 , B29C64/00 , B29K2995/0006 , B29L2031/3425 , B33Y80/00 , C23C18/1608 , C23C18/1612 , H05K3/105 , H05K3/422 , H05K3/426 , H05K3/429 , H05K2203/072 , H05K2203/0759 , H05K2203/107
Abstract: A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
Abstract translation: 一种用于电互连和天线的多层3D印刷激光直接构造方法和装置。 3D打印组件可以配置有结构上集成的金属连接（例如，体高导电金属），其跨越使用通过迭代激光激活电镀工艺增强的添加剂制造系统制造的结构的多层（一些嵌入式和其它外部），其包括 一个新颖的井壁垂直互连。
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29.发明授权公开(公告)号：US09414501B2
公开(公告)日：2016-08-09
申请号：US13829921
申请日：2013-03-14
Inventor： Ryan B. Wicker , Francisco Medina , Eric MacDonald , Danny W. Muse , David Espalin
CPC classification number: H05K3/103 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2224/45144 , H01L2224/45147 , H01L2224/4813 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/85238 , H01L2224/85801 , H01L2924/00014 , H01L2924/12042 , H01L2924/1301 , H01L2924/181 , H05K1/0284 , H05K1/0296 , H05K3/321 , H05K3/328 , H05K3/34 , H05K2201/0129 , H05K2201/09036 , H05K2201/09681 , H05K2201/10977 , H05K2203/0195 , H05K2203/0285 , H05K2203/049 , Y10T29/49155 , Y10T29/5193 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Abstract translation: 本发明提供用于在三维结构，结构部件或结构电子，电磁或机电部件/装置内使用细丝创建层间机械或电连接或连接的系统和方法。
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30.发明申请Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices 审中-公开在3D结构，结构部件和结构电子，电磁和机电元件/器件中嵌入长丝的方法和系统公开(公告)号：US20140268604A1
公开(公告)日：2014-09-18
申请号：US13829723
申请日：2013-03-14
Inventor： Ryan B. Wicker , Francisco Medina , Eric MacDonald , Danny W. Muse , David Espalin
CPC classification number: B29C70/885 , B29C64/00 , B29C70/681 , B29C70/82 , B33Y10/00 , B33Y30/00 , H05K1/0284 , H05K3/103 , H05K2201/0129 , H05K2203/0285 , Y10T29/49171 , Y10T29/49172
Abstract: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Abstract translation: 本发明提供了通过提供至少第一层衬底材料将长丝或细丝网嵌入三维结构，结构部件或结构电子，电磁或机电部件/装置中的系统和方法，并至少嵌入 丝网或丝网的一部分在基材材料的第一层内，丝或丝网的部分基本上与第一层的顶表面齐平，并且处于可流动状态的基底材料被部分 长丝并且基本上不突出在第一层的顶表面之上，允许在嵌入的长丝或细丝网上方继续进行添加剂制造工艺。 提供了一种用于在三维结构，结构部件或结构电子，电磁或机电部件/装置内使用细丝创建层间机械或电连接或连接的方法。
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