公开(公告)号：US06979900B2

公开(公告)日：2005-12-27

申请号：US10689822

申请日：2003-10-21

申请人： Suresh K. Chengalva ,  Bruce A. Myers

发明人： Suresh K. Chengalva ,  Bruce A. Myers

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/34 ,  H01L23/36 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package and packaging method in which integral convective fins are formed of portions of a leadframe from which electrical leads are also formed. The leadframe comprises a base and first and second sets of leads extending from the base. The first set of leads is separated from the base and from the second set of leads, such that each lead of the first set has an interior end adjacent but separate from the base, and each lead of the second set has an interior portion that remains attached to the base. A circuit device is mounted to the base and electrically connected to the interior ends of the first set of leads. The device, base, and interior ends and portions of the leads are then encased within a housing. Exterior ends of the leads remain outside the housing as package terminals and thermal dissipaters.

摘要翻译： 一种电子封装和封装方法，其中整体对流散热片由形成电线的引线框架的部分形成。 引线框架包括基部和从基部延伸的第一和第二组引线。 第一组引线与基座和第二组引线分离，使得第一组的每个引线具有与基部相邻但与基部分离的内部端，并且第二组的每个引线具有保持的内部部分 附在基地。 电路装置安装到基座并电连接到第一组引线的内端。 然后将装置，底座，内端和引线的部分封装在外壳内。 引线的外端保持在外壳外部，作为封装端子和散热器。

公开(公告)号：US06807731B2

公开(公告)日：2004-10-26

申请号：US10114658

申请日：2002-04-02

申请人： Scott D. Brandenburg ,  Bruce A. Myers ,  Jeenhuei S. Tsai ,  Suresh K. Chengalva

发明人： Scott D. Brandenburg ,  Bruce A. Myers ,  Jeenhuei S. Tsai ,  Suresh K. Chengalva

IPC分类号： H05K330

CPC分类号： H05K5/065 ,  H05K1/0203 ,  H05K3/284 ,  H05K9/0045 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172

摘要： An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference (“EMI”) emissions from penetrating within the assembly to the circuit board without substantially increasing the cost of the unit. Thus, an electronic assembly having improved vibration, moisture, and EMI emission resistance is achieved as compared with traditional overmolded or metal assemblies. Further, because the shield can be formed on the electronic assembly in one continuous processing step, a substantial savings in time and cost for the manufacturing process is also realized.

摘要翻译： 一种包覆成型的电子组件，其具有金属薄膜或薄片形式的电磁干扰屏蔽件，该电磁干扰屏蔽件耦合到包覆成型体的顶部或内部。 屏蔽有效地减少了组件内电路干扰（“EMI”）的发射量，而不会大大增加设备的成本。 因此，与传统的包覆成型或金属组件相比，实现了具有改善的振动，湿度和EMI排放电阻的电子组件。 此外，由于可以在一个连续的处理步骤中在电子组件上形成屏蔽，所以也实现了制造过程的显着节省时间和成本。

公开(公告)号：US5400950A

公开(公告)日：1995-03-28

申请号：US199869

申请日：1994-02-22

申请人： Bruce A. Myers ,  Petrina L. Schnabel

发明人： Bruce A. Myers ,  Petrina L. Schnabel

IPC分类号： H01L21/60 ,  H05K3/34

CPC分类号： H01L24/81 ,  H05K3/3436 ,  H01L2224/13111 ,  H01L2224/17051 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/09781 ,  Y02P70/613

摘要： A method is provided for flip-chip bonding a flip chip to a substrate, which may be a ceramic substrate, printed wiring board, flexible circuit, or a silicon substrate, in which a number of input/output solder bumps are reflowed to both bond the flip chip to the circuit board as well as provide the necessary electrical connection between the flip chip and the circuit board's circuitry. The method enables the height of the input/output solder bumps to be closely controlled thereby providing sufficient spacing between the chip and its substrate, thus optimizing the cleanability and stress relief of the package. Generally, the preferred method involves the use of non-input/output, or "dummy" solder bumps which are present in sufficient numbers to overcome the tendency for the input/output solder bumps to draw the flip chip excessively close to the circuit board. Because the dummy solder bumps are electrically inactive, their height can be governed by electrically isolated pads on the surface of the circuit board. Consequently, definition of the input/output solder bumps and the dummy solder bumps does not require the use of solder stops or masks during formation or reflow of the solder bumps.

摘要翻译： 提供了一种将倒装芯片倒装成基板的方法，该基板可以是陶瓷基板，印刷线路板，柔性电路或硅基板，其中多个输入/输出焊料凸块被回流到两个键 倒装芯片到电路板，以及在倒装芯片和电路板电路之间提供必要的电连接。 该方法使得输入/输出焊料凸块的高度受到严格控制，从而在芯片和其基板之间提供足够的间隔，从而优化了封装的可清洁性和应力消除。 通常，优选的方法包括使用以数量足够数量存在的非输入/输出或“虚拟”焊料凸块，以克服输入/输出焊料凸块将触点片过度靠近电路板的趋势。 因为虚拟焊料凸块是电不活动的，所以它们的高度可以由电路板表面上的电隔离焊盘来控制。 因此，输入/输出焊料凸块和虚拟焊料凸块的定义在焊料凸块的形成或回流期间不需要使用焊料停止或掩模。

公开(公告)号：US5395679A

公开(公告)日：1995-03-07

申请号：US38379

申请日：1993-03-29

申请人： Bruce A. Myers ,  Dwadasi H. R. Sarma ,  Anil K. Kollipara ,  Ponnusamy Palanisamy

发明人： Bruce A. Myers ,  Dwadasi H. R. Sarma ,  Anil K. Kollipara ,  Ponnusamy Palanisamy

IPC分类号： H01L21/52 ,  H01L23/12 ,  H01L23/373 ,  H05K7/06 ,  H05K7/20 ,  B32B9/00

CPC分类号： H01L23/3735 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/14 ,  Y10S428/901 ,  Y10T428/12479 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12646 ,  Y10T428/12993 ,  Y10T428/24917

摘要： Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

摘要翻译： 公开了一种铜或银或其它适合的导体材料的超厚厚膜，用于沿着衬底横向散布热量，即在x和y方向上散热。 选择合适厚度的衬底以在诸如半导体芯片的发热部件之下的垂直或z方向上散发热量。 超厚膜具有约2至约5密耳的厚度，并且由平均粒度范围为约1微米至3微米的金属粉末制备。

公开(公告)号：US08438862B2

公开(公告)日：2013-05-14

申请号：US12606245

申请日：2009-10-27

申请人： Todd P. Oman ,  Craig A. Tieman ,  Michel F. Sultan ,  Dale L. Partin ,  Bruce A. Myers

发明人： Todd P. Oman ,  Craig A. Tieman ,  Michel F. Sultan ,  Dale L. Partin ,  Bruce A. Myers

IPC分类号： F25B21/02 ,  B60H3/00 ,  B60H1/00

CPC分类号： H05K7/20854

摘要： A thermal-protection apparatus disposed in a vehicle cabin or storage compartment includes a housing enveloping a chamber in which a thermally-sensitive consumer electronic device is received, a thermoelectric module mounted in a wall of the housing, and a remote electronic controller and power source coupled to the housing via an electrical cable for activating the thermoelectric module, and optionally the consumer electronic device, in a manner to prevent the temperature in the chamber from exceeding a prescribed maximum operating temperature of the consumer electronic device or falling below a prescribed minimum operating temperature of the consumer electronic device.

摘要翻译： 设置在车厢或储藏室中的热保护装置包括：壳体，其包围容纳热敏消费电子设备的室，安装在壳体的壁中的热电模块以及远程电子控制器和电源 通过用于激活热电模块的电缆以及任选的消费电子设备，以防止室内的温度超过消费者电子设备的规定的最大工作温度或低于规定的最小操作的方式耦合到壳体 消费电子设备的温度。

公开(公告)号：US07561436B2

公开(公告)日：2009-07-14

申请号：US11160015

申请日：2005-06-06

申请人： Scott D. Brandenburg ,  Bruce A. Myers

发明人： Scott D. Brandenburg ,  Bruce A. Myers

IPC分类号： H05K7/00

CPC分类号： H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.

摘要翻译： 一种电路组件，其包含结合到衬底上的表面安装（SM）IC封装线，并被配置为通过导热构件而不是衬底将热量从封装传导到散热器。 该封装包含IC器件，其表面上具有输入/输出焊盘，其与导体连接到衬底上的导体。 散热器位于封装附近，以便不被基板与封装分离。 导热构件邻近装置的与输入/输出垫相对的表面定位，并且结合到装置和散热器，以在封装和散热器之间提供不通过衬底的热路径。

公开(公告)号：US20080272485A1

公开(公告)日：2008-11-06

申请号：US11800003

申请日：2007-05-03

申请人： Bruce A. Myers ,  Joseph M. Ratell

发明人： Bruce A. Myers ,  Joseph M. Ratell

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/4012 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.

摘要翻译： 多个直接模具冷却的半导体功率器件封装件以冷却剂和电接口两者垂直堆叠形成液冷电力电子电路。 这些包装件是单独相同的，并且在堆叠之前选择性地取向以形成所需的电路连接并横向错开封装引线。

公开(公告)号：US07294926B2

公开(公告)日：2007-11-13

申请号：US11232499

申请日：2005-09-22

申请人： Peter J. Schubert ,  Bruce A. Myers

发明人： Peter J. Schubert ,  Bruce A. Myers

IPC分类号： H01L23/34 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip cooling system including a semiconductor device having a bulk region, wherein at least one fluid channel extends at least partially through the bulk region, the fluid channel having an inlet and an outlet, a fluid inlet port in fluid communication with the channel inlet, and a fluid outlet port in fluid communication with the channel outlet, and a cooling fluid flows from the fluid inlet port, through the fluid channel and to the fluid outlet port to cool the bulk region.

摘要翻译： 一种芯片冷却系统，包括具有主体区域的半导体器件，其中至少一个流体通道至少部分延伸穿过本体区域，所述流体通道具有入口和出口，与通道入口流体连通的流体入口， 以及与所述通道出口流体连通的流体出口，并且冷却流体从所述流体入口通过所述流体通道流动到所述流体出口以冷却所述主体区域。

公开(公告)号：US07269017B2

公开(公告)日：2007-09-11

申请号：US10904631

申请日：2004-11-19

申请人： Carl W. Berlin ,  Dwadasi Hara Rama Sarma ,  Bruce A. Myers

发明人： Carl W. Berlin ,  Dwadasi Hara Rama Sarma ,  Bruce A. Myers

IPC分类号： H05K7/20

CPC分类号： H05K1/0206 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/341 ,  H05K3/4061 ,  H05K2201/066 ,  H05K2201/10674 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A circuit board assembly with a substrate having a laminate construction of ceramic layers, such as an LTCC ceramic substrate. The substrate is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate. Thermally-conductive vias extend through the substrate from a first surface thereof to a second surface thereof. A circuit device is mounted to the first surface of the substrate and is electrically interconnected to conductor lines of the substrate. The device is also thermally coupled to the thermally-conductive vias with a first solder material. A heat sink located adjacent the second surface of the substrate is bonded to the thermally-conductive vias with a second solder material, such that the first solder material, the thermally-conductive vias, and the second solder material define a thermal path from the device to the heat sink.

摘要翻译： 一种具有衬底的电路板组件，其具有诸如LTCC陶瓷衬底的陶瓷层的层压结构。 基板被配置用于改进安装到基板的电力电路装置的热管理。 导热通孔从基板的第一表面延伸到第二表面。 电路装置安装在基板的第一表面上，并与基板的导体线电连接。 该器件还通过第一焊料材料热耦合到导热通孔。 位于基板的第二表面附近的散热片用第二焊料材料接合到导热通孔，使得第一焊料材料，导热通孔和第二焊料材料限定了来自该装置的热路径 到散热器

公开(公告)号：US07132746B2

公开(公告)日：2006-11-07

申请号：US10643043

申请日：2003-08-18

申请人： Scott D. Brandenburg ,  Bruce A. Myers

发明人： Scott D. Brandenburg ,  Bruce A. Myers

IPC分类号： H01L23/34 ,  H01L23/473 ,  H01L23/372 ,  H01L23/52

CPC分类号： H01L25/165 ,  B23K1/0008 ,  B23K35/26 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K7/20436 ,  H05K7/20854

摘要： A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the heat-conductive member with a solder joint formed of indium and optionally one or more alloying constituents that increase the melting temperature of the solder joint above that of indium. The housing member, substrate, and device are assembled so that an indium-containing solder material is present between the heat-conductive member and the surface of the device opposite the substrate. The solder material is then reflowed to form the solder joint. The alloying constituent(s) are preferably introduced into the solder joint during reflow.

摘要翻译： 一种用于从安装到基板的半导体电路装置传导热量的工艺和电子组件。 衬底由配备有导热构件的壳体构件支撑。 与衬底相对的器件的表面通过由铟形成的焊接接头和任选的一种或多种将焊接点的熔化温度提高到高于铟的熔化温度的合金成分而结合到导热部件。 壳体构件，基板和装置组装成使得含铟焊料材料存在于导热构件和与衬底相对的装置表面之间。 焊料材料然后回流以形成焊接接头。 在回流期间，优选将合金成分引入焊点。