公开(公告)号：US4642161A

公开(公告)日：1987-02-10

申请号：US823003

申请日：1986-01-27

申请人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

发明人： Haruo Akahoshi ,  Kanji Murakami ,  Motoyo Wajima ,  Kiyonori Kogawa ,  Ritsuji Toba ,  Takeshi Shimazaki

IPC分类号： B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  C08J5/12 ,  C23C18/40 ,  C23C22/05 ,  C23C22/63 ,  C23C22/83 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  C23F1/02 ,  B31B31/26 ,  B44C1/22

CPC分类号： B32B15/08 ,  C23C18/40 ,  C23C22/63 ,  C23C22/83 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/4611

摘要： A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

摘要翻译： 公开了一种将铜和树脂接合在一起的方法，其包括在铜的表面上形成氧化铜层以与树脂接合，将还原溶液将氧化铜层还原为金属铜，并将金属铜和 树脂在一起。 根据该方法，可以获得接合界面的良好的耐酸性和足够高的接合强度。

公开(公告)号：US5021296A

公开(公告)日：1991-06-04

申请号：US408530

申请日：1989-09-18

申请人： Yoshihiro Suzuki ,  Toshinari Takada ,  Masahiro Suzuki ,  Haruo Akahoshi ,  Akira Nagai ,  Akio Takahashi ,  Shigeo Amagi ,  Toshikazu Narahara ,  Motoyo Wajima ,  Kiyonori Kogawa

发明人： Yoshihiro Suzuki ,  Toshinari Takada ,  Masahiro Suzuki ,  Haruo Akahoshi ,  Akira Nagai ,  Akio Takahashi ,  Shigeo Amagi ,  Toshikazu Narahara ,  Motoyo Wajima ,  Kiyonori Kogawa

IPC分类号： B32B15/01 ,  B32B9/00 ,  B32B15/08 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/384 ,  H05K3/385 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31 ,  Y10T428/31678

摘要： A circuit board, which comprises an insulating substrate, a copper wiring having a coarsely roughened surface provided on the insulating substrate, and a copper oxide-reduced layer provided on the coarsely roughened surface of the copper wiring and formed by reduction of copper oxide and electroless plating, the copper oxide-reduced layer having a finely roughed surface and having a deposited layer of at least one of nickel and cobalt, where the copper oxide-reduced layer having a deposited layer of at least one of nickel and cobalt on the surface is roughened in a range of 0.05 to 5 .mu.m in terms of a maximum vertical distance between the top of convex parts and the bottom of concave parts of the copper oxide-reduced layer per .mu.m of the longitudinal distance of the copper oxide-reduced layer, and at least one of nickel and cobalt is deposited in an amount of 5.times.10.sup.-7 to 1.times.10.sup.-4 g/cm.sup.2 on the copper oxide-reduced layer, has a high adhesiveness to an insulating resin.

摘要翻译： 一种电路板，其包括绝缘基板，设置在绝缘基板上的具有粗糙粗糙面的铜布线和设置在铜布线的粗糙粗糙表面上的氧化铜还原层，其通过还原氧化铜和无电镀形成 所述氧化铜还原层具有细粗糙表面并且具有镍和钴中的至少一种的沉积层，其中在表面上具有至少一种镍和钴的沉积层的氧化铜还原层是 以每50μm的氧化铜还原层的纵向距离的凸部的顶部与氧化铜还原层的凹部的底部的最大垂直距离为0.05〜5μm的范围进行粗糙化 ，并且在氧化铜还原层上以5×10 -7至1×10 -4 g / cm 2的量沉积镍和钴中的至少一种，对绝缘树脂具有高粘附性。

公开(公告)号：US4587162A

公开(公告)日：1986-05-06

申请号：US754449

申请日：1985-07-12

申请人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L29/00 ,  B29C70/06 ,  B29L9/00 ,  B32B27/04 ,  B32B37/00 ,  C08J5/04 ,  C08J5/24 ,  C08L7/00 ,  C08L15/00 ,  C08L21/00 ,  C08L29/04 ,  C08L29/10 ,  C08L33/00 ,  C08L33/02 ,  C08L39/00 ,  C08L39/04 ,  C08L47/00 ,  H05K1/03 ,  B32B27/00 ,  G03C1/68

CPC分类号： H05K1/0346 ,  C08L15/00 ,  C08L39/04 ,  Y10T442/3528 ,  Y10T442/3667

摘要： A resin composition comprising a prepolymer of homopolymer or copolymer of isocyanuric acid derivative or cyanuric acid derivative, and a cyclized polybutadiene can give a laminate for multi-layer printed circuit boards excellent in heat resistance, dimensional stability and high-frequency electrical properties.

摘要翻译： 包含异氰脲酸衍生物或氰尿酸衍生物的均聚物或共聚物的预聚物和环化聚丁二烯的树脂组合物可以得到耐热性，尺寸稳定性和高频电性能优异的多层印刷电路板的层压体。

公开(公告)号：US5768108A

公开(公告)日：1998-06-16

申请号：US720028

申请日：1996-09-27

申请人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

发明人： Osamu Miura ,  Kunio Miyazaki ,  Akio Takahashi ,  Motoyo Wajima ,  Ryuji Watanabe ,  Takao Miwa ,  Yuichi Satsu ,  Shigeo Amagi

IPC分类号： H05K1/05 ,  H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/00 ,  H05K1/09 ,  H05K1/16

CPC分类号： H01L21/4857 ,  H01L23/5385 ,  H05K3/4641 ,  H01L2224/16225 ,  H05K1/113 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623

摘要： A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.

摘要翻译： 在电子计算机，工作站等中使用用于安装电子装置的多层布线结构，特别是具有微细布线层的多层封装板，该板具有优异的尺寸稳定性和 高可靠性，以及制造这种基板的方法。 多层布线结构包括至少两个子组件的复合体，每个子组件具有通过绝缘层分别形成在低热膨胀金属的芯材的相对侧上的布线层，使得布线层对应于区域 相互之间的比例。 子组件通过导体经由通孔彼此连接。 在这种结构中，将具有低热膨胀金属的芯材的布线结构用作基底，因此板的尺寸变化小，并且可以形成微细的布线层，并且子层之间的连接的可靠性 大会组合得到增强。 此外，该板可以低成本生产。

公开(公告)号：US4886858A

公开(公告)日：1989-12-12

申请号：US15325

申请日：1987-02-17

申请人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

发明人： Junichi Katagiri ,  Akira Nagai ,  Keiko Tawara ,  Akio Takahashi ,  Motoyo Wajima ,  Toshikazu Narahara ,  Ryo Hiraga

IPC分类号： C08L25/04 ,  C08F8/00 ,  C08F12/22 ,  C08F290/12 ,  C08F299/00 ,  C08G59/34 ,  C08L63/08 ,  H05K1/03

CPC分类号： C08G59/027 ,  C08F290/124 ,  C08F299/00 ,  C08F8/00 ,  C08L63/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31678 ,  Y10T428/31696 ,  Y10T442/674

摘要： A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.

摘要翻译： 包含特殊聚（对 - 羟基苯乙烯）衍生物树脂和自由基聚合引发剂的热固性树脂组合物，并且如果需要，可以提供环氧改性聚丁二烯，可以提供具有低介电常数，较短的信号延迟时间，良好的耐热性和较短的信号延迟时间的预浸料和层压材料 阻燃性，因此适用于生产多层印刷电路板。

公开(公告)号：US4607094A

公开(公告)日：1986-08-19

申请号：US697530

申请日：1985-02-01

申请人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

发明人： Katuo Sugawara ,  Akio Takahashi ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara ,  Akira Nagai

IPC分类号： C08G73/00 ,  C08G73/06 ,  C08L79/04 ,  C08G69/14

CPC分类号： C08G73/0655

摘要： The thermosetting resin composition of the present invention is prepared by mixing an aromatic cyanamide compound with a cyclic ester compound and/or a cyclic amide compound. Although a solventless type composition is preferable, the present invention is not limited thereto. The cured product of the present invention can be prepared by heating and curing said thermosetting resin composition. The obtained cured product of the present invention usually contains melamine rings, isomelamine rings and linear polyester and/or a linear polyamide units.

摘要翻译： 本发明的热固性树脂组合物通过将芳族氨基氰化合物与环状酯化合物和/或环状酰胺化合物混合来制备。 虽然优选无溶剂型组合物，但本发明不限于此。 本发明的固化物可以通过加热固化所述热固性树脂组合物来制备。 得到的本发明的固化物通常含有三聚氰胺环，异质单胺环和线性聚酯和/或线性聚酰胺单元。

公开(公告)号：US4585841A

公开(公告)日：1986-04-29

申请号：US547585

申请日：1983-11-01

申请人： Shuji Eguchi ,  Noriaki Taketani ,  Hideki Asano ,  Motoyo Wajima

发明人： Shuji Eguchi ,  Noriaki Taketani ,  Hideki Asano ,  Motoyo Wajima

IPC分类号： C08F212/08 ,  C08F220/04 ,  C08F220/06 ,  G02B1/04 ,  C08F30/04 ,  C08F130/04 ,  C08F230/04

CPC分类号： C08F220/04 ,  G02B1/04

摘要： A transparent resin material containing metallic atoms (except for alkali metals) which are ionic-bonded to a vitreous polymeric material constituting the substance of said resin material, in an amount of at least 8% by weight based on the total weight of the resin material, said resin material having a transparency of at least 80% in terms of a light transmittance, and a refractive index n.sub.D.sup.25 of at least 1.55.

摘要翻译： 以构成所述树脂材料的物质的玻璃质聚合物离子键合的金属原子（碱金属除外）的透明树脂材料的含量相对于树脂材料的总重量为8重量％以上 所述树脂材料的透光率为透明度至少为80％，折射率nD25至少为1.55。

公开(公告)号：US5113477A

公开(公告)日：1992-05-12

申请号：US483294

申请日：1990-02-20

申请人： Shuji Eguchi ,  Noriaki Taketani ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Hiromu Terao ,  Hideki Asano ,  Motoyo Wajima ,  Tomiya Abe

发明人： Shuji Eguchi ,  Noriaki Taketani ,  Seikichi Tanno ,  Yoshiaki Okabe ,  Hiromu Terao ,  Hideki Asano ,  Motoyo Wajima ,  Tomiya Abe

IPC分类号： G02B6/00 ,  C08F2/44 ,  C08F20/06 ,  C08F220/04 ,  D01F8/10 ,  G02B6/02

CPC分类号： D01F8/10 ,  G02B6/02033

摘要： A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.

摘要翻译： 一种包含芯和包层的塑料光纤，所述芯由无定形和光学透明的聚合物形成，所述包层由折射率低于芯的折射率至少0.3％的聚合物形成，至少有0.3％ 由包含金属元素和卤素原子的无定形和光学透明聚合物形成的芯和包层的光损耗低，耐热性优异。

公开(公告)号：US4784917A

公开(公告)日：1988-11-15

申请号：US854507

申请日：1986-04-22

申请人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Keiko Tawara ,  Akira Nagai ,  Akio Takahashi ,  Katuo Sugawara ,  Masahiro Ono ,  Ritsuro Tada ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： C08L25/00 ,  C08F290/12 ,  C08F299/00 ,  C08J5/24 ,  C08L7/00 ,  C08L9/00 ,  C08L21/00 ,  C08L25/18 ,  C08L33/00 ,  C08L47/00 ,  H05K1/03 ,  B32B17/10 ,  B32B27/08 ,  B32B27/34

CPC分类号： C08L25/18 ,  C08F290/124 ,  C08F299/00 ,  C08J5/24 ,  C08L9/00 ,  H05K1/0326 ,  Y10T428/31645 ,  Y10T428/31746 ,  Y10T428/3175

摘要： A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

摘要翻译： 一种热固性树脂组合物，其包含作为必要组分（a）预聚物，其包含通式为其中A表示氢或卤素原子的聚（对羟基苯乙烯）衍生物或具有2〜 4个碳原子，m表示1〜4的数，n表示1〜100的数，（b）1,2-聚丁二烯或其衍生物。 通过使用这种新型树脂组合物和常规设备和方法，可以容易地获得能够生产适合用于多层印刷电路板的低介电常数的层压材料的无粘性预浸料，其改善了接合铜箔的剥离强度， 机械强度，阻燃性和耐热性。

公开(公告)号：US4738900A

公开(公告)日：1988-04-19

申请号：US854766

申请日：1986-04-23

申请人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

发明人： Masahiro Ono ,  Akio Takahashi ,  Katuo Sugawara ,  Ritsuro Tada ,  Akira Nagai ,  Motoyo Wajima ,  Toshikazu Narahara

IPC分类号： B32B15/08 ,  B32B15/088 ,  C08G73/00 ,  C08G73/06 ,  C08G73/10 ,  C08G73/12 ,  C08J5/24 ,  H01B3/30 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  C08F283/00

CPC分类号： H05K1/0346 ,  C08G73/12 ,  H01B3/303 ,  H01L23/145 ,  H05K1/0313 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T428/31721

摘要： Cured resin obtained by polymerization by heating of a thermo-setting, polymerizable composition comprising at least two kinds of polymerizable compounds whose exothermic polymerization temperature ranges at polymerization by heating substantially coincide with each other, for example, an aromatic maleimide compound and an aromatic cyanamide compound, the composition showing a substantially one exothermic polymerization peak at the polymerization by heating, has a good heat resistance, and a laminated, high density wiring board with a good heat resistance, capable of being directly loaded with LSI chips and chip carriers can be obtained, using the composition.

摘要翻译： 通过加热热固性聚合性组合物而得到的固化树脂，所述组合物包含通过加热聚合的放热聚合温度范围内的至少两种聚合性化合物基本上彼此重合，例如芳香族马来酰亚胺化合物和芳香族氨基氰化合物 ，通过加热聚合显示基本上一个放热聚合峰的组成具有良好的耐热性，并且可以获得能够直接装载LSI芯片和芯片载体的具有良好耐热性的层叠高密度布线板 ，使用组合。