公开(公告)号：US20150226810A1

公开(公告)日：2015-08-13

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: G01R31/36 ,  H01M10/42 ,  H01M10/48

CPC classification number: G01R31/3658 ,  H01M10/0525 ,  H01M10/4257 ,  H01M10/48 ,  H01M10/486 ,  H01M2010/4271 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

Abstract translation: 根据实施例的传感器装置包括基板，以及安装在基板上的至少一个传感器和控制电路，其中至少一个传感器和控制电路位于基板上，以可安装在电池单元内部， 电池单元。

公开(公告)号：US08759207B2

公开(公告)日：2014-06-24

申请号：US13671583

申请日：2012-11-08

Applicant: Infineon Technologies AG

Inventor： Hans-Joachim Barth ,  Mathias Vaupel ,  Rainer Steiner ,  Werner Robl ,  Jens Pohl ,  Joem Plagmann ,  Gottfried Beer

IPC: H01L21/20

CPC classification number: H01L21/76843 ,  H01L21/76807 ,  H01L21/76879 ,  H01L23/49816 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L24/03 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00

Abstract: One or more embodiments relate to a method of forming a semiconductor structure, comprising: providing a workpiece; forming a barrier layer over the workpiece; forming a seed layer over the barrier layer; forming an inhibitor layer over the seed layer; removing a portion of said inhibitor layer to expose a portion of the seed layer; and selectively depositing a fill layer on the exposed seed layer.

Abstract translation: 一个或多个实施例涉及一种形成半导体结构的方法，包括：提供工件; 在工件上形成阻挡层; 在阻挡层上形成种子层; 在种子层上形成抑制层; 去除所述抑制剂层的一部分以暴露所述种子层的一部分; 并且在曝光的种子层上选择性地沉积填充层。

公开(公告)号：US10519030B2

公开(公告)日：2019-12-31

申请号：US15478946

申请日：2017-04-04

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Franz Gabler ,  Thomas Mueller ,  Horst Theuss ,  Mathias Vaupel

IPC: B81B7/00 ,  B81C1/00

Abstract: A package which comprises a carrier, a transducer mounted on the carrier and configured for converting between a package-external property and an electric signal, a package housing at least partially housing at least one of the carrier and the transducer, and a sealing which forms at least part of the package housing for sealing between the package and a package-external body.

公开(公告)号：US09448130B2

公开(公告)日：2016-09-20

申请号：US14016046

申请日：2013-08-31

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Horst Theuss ,  Thomas Lehmann

IPC: G01L9/16 ,  G01M1/12 ,  H01L23/00 ,  G01L19/00 ,  G01L19/14

CPC classification number: G01M1/122 ,  G01L19/0084 ,  G01L19/0092 ,  G01L19/141 ,  G01L19/143 ,  H01L23/00 ,  H01L23/3185 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/1815 ,  Y10T29/49117 ,  H01L2924/00014

Abstract: A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising: a carrier; an active sensor component arranged at the carrier and configured for providing a sensor signal being indicative of the environmental property; a molding structure encapsulating at least a part of an exterior surface of the carrier and comprising an access recess exposing the active sensor component with regard to the environment; wherein the access recess is arranged asymmetrically with regard to the carrier.

公开(公告)号：US20150090042A1

公开(公告)日：2015-04-02

申请号：US14039706

申请日：2013-09-27

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L9/00 ,  B81C1/00 ,  B81B7/00

CPC classification number: G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

公开(公告)号：US08937380B1

公开(公告)日：2015-01-20

申请号：US14015522

申请日：2013-08-30

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Uwe Fritzsche Schindler

IPC: H01L23/02 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0054 ,  B81B2201/0264 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83951 ,  H01L2924/1815 ,  H01L2924/00014

Abstract: A semiconductor package includes a lead spaced apart from a semiconductor die. The die includes a diaphragm disposed at a first side of the die and is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The die further includes a second side opposite the first side, a lateral edge extending between the first and second sides and a terminal at the first side. An electrical conductor connects the terminal to the lead. An encapsulant is disposed along the lateral edge of the die so that the terminal and the electrical conductor are spaced apart from the encapsulant. The encapsulant has an elastic modulus of less 10 MPa at room temperature. A molding compound covers and contacts the lead, the electrical conductor, the encapsulant, the terminal and part of the first side of the die so that the diaphragm is uncovered by the molding compound.

Abstract translation: 半导体封装包括与半导体管芯间隔开的引线。 管芯包括设置在管芯的第一侧处的隔膜，并且被配置为响应于横跨隔膜的压差而改变电参数。 模具还包括与第一侧相对的第二侧，在第一侧和第二侧之间延伸的横向边缘和在第一侧的端子。 电导体将端子连接到引线。 沿着模具的侧边缘设置密封剂，使得端子和电导体与密封剂间隔开。 密封剂在室温下的弹性模量小于10MPa。 模塑料覆盖并接触导线，电导体，密封剂，端子和模具的第一面的一部分，使得隔膜不被模塑料覆盖。

公开(公告)号：US20140319627A1

公开(公告)日：2014-10-30

申请号：US13872214

申请日：2013-04-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Bernhard Winkler ,  Horst Theuss ,  Mathias Vaupel

IPC: B81B7/00

CPC classification number: B81B7/0061 ,  B81B2201/0264 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip.

Abstract translation: 在各种实施例中，提供了芯片封装。 芯片封装可以包括具有多个压力传感器区域和封装芯片的封装材料的至少一个芯片。

公开(公告)号：US08786085B2

公开(公告)日：2014-07-22

申请号：US13671573

申请日：2012-11-08

Applicant: Infineon Technologies AG

Inventor： Hans-Joachim Barth ,  Mathias Vaupel ,  Rainer Steiner ,  Werner Robl ,  Jens Pohl ,  Joern Plagmann ,  Gottfried Beer

IPC: H01L23/48

CPC classification number: H01L21/76843 ,  H01L21/76807 ,  H01L21/76879 ,  H01L23/49816 ,  H01L23/53223 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266 ,  H01L24/03 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00

Abstract: One or more embodiments relate to a semiconductor structure, comprising: a barrier layer overlying a workpiece surface; a seed layer overlying the barrier layer; an inhibitor layer overlying said seed layer, the inhibitor layer having a opening exposing a portion of the seed layer, and a fill layer overlying the exposed portion of the seed layer.

Abstract translation: 一个或多个实施例涉及半导体结构，包括：覆盖工件表面的阻挡层; 覆盖阻挡层的种子层; 覆盖所述种子层的抑制剂层，所述抑制剂层具有暴露所述种子层的一部分的开口以及覆盖所述种子层的暴露部分的填充层。

公开(公告)号：US20140167272A1

公开(公告)日：2014-06-19

申请号：US13716004

申请日：2012-12-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Stefan Martens ,  Berthold Schuderer ,  Mathias Vaupel ,  Raimund Peichl

IPC: H01L23/544 ,  H01L21/48

CPC classification number: H01L23/544 ,  H01L23/3171 ,  H01L2223/54406 ,  H01L2223/54413 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip.

Abstract translation: 半导体器件包括芯片，布置在芯片的前侧上的接触焊盘和布置在接触焊盘上的识别标记。 识别标记包括关于芯片的属性的信息。