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公开(公告)号：US09282650B2
公开(公告)日：2016-03-08
申请号：US14132883
申请日：2013-12-18
Applicant: Intel Corporation
Inventor： Hemanth Dhavaleswarapu , Zhihua Li , Joseph Petrini , Steven B. Roach , Shankar Devasenathipathy , George Kostiew , Amram Eitan
CPC classification number: H01L24/81 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K3/085 , B23K20/002 , B23K20/023 , B23K20/026 , B23K20/26 , B23K35/0244 , B23K37/003 , B23K2101/42 , B33Y80/00 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75502 , H01L2224/7555 , H01L2224/81097 , H01L2224/81098 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81948 , H05K3/3436 , H05K3/3494 , H05K2203/04 , H05K2203/1121 , H01L2924/014 , H01L2924/00012
Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.
Abstract translation: 公开了热压接（TCB）工艺冷却歧管，TCB工艺系统和使用冷却歧管的TCB方法的实施例。 在一些实施例中，冷却歧管包括通过挡板与混合室分离的预混合室。 挡板可以包括通过挡板形成的至少一个同心图案，使得预混合室中的主要冷却流体基本均匀地分布到混合室。 预混合室可以连接到主冷却流体源。 混合室可以具有被配置为接受主冷却流体的输入和输出以输出主冷却流体的输入。
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公开(公告)号：US11923268B2
公开(公告)日：2024-03-05
申请号：US16781475
申请日：2020-02-04
Applicant: INTEL CORPORATION
Inventor： Jesus Gerardo Reyes Schuldes , Shankar Devasenathipathy , Pramod Malatkar , Aravindha Antoniswamy , Kyle Arrington
IPC: H01L23/367 , H01L21/48 , H01L23/00 , H01L23/373 , H05K1/02
CPC classification number: H01L23/3675 , H01L21/4814 , H01L23/373 , H01L24/16 , H01L24/73 , H05K1/0204 , H01L2224/16 , H01L2224/73253 , H01L2924/1532
Abstract: Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.
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公开(公告)号：US11901262B2
公开(公告)日：2024-02-13
申请号：US16256831
申请日：2019-01-24
Applicant: Intel Corporation
Inventor： Nicholas Neal , Zhimin Wan , Shankar Devasenathipathy , Je-Young Chang
IPC: H01L23/433 , F28F19/01 , H01L21/48
CPC classification number: H01L23/4336 , F28F19/01 , H01L21/4882
Abstract: Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.
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公开(公告)号：US11456232B2
公开(公告)日：2022-09-27
申请号：US16100406
申请日：2018-08-10
Applicant: Intel Corporation
Inventor： Zhimin Wan , Je-Young Chang , Chia-Pin Chiu , Shankar Devasenathipathy , Betsegaw Kebede Gebrehiwot , Chandra Mohan Jha
IPC: H01L23/427 , H01L25/18
Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.
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Patent Agency Ranking
公开(公告)号：US20210242105A1
公开(公告)日：2021-08-05
申请号：US16781475
申请日：2020-02-04
Applicant: INTEL CORPORATION
Inventor： Jesus Gerardo Reyes Schuldes , Shankar Devasenathipathy , Pramod Malatkar , Aravindha Antoniswamy , Kyle Arrington
IPC: H01L23/367 , H01L23/373 , H01L21/48 , H01L23/00 , H05K1/02
Abstract: Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.
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公开(公告)号：US20200243418A1
公开(公告)日：2020-07-30
申请号：US16256831
申请日：2019-01-24
Applicant: Intel Corporation
Inventor： Nicholas Neal , Zhimin Wan , Shankar Devasenathipathy , Je-Young Chang
IPC: H01L23/433 , H01L21/48 , F28F19/01
Abstract: Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.
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公开(公告)号：US20180141173A1
公开(公告)日：2018-05-24
申请号：US15358016
申请日：2016-11-21
Applicant: Intel Corporation
Inventor： Betsegaw K. Gebrehiwot , Joseph B. Petrini , Nicholas S. Haehn , Shankar Devasenathipathy , Robert L. Sankman , Alfredo G. Cardona
Abstract: Embodiments herein relate to torque controlled drivers to simultaneously drive fasteners to secure a thermal transfer device to an integrated circuit package. In various embodiments, a torque controlled driver may include a gearbox, a driver with a torque controller and a motor with a rotating shank, a motor gear coupled concentrically with the rotating shank, a bit drive gear in rotational engagement with the motor gear to drive a bit sized to drive a fastener to secure a thermal transfer device to an integrated circuit package, where the gearbox is to hold the motor gear in a position about a motor gear rotational axis and the drive gear about a drive gear rotational axis such that the motor gear and the bit drive gear maintain rotational engagement as the motor gear rotates. Other embodiments may be described and/or claimed.
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公开(公告)号：US09748199B2
公开(公告)日：2017-08-29
申请号：US15062298
申请日：2016-03-07
Applicant: Intel Corporation
Inventor： Hemanth Dhavaleswarapu , Zhihua Li , Joseph Petrini , Steven B. Roach , Shankar Devasenathipathy , George Kostiew , Amram Eitan
IPC: B23K31/02 , H01L23/00 , H05K3/34 , B23K1/00 , B23K3/04 , B23K37/00 , B23K3/08 , B23K20/02 , B23K20/00 , B23K20/26 , B23K35/02 , B23K101/42 , B33Y80/00
CPC classification number: H01L24/81 , B23K1/0016 , B23K3/04 , B23K3/08 , B23K3/085 , B23K20/002 , B23K20/023 , B23K20/026 , B23K20/26 , B23K35/0244 , B23K37/003 , B23K2101/42 , B33Y80/00 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/75102 , H01L2224/75252 , H01L2224/75266 , H01L2224/75301 , H01L2224/75502 , H01L2224/7555 , H01L2224/81097 , H01L2224/81098 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/81948 , H05K3/3436 , H05K3/3494 , H05K2203/04 , H05K2203/1121 , H01L2924/014 , H01L2924/00012
Abstract: Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.
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29.发明申请公开(公告)号：US20170014957A1
公开(公告)日：2017-01-19
申请号：US15221102
申请日：2016-07-27
Applicant: Intel Corporation
Inventor： Zhihua Li , Hemanth K. Dhavaleswarapu , Joseph B. Petrini , Shankar Devasenathipathy , Steven B. Roach , Ioan Sauciuc , Pranav K. Desai , George S. Kostiew , Sanjoy K. Saha
CPC classification number: B23K37/003 , B23K3/085 , B23K20/023 , F25B21/02 , F25B2321/0251 , H01L24/13 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/291 , H01L2224/75252 , H01L2224/75301 , H01L2224/75502 , H01L2224/81203 , H01L2224/83203 , H05K3/34 , H01L2924/014
Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
Abstract translation: 描述了热压接瞬态冷却方案的各种实施例。 这些实施例包括耦合到加热器表面的垂直分离的微通道的阵列，其中每个出口微通道包括两个相邻的入口微通道，并且其中入口和出口歧管联接到微通道阵列，并且其中加热器表面 并且微通道在同一块内耦合。
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