公开(公告)号：US20110147914A1

公开(公告)日：2011-06-23

申请号：US13020152

申请日：2011-02-03

申请人： Carl L. Deppisch ,  Rajasekaran Swaminathan

发明人： Carl L. Deppisch ,  Rajasekaran Swaminathan

IPC分类号： H01L23/488 ,  B23K35/14 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K35/02 ,  B23K35/0233 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/40 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T428/12222

摘要： A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.

摘要翻译： 描述了包覆焊料热界面材料。 在一个示例中，该材料具有熔融温度低于特定焊料回流炉的温度的第一层焊料，第二层焊料包覆到第一层焊料层，第二层的熔化温度高于温度 的焊料回流炉，以及与第一层相对的第二层焊料的第三层焊料，第三层的熔融温度低于焊料回流炉的温度。

公开(公告)号：US07036573B2

公开(公告)日：2006-05-02

申请号：US10071471

申请日：2002-02-08

申请人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

发明人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

IPC分类号： F28F7/00 ,  C08K9/10

CPC分类号： F28F13/00 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/905 ,  H01L2924/00

摘要： A thermal interface material made of a binder material and a fusible filler.

摘要翻译： 由粘合剂材料和易熔填料制成的热界面材料。

公开(公告)号：US20180005917A1

公开(公告)日：2018-01-04

申请号：US15197440

申请日：2016-06-29

申请人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

发明人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

IPC分类号： H01L23/373 ,  F28F21/08 ,  F28F21/02 ,  F28F21/04 ,  F28D15/02 ,  H01L23/498 ,  F28F13/00 ,  F28D21/00

CPC分类号： H01L23/3736 ,  F28D2021/0029 ,  F28F13/003 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  F28F2013/001 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/49811 ,  H01L24/00 ,  H01L2224/73204 ,  H01L2224/73253

摘要： Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

公开(公告)号：US20140319682A1

公开(公告)日：2014-10-30

申请号：US14328599

申请日：2014-07-10

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/00 ,  B23K35/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

公开(公告)号：US20140124925A1

公开(公告)日：2014-05-08

申请号：US13670687

申请日：2012-11-07

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/498 ,  B23K1/20 ,  B23K35/14 ,  B23K31/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。

公开(公告)号：US08550327B2

公开(公告)日：2013-10-08

申请号：US13020152

申请日：2011-02-03

申请人： Carl L. Deppisch ,  Rajasekaran Swaminathan

发明人： Carl L. Deppisch ,  Rajasekaran Swaminathan

IPC分类号： B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K35/02 ,  B23K35/0233 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/40 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T428/12222

摘要： A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.

摘要翻译： 描述了包覆焊料热界面材料。 在一个示例中，该材料具有熔融温度低于特定焊料回流炉的温度的第一层焊料，第二层焊料包覆在第一层焊料上，第二层的熔化温度高于温度 的焊料回流炉，以及与第一层相对的第二层焊料的第三层焊料，第三层的熔融温度低于焊料回流炉的温度。

公开(公告)号：US20110159310A1

公开(公告)日：2011-06-30

申请号：US12655407

申请日：2009-12-30

申请人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

发明人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

IPC分类号： B32B15/04 ,  B23K31/02 ,  B32B38/00

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K3/085 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T428/12222

摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

摘要翻译： 形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

公开(公告)号：US20150255415A1

公开(公告)日：2015-09-10

申请号：US14198479

申请日：2014-03-05

申请人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

发明人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

摘要翻译： 描述了一种包括设置在基板上的基板和模具化合物的装置。 半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。 焊球围绕半导体管芯设置在基板上。 每个焊球上都有一个固体涂层。 固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。 在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。 在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。 在组合或替代实施例中，焊料球与模具化合物之间存在微通道。

公开(公告)号：US07436058B2

公开(公告)日：2008-10-14

申请号：US10141735

申请日：2002-05-09

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

摘要翻译： 反应性焊料。 反应性焊料材料可以焊接到半导体表面，例如晶片或晶片的背面。 反应性焊料材料包括与活性元素材料合金化的基底焊料。 反应性焊料材料也可以应用于热管理装置的一部分。 反应性焊料材料可用作半导体表面和热管理装置之间的导热界面。