公开(公告)号：US20140319682A1

公开(公告)日：2014-10-30

申请号：US14328599

申请日：2014-07-10

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/00 ,  B23K35/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

公开(公告)号：US20140124925A1

公开(公告)日：2014-05-08

申请号：US13670687

申请日：2012-11-07

申请人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Wei Hu ,  Carl L. Deppisch ,  Martha A. Dudek

IPC分类号： H01L23/498 ,  B23K1/20 ,  B23K35/14 ,  B23K31/02

CPC分类号： H01L24/14 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed towards multi-solder techniques and configurations for integrated circuit (IC) package assembly. In one embodiment, a method includes depositing a plurality of solder balls on a plurality of pads of a package substrate, the plurality of solder balls corresponding with the plurality of pads and performing a solder reflow process to form a solder joint between the plurality of solder balls and the plurality of pads. Individual solder balls of the plurality of solder balls include a first solder material and a second solder material, the first solder material having a liquidus temperature that is greater than a peak temperature of the solder reflow process and the second solder material having a liquidus temperature that is less than the peak temperature of the solder reflow process. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装组件的多焊接技术和配置。 在一个实施例中，一种方法包括在封装衬底的多个焊盘上沉积多个焊球，所述多个焊球对应于所述多个焊盘并且执行焊料回流工艺以在所述多个焊料之间形成焊接点 球和多个垫。 多个焊球的单个焊球包括第一焊料材料和第二焊料材料，第一焊料材料具有大于焊料回流工艺的峰值温度的液相线温度，第二焊料材料具有液相线温度， 小于焊料回流工艺的峰值温度。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20180005917A1

公开(公告)日：2018-01-04

申请号：US15197440

申请日：2016-06-29

申请人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

发明人： Zhizhong Tang ,  Syadwad Jain ,  Wei Hu ,  Michael A. Schroeder ,  Rajen S. Sidhu ,  Carl L. Deppisch ,  Patrick Nardi ,  Kelly P. Lofgreen

IPC分类号： H01L23/373 ,  F28F21/08 ,  F28F21/02 ,  F28F21/04 ,  F28D15/02 ,  H01L23/498 ,  F28F13/00 ,  F28D21/00

CPC分类号： H01L23/3736 ,  F28D2021/0029 ,  F28F13/003 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  F28F2013/001 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/49811 ,  H01L24/00 ,  H01L2224/73204 ,  H01L2224/73253

摘要： Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

公开(公告)号：US20140291843A1

公开(公告)日：2014-10-02

申请号：US13853982

申请日：2013-03-29

申请人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

发明人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附着到微电子衬底以形成混合焊料 互连。

公开(公告)号：US20140225265A1

公开(公告)日：2014-08-14

申请号：US13976192

申请日：2012-03-29

申请人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Ashay A. Dadi ,  Martha A. Dudek

IPC分类号： H01L23/532 ,  H01L21/768

CPC分类号： H01L23/53209 ,  H01L21/76882 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/00

摘要： Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

摘要翻译： 互连封装技术，用于直接芯片连接，封装封装或一级和二级互连叠层，相对于球技术，Z高度降低。 在实施例中，单层或多层互连结构以允许例如基于功能来定制封装内的特定互连的电气和机械特性之一或两者的方式被沉积。 功能性封装互连可以改变至少材料层组成，层厚度，层数或多个材料中的一个以实现特定功能，例如基于互连部件的应用或应用 整个集会。 在实施例中，多层叠层结构的参数取决于衬底区域内的互连位置，例如具有较高应力的互连位置处具有较高延展性的结构。

公开(公告)号：US20140175160A1

公开(公告)日：2014-06-26

申请号：US13725279

申请日：2012-12-21

申请人： Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Martha A. Dudek

IPC分类号： B23K1/20 ,  B23K35/24 ,  B23K35/362

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/26 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42

摘要： A composition including a solder flux including a rosin material have a property to maintain a less than 10 percent drop in tackiness from an initial tackiness value of 20 gf to 120 gf over a temperature regime of 20° C. to 200° C. A composition including a solder powder; and a solder flux including a rosin material including a softening temperature of 150° C. to 200° C. and a molecular weight of 300 g/mol to 600 g/mol. A method including introducing a solder paste to one or more contact pads of a substrate, the solder paste including a solder powder and a solder flux including a rosin material including a softening temperature of 150° C. to 190° C. and a molecular weight of 300 g/mol to 600 g/mol; contacting the solder paste with a solder ball of a package substrate; and heating the solder paste.

摘要翻译： 包含包含松香材料的焊剂的组合物具有在20℃至200℃的温度范围内保持从20gf的初始粘性值至少低于10％的粘性降低的性质。组合物 包括焊粉; 以及包含软化温度为150℃〜200℃，分子量为300g / mol〜600g / mol的松香材料的焊剂。 一种方法，包括将焊膏引入到衬底的一个或多个接触焊盘中，所述焊膏包括焊料粉末和包含松香材料的助焊剂，所述助焊剂包括150℃至190℃的软化温度和分子量 为300g / mol至600g / mol; 使焊膏与封装衬底的焊球接触; 并加热焊膏。

公开(公告)号：US09024453B2

公开(公告)日：2015-05-05

申请号：US13976192

申请日：2012-03-29

申请人： Rajen S. Sidhu ,  Ashay A. Dani ,  Martha A. Dudek

发明人： Rajen S. Sidhu ,  Ashay A. Dani ,  Martha A. Dudek

IPC分类号： H01L23/48 ,  H01L23/532 ,  H01L23/00 ,  H01L21/768

CPC分类号： H01L23/53209 ,  H01L21/76882 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11005 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11901 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16507 ,  H01L2224/81191 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/00

摘要： Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

摘要翻译： 互连封装技术，用于直接芯片连接，封装封装或一级和二级互连叠层，相对于球技术，Z高度降低。 在实施例中，单层或多层互连结构以允许例如基于功能来定制封装内的特定互连的电气和机械特性之一或两者的方式被沉积。 功能性封装互连可以改变至少材料层组成，层厚度，层数或多个材料中的一个以实现特定功能，例如基于互连部件的应用或应用 整个集会。 在实施例中，多层叠层结构的参数取决于衬底区域内的互连位置，例如具有较高应力的互连位置处具有较高延展性的结构。

公开(公告)号：US08920934B2

公开(公告)日：2014-12-30

申请号：US13853982

申请日：2013-03-29

申请人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

发明人： Hongjin Jiang ,  Arun Kumar C. Nallani ,  Rajen S. Sidhu ,  Martha A. Dudek ,  Weihua Tang

IPC分类号： B32B5/18 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/1056 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/047 ,  Y10S428/929 ,  Y10T428/12181 ,  Y10T428/12479 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/81805

摘要： Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.

摘要翻译： 描述了用于焊球和填充糊的混合焊料。 焊球可以由较高温度焊料液滴和低温焊料涂层形成。 这可以与具有粘合剂和低温焊料颗粒的填料的焊膏一起使用，填料包含少于膏体的80重量％。 焊球和糊剂可用于微电子器件的焊接封装。 可以通过将焊膏施加到基板的接合焊盘来形成封装，使用该膏将混合焊球附着到每个焊盘，以及通过回流混合焊球来将封装衬底附接到微电子衬底以形成混合焊料 互连。

公开(公告)号：US09613933B2

公开(公告)日：2017-04-04

申请号：US14198479

申请日：2014-03-05

申请人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

发明人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC分类号： H01L23/12 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

公开(公告)号：US09950393B2

公开(公告)日：2018-04-24

申请号：US13976001

申请日：2011-12-23

申请人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

发明人： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

IPC分类号： B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  H05K3/34 ,  H01L23/488 ,  H01L23/498 ,  H01L21/48

CPC分类号： B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

摘要： Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.