公开(公告)号：US07863189B2

公开(公告)日：2011-01-04

申请号：US11620423

申请日：2007-01-05

申请人： Veeraraghaven S. Basker ,  John Michael Cotte ,  Hariklia Deligianni ,  John Ulrich Knickerbocker ,  Keith T. Kwietniak

发明人： Veeraraghaven S. Basker ,  John Michael Cotte ,  Hariklia Deligianni ,  John Ulrich Knickerbocker ,  Keith T. Kwietniak

IPC分类号： H01L21/44

CPC分类号： H01L23/433 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/481 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

摘要： Methods are provided for fabricating silicon carriers with conductive through-vias that allow high-yield manufacture of silicon carrier with low defect density. In particular, methods are provided which enable fabrication of silicon carries with via diameters such as 1 to 10 microns in diameter for a vertical thickness of less than 10 micrometers to greater than 300 micrometers, which are capable robust to thermal-mechanical stresses during production to significantly minimize the thermal mechanical movement at the via sidewall interface between the silicon, insulator, liner and conductor materials.

摘要翻译： 提供了用于制造具有导电通孔的硅载体的方法，其允许高产量制造具有低缺陷密度的硅载体。 特别地，提供了这样的方法，其能够制造具有通孔直径的硅载体，其直径为小于10微米至大于300微米的垂直厚度，其垂直厚度小于10微米至大于300微米，这对于在生产期间的热机械应力是坚固的 显着地最小化硅，绝缘体，衬里和导体材料之间的通孔侧壁界面处的热机械运动。

公开(公告)号：US06834671B2

公开(公告)日：2004-12-28

申请号：US10743155

申请日：2003-12-22

申请人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft ,  Richard P. Volant

发明人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft ,  Richard P. Volant

IPC分类号： F16K1502

CPC分类号： F16K99/0001 ,  F15C5/00 ,  F16K15/023 ,  F16K99/0005 ,  F16K99/0007 ,  F16K99/0057 ,  F16K2099/0094 ,  Y10T137/7783 ,  Y10T137/7849 ,  Y10T137/7904

摘要： A check valve for micro electro mechanical structure devices (MEMS), and in particular pertains to a check valve which is adapted to be employed in connection with micro electro mechanical structure devices which are intended to be employed with supercritical fluids constituting working fluids. In a preferred embodiment, the check valve is equipped with a bypass channel including a freely moveable plug structure which, in the open position of the valve enables the ingress of supercritical fluids under high superatmospheric pressures, and subsequent to the filling of the system, let down to atmospheric pressure, causes the plug to be moved into a permanent valve-closed position.

摘要翻译： 一种用于微机电结构装置（MEMS）的止回阀，并且特别涉及一种适于与旨在与构成工作流体的超临界流体一起使用的微机电结构装置结合使用的止回阀。 在优选实施例中，止回阀配备有包括可自由移动的塞子结构的旁通通道，其在阀的打开位置使得能够在高超大气压下进入超临界流体，并且在系统的填充之后，让 降至大气压力，使插头移动到永久性阀关闭位置。

公开(公告)号：US06451375B1

公开(公告)日：2002-09-17

申请号：US09755266

申请日：2001-01-05

申请人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

发明人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

IPC分类号： B05D512

CPC分类号： B05D1/18 ,  B05D2401/90 ,  C23C18/00

摘要： A process of depositing a thin film on a nanometer structure in which a coating, which may be an aerogel material or metallic seed layer, is prepared. The coating is combined with a supercritical composition to form a supercritical coating composition. The supercritical coating composition is deposited upon a nanometer structure under supercritical conditions. Supercritical conditions are removed whereby the supercritical composition is removed and the coating solidifies into a thin solid film.

摘要翻译： 在纳米结构上沉积薄膜的方法，其中制备可以是气凝胶材料或金属种子层的涂层。 将涂层与超临界组合物组合以形成超临界涂料组合物。 超临界涂料组合物在超临界条件下沉积在纳米结构上。 去除超临界条件，由此除去超临界组合物，并将涂层固化成薄的固体膜。

公开(公告)号：US06258703B1

公开(公告)日：2001-07-10

申请号：US09359061

申请日：1999-07-21

申请人： John Michael Cotte ,  Madhav Datta ,  Sung Kwon Kang

发明人： John Michael Cotte ,  Madhav Datta ,  Sung Kwon Kang

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/13116 ,  H01L2224/1357 ,  H01L2224/13616 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3452 ,  H05K2201/2081 ,  H05K2203/159 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/0105 ,  H01L2224/13099 ,  H01L2224/29099

摘要： An array of C4 solder bumps and a method for making is described incorporating an array of conductive areas on an electrical device, each conductive area having a layer of ball limited metalurgy at the device surface and two layers of solder having respective melting temperatures to form the C4 structure. The method includes melting the second layer of solder in the down position or towards earth to form a C4 solder ball or bump. The invention overcomes the problem of low temperature solder from wicking over the sidewall surfaces of the high melt solder of the C4 structure and attacking the edges of the underlying seed layers of the ball limited metalurgy.

摘要翻译： 描述了C4焊料凸块的阵列和制造方法，其中在电气装置上结合有导电区域的阵列，每个导电区域在器件表面具有一层球限定的金属，并且具有相应的熔化温度的两层焊料形成 C4结构。 该方法包括将第二层焊料熔化在向下的位置或者朝向地球，以形成C4焊球或凸块。 本发明克服了在C4结构的高熔点焊料的侧壁表面上芯吸的低温焊料的问题，并攻击了有限的金属冶金的下层种子层的边缘。

公开(公告)号：US20080277769A1

公开(公告)日：2008-11-13

申请号：US11690682

申请日：2007-05-08

申请人： John Michael Cotte ,  Hanyi Ding ,  Kai Di Feng ,  Zhong-Xiang He ,  Nils D. Hoivik ,  Xuefeng Liu

发明人： John Michael Cotte ,  Hanyi Ding ,  Kai Di Feng ,  Zhong-Xiang He ,  Nils D. Hoivik ,  Xuefeng Liu

IPC分类号： H01L23/02 ,  H01L21/58

CPC分类号： H01L23/04 ,  H01L23/5227 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01042

摘要： An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic material may be affixed to the package cover by an adhesive. The magnetic material may be formed directly on the package cover by one of deposition, sputtering or spraying. The magnetic material may be affixed to the integrated circuit.

摘要翻译： 集成电路封装包括具有一个或多个片上电感器的集成电路。 封装盖覆盖集成电路。 在集成电路和封装盖之间提供磁性材料。 磁性材料可以是软磁性薄膜。 磁性材料可以通过粘合剂固定到包装盖上。 磁性材料可以通过沉积，溅射或喷涂之一直接形成在封装盖上。 磁性材料可以固定在集成电路上。

公开(公告)号：US07332436B2

公开(公告)日：2008-02-19

申请号：US10966301

申请日：2004-10-15

申请人： John Michael Cotte ,  Dario L. Goldfarb ,  Pamela Jones ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

发明人： John Michael Cotte ,  Dario L. Goldfarb ,  Pamela Jones ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

IPC分类号： H01L21/302 ,  C09K13/00

CPC分类号： H01L21/02071 ,  B08B7/0021 ,  C11D7/08 ,  C11D7/265 ,  C11D7/28 ,  C11D7/50 ,  C11D11/0047 ,  H01L21/31116

摘要： A composition which includes liquid or supercritical carbon dioxide and an acid having a pKa of less than about 4. The composition is employed in a process of removing residue from a precision surface, such as a semiconductor sample, in which the precision surface is contacted with the composition under thermodynamic conditions consistent with the retention of the liquid or supercritical carbon dioxide in the liquid or supercritical state.

摘要翻译： 包括液体或超临界二氧化碳和pKa小于约4的酸的组合物。该组合物用于从精密表面与精密表面接触的精密表面（例如半导体样品）中除去残余物的方法 在热力学条件下的组成与液体或超临界二氧化碳在液体或超临界状态下的保留一致。

公开(公告)号：US06890855B2

公开(公告)日：2005-05-10

申请号：US09893207

申请日：2001-06-27

申请人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

发明人： John Michael Cotte ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  Keith R. Pope ,  John P. Simons ,  Charles J. Taft

IPC分类号： H01L21/02 ,  H01L21/302

CPC分类号： H01L21/02101 ,  H01L21/02057

摘要： A process of removing residue from an etched precision surface. In this process the etched precision surface is contacted with a composition which includes liquid or supercritical carbon dioxide and a fluoride-generating species.

摘要翻译： 从蚀刻精密表面除去残留物的方法。 在该过程中，蚀刻的精密表面与包括液体或超临界二氧化碳和产生氟化物质的组合物接触。

公开(公告)号：US06579464B2

公开(公告)日：2003-06-17

申请号：US09903880

申请日：2001-07-12

申请人： John Michael Cotte ,  Matteo Flotta ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

发明人： John Michael Cotte ,  Matteo Flotta ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft

IPC分类号： B44C122

CPC分类号： B08B7/0021

摘要： Fixtures and methods for clamping workpieces in a workplace to enable the optimized exposure thereof to a stream or flow of a supercritical fluid. Provided is a rotatably indexable chuck or locator mounting the workpiece and enabling orientating the latter in specific static pitch position within a high pressure vessel in order to subject the workpiece to a full frontal exposure to the supercritical fluid stream within the vessel. This mounting arrangement facilitates an optimum positioning of the workpiece being processed in the flow path of the supercritical fluid stream while oriented in selectively indexed rotational positions.

摘要翻译： 用于在工作场所夹紧工件以使其优化地暴露于超临界流体的流或流的夹具和方法。 提供了一种安装工件的可转动的可转位的卡盘或定位器，并且能够将其定位在高压容器内的特定静态俯仰位置，以便使工件对容器内的超临界流体流进行完全正面暴露。 这种安装布置有助于正在处理的工件在超临界流体流的流动路径中的最佳定位，同时定向成选择性分度的旋转位置。

公开(公告)号：US06425956B1

公开(公告)日：2002-07-30

申请号：US09755267

申请日：2001-01-05

申请人： John Michael Cotte ,  Donald J. Delehanty ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft ,  Richard P. Volant

发明人： John Michael Cotte ,  Donald J. Delehanty ,  Kenneth John McCullough ,  Wayne Martin Moreau ,  John P. Simons ,  Charles J. Taft ,  Richard P. Volant

IPC分类号： C23G102

CPC分类号： H01L21/02074 ,  B08B7/0021 ,  C11D1/004 ,  C11D3/2075 ,  C11D3/43 ,  C23G5/00 ,  H01L21/02065 ,  Y10S134/902

摘要： A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical fluid including supercritical, carbon dioxide and a co-solvent, and a surfactant.

摘要翻译： 一种从工件与超临界流体组合物，所述超临界流体包括超临界流体，二氧化碳和助溶剂以及表面活性剂接触的工件的化学机械抛光产生的剩余浆料的清除方法。

公开(公告)号：US06281105B1

公开(公告)日：2001-08-28

申请号：US09382401

申请日：1999-08-24

申请人： John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

发明人： John Michael Cotte ,  Judith Marie Roldan ,  Carlos Juan Sambucetti ,  Ravi F. Saraf

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/83 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13311 ,  H01L2224/13411 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/81011 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19043 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49165 ,  Y10T428/12063 ,  Y10T428/12104 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12889 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/0401

摘要： A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.

摘要翻译： 描述了一种糊状物，用掺有溶剂的无氧化物金属层，不可剥离的聚合物和颗粒来覆盖电极。 电极可以是诸如C4凸起的互连。 还描述了用于形成涂层的方法和用于测试集成电路芯片的方法。 本发明克服了通过用含有Pb的电极与Au一起涂覆由集成电路芯片上的绝缘氧化物覆盖的含Pb电极来提供无氧化物表面进行测试和互连的问题。