公开(公告)号：US20100330742A1

公开(公告)日：2010-12-30

申请号：US12793923

申请日：2010-06-04

申请人： Michiaki Sugiyama ,  Takashi Miwa ,  Toshikazu Ishikawa ,  Tatsuya Hirai

发明人： Michiaki Sugiyama ,  Takashi Miwa ,  Toshikazu Ishikawa ,  Tatsuya Hirai

IPC分类号： H01L21/60

CPC分类号： H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A first conductive member made of metal is provided over a first wiring substrate, which is a mounting substrate in the lower tier, a through hole is provided in a second wiring substrate, which is a mounting substrate in the upper tier, at a position corresponding to the first conductive member in a plan view, and a wiring is exposed at the sidewall of the through hole. The first conductive member is inserted into the through hole on the corresponding first wiring substrate side and the first wiring substrate and the second wiring substrate are electrically coupled by filling the through hole with a second conductive member. an electrode pad that is electrically coupled to the second conductive member and over which a semiconductor member in the upper tier is mounted is formed on the main surface side of the second wiring substrate.

摘要翻译： 金属制的第一导电部件设置在第一布线基板上，第一布线基板是下层中的安装基板，通孔设置在第二布线基板中，第二布线基板是上层中的安装基板， 在平面图中的第一导电构件，并且布线在通孔的侧壁处露出。 将第一导电构件插入对应的第一布线基板侧的通孔中，并且通过用第二导电构件填充通孔来电耦合第一布线基板和第二布线基板。 在第二布线基板的主表面侧形成有电耦合到第二导电构件并且在其上安装上层中的半导体构件的电极焊盘。

公开(公告)号：USD581932S1

公开(公告)日：2008-12-02

申请号：US29286731

申请日：2007-05-17

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka ,  Yoshitaka Aoki ,  Keiichi Tsutsui

设计人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka ,  Yoshitaka Aoki ,  Keiichi Tsutsui

公开(公告)号：US20080272197A1

公开(公告)日：2008-11-06

申请号：US11957469

申请日：2007-12-16

申请人： Hirotaka NISHIZAWA ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

发明人： Hirotaka NISHIZAWA ,  Akira Higuchi ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama

IPC分类号： G06K19/067

CPC分类号： G06K19/07732 ,  G06K19/005 ,  G06K19/077 ,  G06K19/07749

摘要： An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.

摘要翻译： 通过抑制不对应于非接触式接口的存储卡的引脚布置和引脚形状的修改来提供用于非接触式接口的天线连接功能。 具有存储卡的两个天线连接引脚被分成两个区域，其中一个电位引脚的尺寸最大并且用作间隔布置的分离引脚。 由于两个天线连接引脚的尺寸与电源引脚的尺寸一样大，所以提供了两个天线连接引脚，并且通过使用具有尺寸的引脚区域来获得与非接触式接口对应的存储卡 一个可能的电源引脚与存储卡不对应的非接触式接口。 因此，可以形成与非接触式接口相对应的存储卡的引脚区域，而不会脱离与非接触式接口对应的存储卡的引脚区域。

公开(公告)号：US07399694B2

公开(公告)日：2008-07-15

申请号：US11482764

申请日：2006-07-10

申请人： Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

发明人： Takashi Kikuchi ,  Koichi Kanemoto ,  Michiaki Sugiyama ,  Hiroshi Kawakukbo

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K1/111 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/043 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.

摘要翻译： 通过制备具有多个NSMD结构的焊盘的封装衬底以及连接到每个焊盘并且已经以180度对称的位置相互布置的输出布线和虚拟布线，以及通过印刷方法印刷焊料 在封装组装之后的焊盘上的焊接层的高度的变化可以减小，并且实现了LGA（半导体器件）的安装性能的提高。

公开(公告)号：US07352588B2

公开(公告)日：2008-04-01

申请号：US11371929

申请日：2006-03-10

申请人： Hirotaka Nishizawa ,  Tamaki Wada ,  Kenji Osawa ,  Junichiro Osako ,  Michiaki Sugiyama

发明人： Hirotaka Nishizawa ,  Tamaki Wada ,  Kenji Osawa ,  Junichiro Osako ,  Michiaki Sugiyama

IPC分类号： H05K1/14 ,  H05K1/18 ,  H01L29/40

CPC分类号： H01L23/49855 ,  G06K19/07732 ,  H01L23/49833 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/145 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.

摘要翻译： 一种半导体器件，包括：一侧具有多个外部连接端子的第一布线板，安装在所述第一布线板的另一侧上并通过多根电线电连接到所述第一布线基板的半导体芯片，用于密封的密封树脂 半导体芯片和电线，以及第二配线基板，其在一侧具有多个接触点，并且在另一侧与所述密封树脂的上表面接合，其中，所述多根电线的所述环的上端部， 将第一配线基板与半导体芯片电连接，从密封树脂的顶面露出，并与第二配线基板电连接。

公开(公告)号：US07308588B2

公开(公告)日：2007-12-11

申请号：US10912289

申请日：2004-08-06

申请人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama ,  Junichiro Osako

发明人： Hirotaka Nishizawa ,  Akira Higuchi ,  Kenji Osawa ,  Tamaki Wada ,  Michiaki Sugiyama ,  Junichiro Osako

IPC分类号： G06F1/00

CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a memory card equipped with an interface controller connected to external connecting terminals, a memory connected to the interface controller, and a security controller connected to the interface controller. A second external connecting terminal capable of supplying an operating power supply to the security controller is provided aside from a first external connecting terminal which supplies an operating power supply to the interface controller and the memory. An interface unit of the interface controller connected to the security controller receives the operating power supply from the second external connecting terminal and thereby enables a stop of the supply of the operating power supply from the first external connecting terminal. Even if the supply of the operating power supply to the interface controller is cut off, the output of the interface unit is not brought to an indefinite state.

摘要翻译： 本发明提供了一种存储卡，其配备有连接到外部连接终端的接口控制器，连接到接口控制器的存储器和连接到接口控制器的安全控制器。 除了向接口控制器和存储器提供工作电源的第一外部连接端子之外，还提供了能够向安全控制器提供工作电源的第二外部连接端子。 连接到安全控制器的接口控制器的接口单元接收来自第二外部连接端子的工作电源，从而能够停止从第一外部连接端子供给工作电源。 即使向接口控制器提供工作电源被切断，接口单元的输出也不会变为无限状态。

公开(公告)号：USD552099S1

公开(公告)日：2007-10-02

申请号：US29242997

申请日：2005-11-18

申请人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka ,  Yoshitaka Aoki ,  Keiichi Tsutsui

设计人： Hirotaka Nishizawa ,  Kenji Osawa ,  Junichiro Osako ,  Tamaki Wada ,  Michiaki Sugiyama ,  Takashi Totsuka ,  Yoshitaka Aoki ,  Keiichi Tsutsui

公开(公告)号：US20060087016A1

公开(公告)日：2006-04-27

申请号：US11251961

申请日：2005-10-18

申请人： Tamaki Wada ,  Hirotaka Nishizawa ,  Michiaki Sugiyama ,  Junichiro Osako

发明人： Tamaki Wada ,  Hirotaka Nishizawa ,  Michiaki Sugiyama ,  Junichiro Osako

IPC分类号： H01L23/02

CPC分类号： H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/117 ,  H05K3/284 ,  H05K2201/0129 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09145 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

摘要： An IC card according to the present invention reduces or prevents a deterioration or damage on an electronic device to which the IC card is mounted. A buffer section made of a thermoplastic resin formed by a plastic injection molding is provided at the outer peripheral face of a memory card whose appearance is partly composed of a sealing section made of a thermosetting resin formed by a transfer molding without providing a cap. The buffer section has a taper formed at the outer peripheral corner, and further, the buffer section is softer than the sealing section and has a smooth surface. When the memory card is mounted to an electronic device, the buffer section is brought into contact with connector pins or a guide rail of a connector of the electronic device, thereby being capable of reducing or preventing the deterioration or damage on the connector.

摘要翻译： 根据本发明的IC卡减少或防止安装IC卡的电子设备的劣化或损坏。 由塑料注塑成型的热塑性树脂制成的缓冲部分设置在存储卡的外周面上，该存储卡的外观部分由密封部分组成，该密封部由不需设置帽的传递模塑形成的热固性树脂构成。 缓冲部具有在外周角形成的锥形，此外，缓冲部比密封部更软，并且具有光滑的表面。 当存储卡安装到电子设备时，缓冲部分与电子设备的连接器引脚或导轨接触，从而能够减少或防止连接器的劣化或损坏。

公开(公告)号：US20050094433A1

公开(公告)日：2005-05-05

申请号：US11002247

申请日：2004-12-03

申请人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

发明人： Masachika Masuda ,  Tamaki Wada ,  Michiaki Sugiyama ,  Hirotaka Nishizawa ,  Toshio Sugano ,  Yasushi Takahashi ,  Masayasu Kawamura

IPC分类号： H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07 ,  G11C11/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/3011 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

摘要翻译： 一种半导体器件，包括树脂模具，位于树脂模具内部的两个半导体芯片，具有形成在前表面上的前后表面和外部端子以及从树脂模具的内部延伸到外部的引线，其中每个所述引线 至少在树脂模具中分支成两个分支引线，一个分支引线固定到一个半导体芯片的表面，并通过导线与表面上的外部端子电连接，另一个分支引线被固定到 另一个半导体芯片的表面，并通过导线与表面上的外部端子电连接，并且两个半导体芯片彼此堆叠，并且它们的背面彼此相对。

公开(公告)号：US06853089B2

公开(公告)日：2005-02-08

申请号：US10225163

申请日：2002-08-22

申请人： Mikako Ujiie ,  Michiaki Sugiyama ,  Kazunari Suzuki ,  Masachika Masuda ,  Tamaki Wada

发明人： Mikako Ujiie ,  Michiaki Sugiyama ,  Kazunari Suzuki ,  Masachika Masuda ,  Tamaki Wada

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/28 ,  H01L23/498 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e., a package, which covers the semiconductor chip, the main surface of the wiring substrate and the electrodes, wherein a groove is formed between the semiconductor chip and the electrodes and the seal member and the wiring substrate have side faces cut by dicing. A protruding portion of the adhesive (an insulating resin) stays within the groove without getting over the groove and does not reach the electrodes. The groove is formed by removing the insulating film partially in the full depth direction of the film so as to extend through the film.

摘要翻译： 在半导体器件的制造中，通过采用通过粘合剂将半导体芯片固定在布线基板上的嵌段成型方法，可以防止由粘合剂流出而引起的缺陷的发生。 根据本发明的半导体器件包括布线基板，具有主表面的布线基板，形成在主表面上的绝缘膜，以及形成在主表面上以从绝缘膜露出的电极，半导体芯片 通过粘合剂固定在形成在布线基板的主表面上的绝缘膜上，用于将布线基板的主表面上的电极和半导体芯片上的电极彼此连接的导线，以及密封件 封装，其覆盖半导体芯片，布线基板的主表面和电极，其中在半导体芯片和电极之间形成凹槽，并且密封构件和布线基板具有通过切割切割的侧面。 粘合剂（绝缘树脂）的突出部分保持在槽内而不越过槽并且不会到达电极。 通过在膜的整个深度方向上部分地去除绝缘膜以便延伸穿过膜而形成凹槽。