公开(公告)号：US06881611B1

公开(公告)日：2005-04-19

申请号：US09635124

申请日：2000-08-08

申请人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

发明人： Norio Fukasawa ,  Toshimi Kawahara ,  Muneharu Morioka ,  Mitsunada Osawa ,  Yasuhiro Shinma ,  Hirohisa Matsuki ,  Masanori Onodera ,  Junichi Kasai ,  Shigeyuki Maruyama ,  Masao Sakuma ,  Yoshimi Suzuki ,  Masashi Takenaka

IPC分类号： B29C43/18 ,  H01L21/301 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L29/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  B29C43/18 ,  B29C2043/3444 ,  B29C2043/3628 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/566 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L29/0657 ,  H01L2221/68377 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1005 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

摘要翻译： 一种方法包括：树脂密封步骤，在模具20的空腔28中，将布置有凸块12的半导体元件11的基板16设置在树脂密封步骤中，将树脂35供应到凸块12的位置，使得 形成密封凸块12的树脂层13，使由树脂层13密封的凸块12的至少端部露出使突出部12的端部从树脂层13露出的突出电极曝光工序，以及分离工序 与树脂层13一起切割基板16，使得半导体元件11彼此分离。

公开(公告)号：US20090311831A1

公开(公告)日：2009-12-17

申请号：US12332146

申请日：2008-12-10

申请人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

发明人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

IPC分类号： H01L21/50

CPC分类号： H01L21/561 ,  H01L24/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is disclosed. As a part of the method, one surface of a substrate is molded with resin where the substrate and the resin are heated in a first heating process and maintained in a flat condition. The substrate and the resin are returned to room temperature while being maintained in the flat condition after the first heating process. The resin is cut after the substrate and the resin are returned to room temperature from a surface of the resin that is opposite the surface of the resin where the substrate contacts the resin. The substrate is left intact when the resin is cut. Thereafter, the substrate is separated.

摘要翻译： 公开了一种制造半导体器件的方法。 作为该方法的一部分，基板的一个表面用树脂模制，其中基板和树脂在第一加热过程中被加热并保持在平坦的状态。 在第一加热处理之后，将基板和树脂恢复到室温，同时保持在平坦状态。 在基板之后切割树脂，树脂从与树脂接触的树脂表面相对的树脂表面返回到室温。 当切割树脂时，基材保持不变。 此后，分离基板。

公开(公告)号：US07851260B2

公开(公告)日：2010-12-14

申请号：US12332146

申请日：2008-12-10

申请人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

发明人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L24/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is disclosed. As a part of the method, one surface of a substrate is molded with resin where the substrate and the resin are heated in a first heating process and maintained in a flat condition. The substrate and the resin are returned to room temperature while being maintained in the flat condition after the first heating process. The resin is cut after the substrate and the resin are returned to room temperature from a surface of the resin that is opposite the surface of the resin where the substrate contacts the resin. The substrate is left intact when the resin is cut. Thereafter, the substrate is separated.

摘要翻译： 公开了一种制造半导体器件的方法。 作为该方法的一部分，基板的一个表面用树脂模制，其中基板和树脂在第一加热过程中被加热并保持在平坦的状态。 在第一加热处理之后，将基板和树脂恢复到室温，同时保持在平坦状态。 在基板之后切割树脂，树脂从与树脂接触的树脂表面相对的树脂表面返回到室温。 当切割树脂时，基材保持不变。 此后，分离基板。

公开(公告)号：US5747874A

公开(公告)日：1998-05-05

申请号：US529784

申请日：1995-09-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L23/02

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装有半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US6022759A

公开(公告)日：2000-02-08

申请号：US25327

申请日：1998-02-18

申请人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

发明人： Masaaki Seki ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Lim Cheang Hai ,  Koki Otake ,  Susumu Abe ,  Junichi Kasai ,  Masao Sakuma ,  Yoshimi Suzuki ,  Yasuhiro Shinma

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H01L21/44 ,  H01L21/58

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49805 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8547 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

摘要翻译： 半导体器件包括半导体元件，半导体器件基底元件，其具有安装半导体元件的元件安装部分，设置在半导体器件基底元件上并与半导体元件电连接的外部连接端子，以及密封半导体元件的树脂 元件。 半导体器件基底部件包括基部和由基部支撑的引线部。 引线部分电连接到外部连接端子。 半导体器件基体具有弯曲部分，其中引线部分位于半导体器件基底部件的外侧。 弯曲部分位于半导体器件基底部件的边缘部分。

公开(公告)号：US06563207B2

公开(公告)日：2003-05-13

申请号：US10186997

申请日：2002-07-02

申请人： Yasuhiro Shinma

发明人： Yasuhiro Shinma

IPC分类号： H01L2322

CPC分类号： H01L21/67126 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

摘要： A split-mold, which is used for manufacturing semiconductor devices by resin-encapsulating a substrate on which a plurality of semiconductor chips are formed, includes a first mold and a second mold. The second mold has a pressing surface that is provided with a mold release sheet. The second mold has a mold-release-sheet mechanism holding a mold release sheet outside the pressing surface of the second mold and applying tension to the mold release sheet.

公开(公告)号：US20090315166A1

公开(公告)日：2009-12-24

申请号：US12337396

申请日：2008-12-17

申请人： Yasuhiro Shinma

发明人： Yasuhiro Shinma

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention provides a semiconductor device that includes semiconductor packages arranged in a stacked configuration. A plurality of leads are drawn from the stacked semiconductor packages and folded around the outer shape of each semiconductor package such that the leads extend over the upper surfaces of the semiconductor package. Holders affix the stacked semiconductor packages so that first and second leads contact each other, the first leads being drawn from a first one of the stacked semiconductor packages at a lower stacking stage, and the second leads being drawn from a second one of the stacked semiconductor packages at an adjacent, upper stacking stage.

摘要翻译： 本发明提供一种半导体器件，其包括以堆叠配置布置的半导体封装。 多个引线从堆叠的半导体封装中被拉出并围绕每个半导体封装的外部形状折叠，使得引线在半导体封装的上表面上延伸。 保持器固定堆叠的半导体封装，使得第一和第二引线彼此接触，第一引线在堆叠阶段的下部从堆叠的半导体封装中的第一引线拉出，并且第二引线从第二堆叠半导体 包装在相邻的上堆叠阶段。

公开(公告)号：US06511620B1

公开(公告)日：2003-01-28

申请号：US09511496

申请日：2000-02-23

申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

IPC分类号： B29C3318

CPC分类号： B29C33/0055 ,  B29C33/68 ,  B29C43/18 ,  B29C43/36 ,  B29C43/3642 ,  B29C43/56 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.

摘要翻译： 一种制造半导体器件的方法，其在树脂封装之后与金属模具具有优异的可分离性，因此不需要清洁金属模具。 还提供了用于制造这种半导体器件的金属模具。 根据本发明的方法，首先打开金属模具，并且在包括第一金属模具和第二金属模具的空腔形成表面的分割表面上设置两个分离片。 然后将基板放置在一个分离片上，其半导体芯片形成表面面向第二金属模具。 在放置在一个分离片上的基板上设置封装树脂。 将处于加热状态的金属模封闭并压制以形成用于封装形成在基板上的电极的树脂层。 再次打开金属模具，将树脂封装的基板从金属模具中取出。 在分离片被去除之后，将衬底分成单独的半导体器件。

公开(公告)号：US06515347B1

公开(公告)日：2003-02-04

申请号：US09588348

申请日：2000-06-07

申请人： Yasuhiro Shinma ,  Norio Fukasawa ,  Takashi Hozumi ,  Toshimi Kawashara ,  Masamitsu Ikumo

发明人： Yasuhiro Shinma ,  Norio Fukasawa ,  Takashi Hozumi ,  Toshimi Kawashara ,  Masamitsu Ikumo

IPC分类号： H01L23544

CPC分类号： H01L23/3114 ,  H01L21/56 ,  H01L21/566 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/274 ,  H01L2924/15151 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014

摘要： A wafer level semiconductor device including a wafer having a plurality of semiconductor elements formed on an upper surface thereof, a sealing resin including a first part for sealing the upper surface of the wafer and a second part for sealing a side surface of wafer, the second part having a lower edge surface flush with a lower surface of the wafer, and a film for covering the lower surface of wafer and the lower edge surface of the second part of the sealing resin and conducting the process using the wafer level semiconductor device in which the film is bonded. This structure prevents warping of the wafer level semiconductor device after the sealing resin is formed on the device and it is then taken out from the mold dies.

摘要翻译： 一种晶片级半导体器件，包括在其上表面上形成有多个半导体元件的晶片，密封树脂，其包括用于密封晶片的上表面的第一部分和用于密封晶片的侧表面的第二部分，第二部分 具有与晶片的下表面齐平的下边缘表面的部分，以及用于覆盖晶片的下表面和密封树脂的第二部分的下边缘表面的膜，并且使用晶片级半导体器件进行该工艺，其中 胶片粘合。 这种结构防止了在装置上形成密封树脂之后晶片级半导体器件翘曲，然后从模具中取出。

公开(公告)号：US07622067B2

公开(公告)日：2009-11-24

申请号：US11441760

申请日：2006-05-26

申请人： Yasuhiro Shinma

发明人： Yasuhiro Shinma

IPC分类号： H01L21/56 ,  B29C45/14

CPC分类号： H01L21/565 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An apparatus for manufacturing a semiconductor device includes an upper mold (21), a lower mold (22), and a plate (30, 130, 230) that includes at least one cavity (31) that receives resin and defines an outer shape and a thickness of a resin sealing portion, and a gate (32) through which the resin is guided to the cavity (31), the plate (30) being interposed between the upper mold (21) and the lower mold (22). The plate (130) further includes a resin film (132) fixed by viscoelastic or adhesive bonding to a side of thin plates (131) towards a substrate on which electrodes are provided. The semiconductor device is provided which has no resin burrs that occur on a substrate in an end portion of the molded body. The plate (30, 130, 230) is formed by multiple thin plates (231, 232, 233) joined by welding or positioned by positioning pins (237, 238).

摘要翻译： 一种用于制造半导体器件的装置，包括上模具（21），下模具（22）和板（30,130,230），其包括至少一个容纳树脂并限定外形的空腔（31） 树脂密封部分的厚度和树脂被引导到空腔31的浇口（32），板（30）插入在上模具（21）和下模具（22）之间。 板（130）还包括通过粘弹性或粘合剂粘合到薄板（131）侧面朝向其上设置有电极的基板的树脂膜（132）。 提供了在成型体的端部的基板上不产生树脂毛刺的半导体装置。 板（30,130,230）由通过焊接接合或通过定位销（237,238）定位的多个薄板（231,232,233）形成。