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    Method of producing semiconductor devices having easy separability from a metal mold after molding
    1.
    发明授权
    Method of producing semiconductor devices having easy separability from a metal mold after molding 失效
    在成型后具有与金属模具容易分离的半导体器件的制造方法

    公开(公告)号：US06511620B1

    公开(公告)日：2003-01-28

    申请号：US09511496

    申请日：2000-02-23

    申请人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

    发明人： Toshimi Kawahara ,  Hirohisa Matsuki ,  Yasuhiro Shinma ,  Yoshiyuki Yoneda ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Kenichi Nagashige ,  Takashi Hozumi

    IPC分类号： B29C3318

    CPC分类号： B29C33/0055 ,  B29C33/68 ,  B29C43/18 ,  B29C43/36 ,  B29C43/3642 ,  B29C43/56 ,  H01L21/566 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of producing semiconductor devices which have an excellent separability from a metal mold after resin encapsulation and thus eliminates the need to clean the metal mold. A metal mold for producing such semiconductor devices is also provided. According to the method of the present invention, the metal mold is first opened, and two separation sheets are disposed on dividing surfaces including cavity forming surfaces of a first metal mold and a second metal mold. A substrate is then placed on one of the separation sheets, with its semiconductor chip formed surface facing the second metal mold. An encapsulation resin is provided on the substrate placed on one of the separation sheets. The metal mold in a heated state is closed and pressed to form a resin layer for encapsulating electrodes formed on the substrate. The metal mold is again opened, and the resin-encapsulated substrate is taken out of the metal mold. After the separation sheets are removed, the substrate is divided into individual semiconductor devices.

    摘要翻译： 一种制造半导体器件的方法，其在树脂封装之后与金属模具具有优异的可分离性，因此不需要清洁金属模具。 还提供了用于制造这种半导体器件的金属模具。 根据本发明的方法，首先打开金属模具，并且在包括第一金属模具和第二金属模具的空腔形成表面的分割表面上设置两个分离片。 然后将基板放置在一个分离片上，其半导体芯片形成表面面向第二金属模具。 在放置在一个分离片上的基板上设置封装树脂。 将处于加热状态的金属模封闭并压制以形成用于封装形成在基板上的电极的树脂层。 再次打开金属模具，将树脂封装的基板从金属模具中取出。 在分离片被去除之后，将衬底分成单独的半导体器件。

    Mold for fabricating semiconductor devices
    3.
    发明授权
    Mold for fabricating semiconductor devices 有权
    用于制造半导体器件的模具

    公开(公告)号：US06471501B1

    公开(公告)日：2002-10-29

    申请号：US09272754

    申请日：1999-03-18

    申请人： Yasuhiro Shinma ,  Muneharu Morioka ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Tadashi Uno ,  Hirohisa Matsuki ,  Kenichi Nagashige

    发明人： Yasuhiro Shinma ,  Muneharu Morioka ,  Norio Fukasawa ,  Yuzo Hamanaka ,  Tadashi Uno ,  Hirohisa Matsuki ,  Kenichi Nagashige

    IPC分类号： B29C4514

    CPC分类号： B29C43/36 ,  B29C43/18 ,  B29C2043/5858 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A mold for press-molding a resin package body includes a lower mold and an upper mold, wherein the upper mold includes a press plate held in a tiltable manner with respect to a press head used for urging the upper mold against the lower mold and a lock mechanism for locking the press plate. The lower mold includes an inner die carrying a semiconductor device and a resin tablet and an outer die surrounding the inner die in a manner movable up and down with respect to the inner die. In operation, the press plate is first engaged with the outer die in the unlocked state to achieve an exact parallelism with respect to the inner die, and after locking the press plate and melting the resin tablet, the press plate is urged further toward the inner die while simultaneously lowering the outer die such that the space formed by the lower die, outer die and the press plate for accommodating a semiconductor chip is collapsed.

    摘要翻译： 一种用于模制树脂封装体的模具包括下模具和上模具，其中上模具包括相对于用于将上模压靠在下模上的压头可倾斜地保持的压板，以及 用于锁定压板的锁定机构。 下模包括以相对于内模上下移动的方式承载半导体装置和树脂片的内模和围绕内模的外模。 在操作中，压板首先在解锁状态下与外模接合，以实现相对于内模的精确平行度，并且在锁定压板并熔化树脂片之后，压板进一步向内 同时降低外模，使得由下模，外模和用于容纳半导体芯片的压板形成的空间被折叠。

    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices
    7.
    发明申请
    Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices 失效
    叠层型半导体器件用载体及叠层型半导体器件的制造方法

    公开(公告)号：US20060245908A1

    公开(公告)日：2006-11-02

    申请号：US11341984

    申请日：2006-01-27

    申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

    发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Achari

    IPC分类号： B65H1/00

    CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

    摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。