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    SEMICONDUCTOR DEVICE
    22.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210193540A1

    公开(公告)日：2021-06-24

    申请号：US17190584

    申请日：2021-03-03

    Applicant: MediaTek Inc.

    Inventor： Nan-Cheng Chen ,  Che-Ya Chou ,  Hsing-Chih Liu ,  Che-Hung Kuo

    IPC: H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H01L23/482 ,  H01L25/04

    Abstract: A semiconductor device includes a substrate, a body structure and an electronic component. The body structure is disposed above the substrate and includes a semiconductor die, a molding compound, a conductive component and a lower redistribution layer (RDL). The semiconductor die has an active surface. The molding compound encapsulates the semiconductor die and has a lower surface, an upper surface opposite to the lower surface and a through hole extending to the upper surface from the lower surface. The conductive component is formed within the through hole. The lower RDL is formed on the lower surface of the molding compound, the active surface of the semiconductor die and the conductive component exposed from the lower surface. The electronic component is disposed above the upper surface of the molding compound and electrically connected to the lower RDL through the conductive component.

    Semiconductor package with reduced noise
    23.
    发明授权
    Semiconductor package with reduced noise 有权

    公开(公告)号：US10910323B2

    公开(公告)日：2021-02-02

    申请号：US16535019

    申请日：2019-08-07

    Applicant: MEDIATEK INC.

    Inventor： Sheng-Mou Lin ,  Wen-Chou Wu ,  Hsing-Chih Liu

    IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18

    Abstract: The present disclosure provides a semiconductor package including a bottom package having a substrate, a radio-frequency (RF) die and a system-on-a-chip (SoC) die arranged on the substrate in a side-by-side manner, a molding compound covering the RF die and the SoC die, and an interposer over the molding compound. Connection elements and a column of signal interference shielding elements are disposed on the substrate. The connection elements surround the SoC die. The column of signal interference shielding elements is interposed between the RF die and the SoC die. A top package is mounted on the interposer.

    Semiconductor package structure
    26.
    发明授权
    Semiconductor package structure 有权

    公开(公告)号：US12230560B2

    公开(公告)日：2025-02-18

    申请号：US17546191

    申请日：2021-12-09

    Applicant: MEDIATEK INC.

    Inventor： Che-Hung Kuo ,  Hsing-Chih Liu ,  Tai-Yu Chen

    IPC: H01L23/498 ,  H01L23/48 ,  H01L23/64 ,  H01L25/065

    Abstract: A semiconductor package structure includes a frontside redistribution layer, a first semiconductor die, a first capacitor, a conductive terminal, and a backside redistribution layer. The first semiconductor die is disposed over the frontside redistribution layer. The first capacitor is disposed over the frontside redistribution layer and electrically coupled to the first semiconductor die. The conductive terminal is disposed below the frontside redistribution layer and electrically coupled to the frontside redistribution layer. The backside redistribution layer is disposed over the first semiconductor die.

    SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE
    27.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING DISCRETE ANTENNA DEVICE 有权

    公开(公告)号：US20250015483A1

    公开(公告)日：2025-01-09

    申请号：US18885764

    申请日：2024-09-16

    Applicant: MEDIATEK INC.

    Inventor： Wen-Chou Wu ,  Yi-Chieh Lin ,  Chia-Yu Jin ,  Hsing-Chih Liu

    IPC: H01Q1/22 ,  H01L23/498 ,  H01L25/16 ,  H01Q21/06

    Abstract: A semiconductor package includes a first package having a first side and a second side opposing the first side. The first package comprises a first electronic component and a second electronic component arranged in a side-by-side manner on the second side. A second package is mounted on the first side of the first package. The second package comprises a radiative antenna element. A connector is configured to electrically couple to a 5G modem through a flex cable and is disposed on the second side.

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