公开(公告)号：US20160184593A1

公开(公告)日：2016-06-30

申请号：US14966279

申请日：2015-12-11

Applicant: Medtronic, Inc.

Inventor： David A. Ruben ,  Michael S. Sandlin

IPC: A61N1/375 ,  H05K3/42 ,  H05K3/32

CPC classification number: A61N1/3754 ,  H05K3/32 ,  H05K3/42

Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

Abstract translation: 公开了可植入医疗装置系统的各种实施例和形成这种系统的方法。 在一个或多个实施例中，可植入医疗装置系统包括壳体，设置在壳体内的电子装置，以及连接到壳体的侧壁并与电子装置电连接的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料和设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部接触电耦合到布置在通孔中的导电材料。 在一个或多个实施例中，通过围绕通孔的激光键将外部接触件气密地密封到非导电衬底的外表面。

公开(公告)号：US20140171822A1

公开(公告)日：2014-06-19

申请号：US14186039

申请日：2014-02-21

Applicant: Medtronic, Inc.

Inventor： Richard J. O'Brien ,  John K. Day ,  Paul F. Gerrish ,  Michael F. Mattes ,  David A. Ruben ,  Malcolm K. Grief

IPC: H01L23/12 ,  A61N1/372 ,  A61B5/11 ,  A61B5/01 ,  A61B5/03

CPC classification number: H01L23/12 ,  A61B5/0031 ,  A61B5/01 ,  A61B5/03 ,  A61B5/11 ,  A61N1/37211 ,  A61N1/3758 ,  B81B2201/0214 ,  B81B2207/012 ,  B81C1/0023 ,  H01L23/58 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Abstract translation: 医疗装置包括第一基板，第二基板，控制模块和能量存储装置。 第一基板包括第一半导体材料和第一绝缘材料中的至少一个。 第二基板包括第二半导体材料和第二绝缘材料中的至少一个。 第二基板被结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。 控制模块设置在封闭腔内。 控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。 能量存储装置设置在空腔内并被配置为向控制模块供电。

公开(公告)号：US20240244782A1

公开(公告)日：2024-07-18

申请号：US18619746

申请日：2024-03-28

Applicant: MEDTRONIC, INC.

Inventor： David A. Ruben

IPC: H05K5/06 ,  A61N1/375 ,  H05K3/38 ,  H05K7/06

CPC classification number: H05K5/066 ,  A61N1/3754 ,  H05K3/38 ,  H05K5/06 ,  H05K7/06 ,  H05K2203/107

Abstract: Various embodiments of a hermetically-sealed package and methods of forming such packages are disclosed. In one or more embodiments, the hermetically-sealed package can include a housing and a feedthrough assembly that forms a part of the housing. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. Further, the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

公开(公告)号：US11969821B2

公开(公告)日：2024-04-30

申请号：US18067438

申请日：2022-12-16

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben

IPC: B23K26/122 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/12 ,  B23K26/352 ,  A61N1/04

CPC classification number: B23K26/0622 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/082 ,  B23K26/122 ,  B23K26/127 ,  B23K26/355 ,  A61N1/04

Abstract: A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

公开(公告)号：US11744518B2

公开(公告)日：2023-09-05

申请号：US17884909

申请日：2022-08-10

Applicant: Medtronic, Inc.

Inventor： David A. Ruben ,  Craig L. Schmidt

IPC: H05K5/06 ,  H05K5/02 ,  A61B5/00 ,  A61N1/375 ,  A61N1/372 ,  A61B5/0245 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/03

CPC classification number: A61B5/686 ,  A61B5/0245 ,  A61N1/05 ,  A61N1/372 ,  A61N1/3754 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0017 ,  H05K3/32 ,  H05K3/4038 ,  H05K5/0247 ,  H05K5/03 ,  H05K5/066 ,  H05K5/069 ,  A61N1/37512 ,  A61N2001/37294 ,  H05K2201/09036

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

公开(公告)号：US11548092B2

公开(公告)日：2023-01-10

申请号：US16353119

申请日：2019-03-14

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben

IPC: B23K26/0622 ,  B23K26/046 ,  B23K26/352 ,  B23K26/122 ,  B23K26/12 ,  B23K26/082 ,  A61N1/04

Abstract: A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

公开(公告)号：US20210154772A1

公开(公告)日：2021-05-27

申请号：US17086946

申请日：2020-11-02

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/70 ,  B23K26/362

Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

公开(公告)号：US10981355B2

公开(公告)日：2021-04-20

申请号：US16156760

申请日：2018-10-10

Applicant: Medtronic, Inc. ,  Corning Incorporated

Inventor： Michael S. Sandlin ,  David A. Ruben ,  Raymond M. Karam ,  Georges Roussos ,  Thomas M. Wynne

IPC: B32B7/04 ,  B23K20/02 ,  B32B15/04 ,  B23K20/22 ,  B32B37/14 ,  B32B17/06 ,  B23K103/14 ,  B23K103/18 ,  B23K103/00 ,  B23K103/16

Abstract: Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

公开(公告)号：US20210045260A1

公开(公告)日：2021-02-11

申请号：US17013609

申请日：2020-09-06

Applicant: Medtronic, Inc.

Inventor： John K. Day ,  Michael J. Nidelkoff ,  Kris A. Peterson ,  Andrew J. Ries ,  David A. Ruben ,  Craig L. Wiklund

IPC: H05K5/06 ,  A61N1/375 ,  A61N1/378 ,  A61J1/00 ,  H05K7/14 ,  H01M2/30 ,  H05K5/00

Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

公开(公告)号：US10818811B2

公开(公告)日：2020-10-27

申请号：US16409956

申请日：2019-05-13

Applicant: Medtronic, Inc.

Inventor： Andreas A. Fenner ,  David A. Ruben ,  Jennifer Lorenz Marckmann ,  James R. Wasson

IPC: H01L31/055 ,  H01L31/16 ,  H01L31/054 ,  G21H1/12

Abstract: Various embodiments of a power source and method of forming such power source are disclosed. The power source can include a substrate and a cavity disposed in a first major surface of the substrate. The power source can also include radioactive material disposed within the cavity, where the radioactive material emits radiation particles; and particle converting material disposed within the cavity, where the particle converting material converts one or more radiation particles emitted by the radioactive material into light. The power source further includes a sealing layer disposed such that the particle converting material and the radioactive material are hermetically sealed within the cavity, and a photovoltaic device disposed adjacent the substrate. The photovoltaic device can convert at least a portion of the light emitted by the particle converting material that is incident upon an input surface of the photovoltaic device into electrical energy.