公开(公告)号：US06608757B1

公开(公告)日：2003-08-19

申请号：US10101277

申请日：2002-03-18

申请人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

发明人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

IPC分类号： H05K716

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/4641 ,  H05K2203/143

摘要： Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.

摘要翻译： 通孔形成在导电电力平面中。 可光成像电介质（PID）材料被施加到填充通孔的电源平面的一侧。 没有PID材料的电源平面侧暴露于光能以固化通孔中的PID材料。 开发人员用于去除任何未固化的PID材料。 包括导电信号平面和电介质层的信号平面组件层压到形成两个信号和一个功率平面（2S1P）结构的填充的电源平面上。 在另一实施例中，动力平面具有从两侧施加的PID材料。 将光掩模应用于电源平面，通孔中的PID材料用光能固化。 开发人员用于清除未固化的PID材料。 如上所述的信号平面组件被层压到形成2S1P结构的填充的电源平面上。

公开(公告)号：US06593534B2

公开(公告)日：2003-07-15

申请号：US09812261

申请日：2001-03-19

申请人： Gerald W. Jones ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  James P. Paoletti ,  Konstantinos I. Papathomas ,  James R. Stack

发明人： Gerald W. Jones ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller ,  James P. Paoletti ,  Konstantinos I. Papathomas ,  James R. Stack

IPC分类号： H01R909

CPC分类号： H05K3/462 ,  H05K1/115 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0554

摘要： A structure of and method for producing a multilayer printed or wiring circuit board, and more particularly a method producing so-called z-axis or multilayer electrical interconnections in a hierarchial wiring structure in order to be able to provide for an increase in the number of inputs and outputs (I/O) in comparison with a standard printed wiring board (PWB) arrangement, and a printed wiring board produced by the method.

公开(公告)号：US5467837A

公开(公告)日：1995-11-21

申请号：US421283

申请日：1995-04-13

申请人： Thomas R. Miller ,  Daniel C. Sheirer

发明人： Thomas R. Miller ,  Daniel C. Sheirer

IPC分类号： E21B10/46 ,  E21B10/54 ,  E21B10/58

CPC分类号： E21B10/46 ,  E21B10/54 ,  E21B10/58

摘要： A roof drill bit having a tool body with a cutting insert brazed thereto. The cutting insert has opposite leading and trailing face portions joined by a side surface which has a leading side relief portion adjacent the leading face portion and a trailing side relief portion adjacent the trailing face portion. The trailing side relief portion, which extends from the leading face portion a distance equal to between about one-third to two-thirds the thickness of the insert, has a greater relief angle that the leading side relief portion, which extends from the trailing face portion a distance equal to between about one-third to about two-thirds the thickness of the insert.

摘要翻译： 一种具有工具主体的屋顶钻头，其具有钎焊到其上的切削刀片。 切削刀片具有由具有与前表面部分相邻的前侧浮雕部分和与后表面部分相邻的后侧浮雕部分的侧表面连接的相对的前后面部分。 从前面部分延伸的距离等于插入件厚度的约三分之一至三分之二的尾边释放部分具有较大的角度，即，从侧面延伸的前侧卸载部分 部分的距离等于插入件的厚度的大约三分之一到三分之二。

公开(公告)号：US5054984A

公开(公告)日：1991-10-08

申请号：US593475

申请日：1990-10-02

申请人： Wai-Kwong Chan ,  Mary F. Allsopp ,  Peter A. Brandt ,  Robert R. Butler ,  Kevin T. McGuire ,  Thomas R. Miller ,  Robert W. Nonnemann ,  Gordon A. Obrecht ,  Ronald B. Saluski ,  Michael W. Shircliff ,  Samuel A. Walker

发明人： Wai-Kwong Chan ,  Mary F. Allsopp ,  Peter A. Brandt ,  Robert R. Butler ,  Kevin T. McGuire ,  Thomas R. Miller ,  Robert W. Nonnemann ,  Gordon A. Obrecht ,  Ronald B. Saluski ,  Michael W. Shircliff ,  Samuel A. Walker

IPC分类号： B42C19/04 ,  B42C19/08 ,  G06F19/00

CPC分类号： B42C19/08 ,  B65H2301/4311

摘要： A binding line including at least first and second binding line sections. The first binding line section is adapted to transport books therealong to a book exit station and the second binding line section is adapted to transport books therealong from a book entry station. The binding line includes a book transferring mechanism or subsystem for moving books from the book exit station of the first binding line section to the book entry station of the second binding line section as well as devices associated with book leaving the book exit station and books entering the book entry station for tracking books during transfer from the first binding line section to the second binding line section. The first binding line section can run at the same or a different speed than the second binding line section. In addition, the binding line can include asynchronous or synchronous multiple first and/or second binding line sections.

摘要翻译： 包括至少第一和第二结合线段的结合线。 第一装订线部分适于将书籍运送到书籍出口站，并且第二装订线部分适用于从书籍输入站传送书本。 装订线包括书籍传送机构或子系统，用于将书籍从第一装订线路部分的书籍出口站移动到第二装订线路部分的书籍输入站，以及与书籍出口站相关联的书籍和书籍输入 用于在从第一装订线部分转移到第二装订线部分的期间跟踪书籍的书籍输入站。 第一结合线段可以以与第二结合线段相同或不同的速度运行。 此外，绑定线可以包括异步或同步多个第一和/或第二绑定线段。

公开(公告)号：US4544208A

公开(公告)日：1985-10-01

申请号：US633728

申请日：1984-07-23

申请人： Thomas R. Miller

发明人： Thomas R. Miller

IPC分类号： E21F7/00 ,  E21F5/00

CPC分类号： E21F7/00

摘要： A coal seam is degasified in advance of its being mined by drilling one or more generally horizontal holes from a working face into the seam, and placing a particulate propping agent into the borehole to maintain its integrity.

摘要翻译： 煤层通过将一个或多个大致水平的孔从工作面钻入接缝中而在其开采之前脱气，并将颗粒状支撑剂置于钻孔中以保持其完整性。

公开(公告)号：US08634529B2

公开(公告)日：2014-01-21

申请号：US11776681

申请日：2007-07-12

申请人： Thomas R. Miller ,  Lee Inman

发明人： Thomas R. Miller ,  Lee Inman

IPC分类号： H04M3/42 ,  H04M1/64

CPC分类号： H04M3/42221 ,  H04M3/5322 ,  H04M3/56 ,  H04M3/565 ,  H04M2203/5054 ,  H04M2203/5063

摘要： An improved conference calling system that operates to correlate a conference call with other conference calls, along with collateral information pertinent to the conference call, and deliver the correlated information to conference call participants or other entities. When setting up a conference call, a reservation system interface enables a user to not only schedule the conference call, but to also enter information that can be used to (a) correlate the instance conference call with previous or future conference calls, (b) set up for the recordation of the conference call, (c) set up for the delivery of the recorded conference call through one or more media channels, and (d) provide the recorded conference call as well as any related collateral and correlated conference calls to various parties.

摘要翻译： 一种改进的电话会议系统，其操作以将电话会议与其他电话会议相关联，以及与会议呼叫相关的附带信息，并将相关信息传递给电话会议参与者或其他实体。 在建立电话会议时，预约系统接口使得用户不仅可以安排电话会议，还可以输入可用于（a）将实例电话会议与先前或将来的电话会议关联的信息，（b） 设立电话会议记录，（c）通过一个或多个媒体渠道设置传送录制的电话会议，以及（d）提供记录的电话会议以及任何相关的抵押品和相关电话会议 各方

公开(公告)号：US07547577B2

公开(公告)日：2009-06-16

申请号：US11598647

申请日：2006-11-14

申请人： Norman A. Card ,  Thomas R. Miller ,  William J. Rudik

发明人： Norman A. Card ,  Thomas R. Miller ,  William J. Rudik

IPC分类号： H01L21/44

CPC分类号： H05K3/4614 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/16225 ,  H05K3/3484 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49158 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical connections being formed between respective pairs of conductors of the subassemblies in such a manner that the metallurgies of the conductors, and those of an interim metallic solder paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies is forced to flow to engage and surround the conductor coupling, without adversely affecting the electrical connection formed.

摘要翻译： 一种制造电路化基板组件的方法，其中两个或更多个子组件对准并结合在一起。 优选使用层压的结合导致在子组件的各对导体之间形成有效的电连接，使得导体和中间金属焊膏的导体的冶金被有效地混合，并且可流动的中间电介质 在配合子组件之间使用的流体被迫流动以接合和围绕导体耦合，而不会不利地影响形成的电连接。

公开(公告)号：US07083901B2

公开(公告)日：2006-08-01

申请号：US10262724

申请日：2002-10-01

申请人： Frank D. Egitto ,  Voya Markovich ,  Thomas R. Miller ,  Douglas O. Powell ,  James R. Wilcox

发明人： Frank D. Egitto ,  Voya Markovich ,  Thomas R. Miller ,  Douglas O. Powell ,  James R. Wilcox

IPC分类号： G03C5/00 ,  H01K3/00

CPC分类号： H05K3/4069 ,  H05K3/062 ,  H05K3/108 ,  H05K3/423 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4614 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09554 ,  H05K2203/025 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49179

摘要： A layer for use in a modular assemblage for supporting ICES is formed with metal contacts for assembly by making a sandwich of metal interconnect members between two layers of dielectric; drilling holes through the dielectric, stopping on a metal layer bonded to the bottom surface of the module; forming blind holes stopping on the interconnect members; and plating metal through the volume of the via, both full and blind holes, thereby forming vertical and horizontal connections in a layer that be stacked to form complex interconnect assemblies.

摘要翻译： 用于支撑ICES的模块化组件中的层由用于组装的金属触点形成，通过在两层电介质之间制造金属互连构件的夹层; 通过电介质钻孔，停止在与模块底面接合的金属层上; 形成在所述互连构件上停止的盲孔; 并通过通孔的体积电镀金属孔，这两个孔都是盲孔，从而在堆叠形成复杂互连组件的层中形成垂直和水平连接。

公开(公告)号：US06905589B2

公开(公告)日：2005-06-14

申请号：US10370529

申请日：2003-02-24

申请人： Frank D. Egitto ,  Voya P. Markovich ,  Thomas R. Miller

发明人： Frank D. Egitto ,  Voya P. Markovich ,  Thomas R. Miller

IPC分类号： H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  C25D5/02

CPC分类号： H05K3/4644 ,  H05K1/112 ,  H05K3/423 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/0733

摘要： A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.

摘要翻译： 一种制造电路化基板的方法，其中共用层在诸如用于将芯片耦合到印刷电路板等的层叠插入件的多层部件中形成多个基本上垂直排列的导电开口。 包括这种芯片和电路板的结构非常适合在信息处理系统中使用。

公开(公告)号：US06852152B2

公开(公告)日：2005-02-08

申请号：US10253679

申请日：2002-09-24

申请人： Raymond T. Galasco ,  Roy H. Magnuson ,  Voya R. Markovich ,  Thomas R. Miller ,  Anita Sargent ,  William E. Wilson

发明人： Raymond T. Galasco ,  Roy H. Magnuson ,  Voya R. Markovich ,  Thomas R. Miller ,  Anita Sargent ,  William E. Wilson

IPC分类号： C23C18/28 ,  H05K3/18 ,  C23C18/30

CPC分类号： C23C18/28 ,  H05K3/181

摘要： A colloidal metal seed formulation useful for catalytically activating a surface of a non-conductive dielectric substrate in an electroless plating process is provided. The colloidal metal seed formulation includes stannous chloride, palladium chloride, HCl and a surfactant selected from a diphenyloxide disulfonic acid or alkali or alkaline earth metal salt thereof, C30H50O10, an alcohol alkoxylate and mixtures thereof. A method of electroless plating of a conductive metal onto a non-conductive dielectric substrate using the colloidal metal seed formulation is also provided.

摘要翻译： 提供了一种用于在非电镀过程中催化活化非导电电介质基片的表面的胶态金属种子制剂。 胶态金属种子制剂包括氯化亚锡，氯化钯，HCl和选自二苯氧基二磺酸或其碱金属或碱土金属盐，C30H50O10，醇烷氧基化物及其混合物的表面活性剂。 还提供了使用胶体金属种子制剂将导电金属化学镀在非导电电介质基底上的方法。