公开(公告)号：US08424388B2

公开(公告)日：2013-04-23

申请号：US13016363

申请日：2011-01-28

申请人： Michael F. Mattes ,  David A. Ruben

发明人： Michael F. Mattes ,  David A. Ruben

IPC分类号： G01L7/00

CPC分类号： A61B5/0215 ,  A61B2562/0247 ,  A61B2562/028 ,  A61N1/056 ,  G01L9/0072 ,  G01L9/12 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An implantable capacitive pressure sensor apparatus and method for making such an apparatus includes a first pressure sensor portion and a second pressure sensor portion. The first pressure sensor portion includes a diaphragm electrode connectable to ground (e.g., the diaphragm electrode being positioned in close proximity to the body when implanted therein such that the diaphragm electrode is deformable in response to pressure applied thereto by the body). The second pressure sensor portion includes a signal electrode (e.g., wherein the first pressure sensor portion and the second pressure sensor portion are coupled such that a gap is provided between the diaphragm electrode and the signal electrode) and an insulator material. The signal electrode is provided on and in direct contact with the insulator material to electrically isolate the signal electrode such that parasitic capacitance effects on the signal electrode are reduced.

摘要翻译： 一种用于制造这种装置的可植入电容式压力传感器装置和方法包括第一压力传感器部分和第二压力传感器部分。 第一压力传感器部分包括可连接到地面的隔膜电极（例如，当植入其中时，隔膜电极位于身体附近，使得隔膜电极响应于由身体施加到其上的压力而变形）。 第二压力传感器部分包括信号电极（例如，其中第一压力传感器部分和第二压力传感器部分联接成使得在隔膜电极和信号电极之间设置间隙）和绝缘体材料。 信号电极设置在绝缘体材料上并与绝缘体材料直接接触，以使信号电极电隔离，从而减小对寄生电容对信号电极的影响。

公开(公告)号：US20120161305A1

公开(公告)日：2012-06-28

申请号：US12977890

申请日：2010-12-23

申请人： David A. Ruben ,  Michael S. Sandlin

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： H01L23/00 ,  H01L21/50 ,  H01L21/762 ,  H01L21/66

CPC分类号： B32B7/04 ,  B32B17/06 ,  B32B2250/02 ,  B32B2457/00 ,  H01L21/2007 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/0175 ,  Y10T428/13 ,  Y10T428/24562 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

摘要： A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

摘要翻译： 一种方法包括在第一衬底的第一表面上沉积薄膜并将第二衬底的第二表面移动为与薄膜接触，使得薄膜位于第一和第二表面之间。 该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。 此外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。

公开(公告)号：US07886608B2

公开(公告)日：2011-02-15

申请号：US12544342

申请日：2009-08-20

申请人： Kamal Deep Mothilal ,  Michael A. Schugt ,  David A. Ruben ,  Jonathan P. Roberts ,  Clark B. Norgaard ,  Lary R. Larson

发明人： Kamal Deep Mothilal ,  Michael A. Schugt ,  David A. Ruben ,  Jonathan P. Roberts ,  Clark B. Norgaard ,  Lary R. Larson

IPC分类号： G01L9/12

CPC分类号： A61N1/056 ,  A61B5/0215 ,  A61B2562/0247 ,  A61B2562/028 ,  A61B2562/182 ,  A61N1/0573

摘要： An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

摘要翻译： 可植入的压力传感器，其可并入可植入医疗电引线内，包括绝缘侧壁，其包含间隙电容器和集成电路。 压力传感器的绝缘侧壁包括压敏膜部分，并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板 第一电极板并且耦合到集成电路，其通过侧壁耦合到电源触点和接地触点。 导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

公开(公告)号：US07682878B2

公开(公告)日：2010-03-23

申请号：US11877408

申请日：2007-10-23

申请人： David A. Ruben ,  Scott B. Sleeper ,  Peter C. Tortorici

发明人： David A. Ruben ,  Scott B. Sleeper ,  Peter C. Tortorici

IPC分类号： H01L21/44

CPC分类号： H05K3/284 ,  H01L23/24 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2018 ,  H01L2924/00

摘要： An assembly for a circuit board includes a substrate, at least one circuit component formed on the substrate, and a frame. The frame comprises a first substantially planar surface attached to the substrate, and a hole formed through the frame and defined by a wall that surrounds the at least one circuit component. A method of manufacturing the circuit board includes the step of attaching the substantially planar surface of the frame to the substrate in an arrangement in which the at least one circuit component is surrounded by a wall that defines the hole.

摘要翻译： 一种用于电路板的组件包括衬底，形成在衬底上的至少一个电路部件和框架。 框架包括附接到基板的第一基本上平坦的表面，以及穿过框架形成并由围绕至少一个电路部件的壁限定的孔。 一种制造电路板的方法包括将框架的基本上平坦的表面附接到衬底的步骤，其中至少一个电路部件被限定孔的壁包围。

公开(公告)号：US08796109B2

公开(公告)日：2014-08-05

申请号：US12977890

申请日：2010-12-23

申请人： David A. Ruben ,  Michael S. Sandlin

发明人： David A. Ruben ,  Michael S. Sandlin

IPC分类号： H01L23/10 ,  H01L21/20

CPC分类号： B32B7/04 ,  B32B17/06 ,  B32B2250/02 ,  B32B2457/00 ,  H01L21/2007 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/0175 ,  Y10T428/13 ,  Y10T428/24562 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

摘要： A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

摘要翻译： 一种方法包括在第一衬底的第一表面上沉积薄膜并将第二衬底的第二表面移动为与薄膜接触，使得薄膜位于第一和第二表面之间。 该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。 此外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。

公开(公告)号：US20110270099A1

公开(公告)日：2011-11-03

申请号：US13096968

申请日：2011-04-28

申请人： David A. Ruben ,  Michael F. Mattes ,  Jonathan R. Smith

发明人： David A. Ruben ,  Michael F. Mattes ,  Jonathan R. Smith

IPC分类号： A61B5/0402 ,  H01L23/48 ,  A61N1/04 ,  H01L21/762

CPC分类号： H01L24/81 ,  A61B5/00 ,  A61B5/0402 ,  A61N1/375 ,  H01L21/76898 ,  H01L23/564 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13007 ,  H01L2224/13016 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/29111 ,  H01L2224/80896 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83894 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/9205 ,  H01L2224/9212 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/80 ,  H01L2224/81 ,  H01L2924/01028 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/80001 ,  H01L2924/00012

摘要： An implantable medical device (IMD) is disclosed. The IMD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device.

公开(公告)号：US20100314149A1

公开(公告)日：2010-12-16

申请号：US12569431

申请日：2009-09-29

申请人： Paul F. Gerrish ,  Geoffrey Batchelder ,  Andreas Armin Fenner ,  Lary R. Larson ,  Anna J. Malin ,  Michael F. Mattes ,  Tyler Mueller ,  David A. Ruben ,  Larry E. Tyler

发明人： Paul F. Gerrish ,  Geoffrey Batchelder ,  Andreas Armin Fenner ,  Lary R. Larson ,  Anna J. Malin ,  Michael F. Mattes ,  Tyler Mueller ,  David A. Ruben ,  Larry E. Tyler

IPC分类号： H05K5/06

CPC分类号： H05K1/144 ,  H01L23/3107 ,  H01L23/3185 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/80 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/818 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/11 ,  H05K2201/041 ,  Y10T29/49117 ,  Y10T29/49147 ,  H01L2224/05552 ,  H01L2924/00

摘要： Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.

摘要翻译： 气密密封电路装置和使用一个或多个密封部分构造这种装置的方法。

公开(公告)号：US07591185B1

公开(公告)日：2009-09-22

申请号：US12108212

申请日：2008-04-23

申请人： Kamal Deep Mothilal ,  Michael A. Schugt ,  David A. Ruben ,  Jonathan P. Roberts ,  Clark B. Norgaard ,  Lary R. Larson

发明人： Kamal Deep Mothilal ,  Michael A. Schugt ,  David A. Ruben ,  Jonathan P. Roberts ,  Clark B. Norgaard ,  Lary R. Larson

IPC分类号： G01L9/12 ,  A61N1/00

CPC分类号： A61N1/056 ,  A61B5/0215 ,  A61B2562/0247 ,  A61B2562/028 ,  A61B2562/182 ,  A61N1/0573

摘要： An implantable pressure sensor, which may be incorporated within an implantable medical electrical lead, includes an insulative sidewall, which contains a gap capacitor and an integrated circuit. The insulative sidewall of the pressure sensor includes a pressure sensitive diaphragm portion, and the gap capacitor includes a first electrode plate, which is attached to an interior surface of the diaphragm portion of the sidewall, and a second electrode plate, which is spaced apart from the first electrode plate and coupled to the integrated circuit, which is coupled, through the sidewall, to a supply contact and a ground contact. A conductive layer extends over one of the interior surface of the diaphragm portion of the sidewall and an exterior surface of the diaphragm portion; and the conductive layer is coupled to the ground contact to either shield or ground the first electrode plate.

摘要翻译： 可植入的压力传感器，其可并入可植入医疗电引线内，包括绝缘侧壁，其包含间隙电容器和集成电路。 压力传感器的绝缘侧壁包括压敏膜部分，并且间隙电容器包括附接到侧壁的隔膜部分的内表面的第一电极板和与侧壁隔膜部分隔开的第二电极板 第一电极板并且耦合到集成电路，其通过侧壁耦合到电源触点和接地触点。 导电层在侧壁的隔膜部分的内表面和隔膜部分的外表面之一上延伸; 并且所述导电层耦合到所述接地触头以屏蔽或接地所述第一电极板。

公开(公告)号：USD494319S1

公开(公告)日：2004-08-10

申请号：US29183185

申请日：2003-06-06

申请人： David A. Ruben

设计人： David A. Ruben

公开(公告)号：US06717100B2

公开(公告)日：2004-04-06

申请号：US10280965

申请日：2002-10-25

申请人： David A. Ruben

发明人： David A. Ruben

IPC分类号： B23K2620

CPC分类号： H01L24/85 ,  B23K26/22 ,  B23K26/40 ,  B23K2101/32 ,  B23K2101/38 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/26 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/45655 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/40252 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/0002

摘要： An apparatus and method are provided for using laser energy in an automated bonding machine to effect laser welding of ribbons and other connectors, particularly conductive ribbons in microelectronic circuits. The apparatus and method allow bonding and connection of microelectronic circuits with discrete heating avoiding heat damage to peripheral microelectronic components. The apparatus and method also allow bonding of flexible materials and low-resistance materials, and are less dependant on substrate and terminal stability in comparison to existing bonding methods. The bonding method leads to decreased apparatus wear in comparison to existing bonding methods.

摘要翻译： 提供了一种在自动焊接机中使用激光能量来实现丝带和其它连接器，特别是微电子电路中的导电带的激光焊接的装置和方法。 该装置和方法允许微电子电路与分立加热的结合和连接，避免对外围微电子部件的热损伤。 该装置和方法还允许柔性材料和低电阻材料的结合，并且与现有的结合方法相比较，其对衬底和端子稳定性的依赖性较小。 与现有的接合方法相比，接合方法导致设备磨损降低。