-
公开(公告)号：US20190123253A1
公开(公告)日：2019-04-25
申请号：US16222581
申请日：2018-12-17
Applicant: NICHIA CORPORATION
Inventor： Masato FUJITOMO , Hiroto TAMAKI , Shinji NISHIJIMA , Yuichiro TANDA , Tomohide MIKI
Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
-
公开(公告)号：US20180040583A1
公开(公告)日：2018-02-08
申请号：US15784639
申请日：2017-10-16
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L24/97 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2224/16225 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.
-
公开(公告)号：US20170229628A1
公开(公告)日：2017-08-10
申请号：US15494863
申请日：2017-04-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Yoshitaka BANDO , Hiroto TAMAKI
CPC classification number: H01L23/49537 , H01L21/4828 , H01L23/49503 , H01L23/49544 , H01L23/49551 , H01L23/49562 , H01L23/49582 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device includes a resin package and a light emitting element. The resin package has a cavity. The resin package includes first and second lead portions and a resin member. The first lead portion includes a first lead side surface and a lead recess portion that extends from the first lead side surface in a direction away from the second lead portion, with a part of the resin member being arranged within the lead recess portion. The light emitting element includes first and second electrodes that respectively face the first and second lead portions. The first electrode includes a first electrode side surface and an electrode recess portion that extends from the first electrode side surface in a direction away from the second electrode. The electrode recess portion is arranged at a position overlapping the lead recess portion in a plan view.
-
公开(公告)号：US20170120390A1
公开(公告)日：2017-05-04
申请号：US15337513
申请日：2016-10-28
Applicant: Laser Systems Inc. , NICHIA CORPORATION
Inventor： Kock Khuen SEET , Masayuki HAYASHIDA , Masakazu SAKAMOTO , Hiroto TAMAKI
IPC: B23K26/382 , B23K26/0622 , B23K26/402 , B23K26/082
CPC classification number: B23K26/382 , B23K26/0622 , B23K26/082 , B23K26/18 , B23K26/402 , B23K2103/10 , B23K2103/12 , B23K2103/42 , H05K3/0035 , H05K2201/09127 , H05K2203/0554
Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.
-
公开(公告)号：US20160049388A1
公开(公告)日：2016-02-18
申请号：US14928009
申请日：2015-10-30
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI , Hiroto TAMAKI , Tadaaki MIYATA
IPC: H01L25/075 , H01L33/60 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
Abstract translation: 发光装置可以包括基板，固定到基板的电线和安装到电线的多个发光二极管。 根据一个实施例，多个发光二极管中的每一个是LED芯片，并且基板上的发光二极管被一个或多个密封构件单独地或共同地密封。 根据另一实施例，基板具有多个通孔，其中设置在基板的背面侧的电线的多个部分与基板的表面侧在基板的多个通孔处连通 并且其中多个发光二极管分别安装到与基板的前表面侧连通的电线的各个部分。 其他实施例涉及制造发光器件的方法。
-
Patent Agency Ranking
公开(公告)号：US20150340574A1
公开(公告)日：2015-11-26
申请号：US14718098
申请日：2015-05-21
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI
CPC classification number: H01L33/507 , H01L24/97 , H01L33/505 , H01L33/54 , H01L2224/16 , H01L2924/181 , H01L2933/0041 , H01L2933/005 , H01L2924/00012
Abstract: The light emitting device is manufactured by processing that includes forming encapsulating member at least on the upper surface and upper surface perimeter of a light emitting element, removing at least the part of the encapsulating member that is on upper surface of the light emitting element and form a cavity with a perimeter that surrounds the light emitting element, and forming a wavelength-conversion layer inside the cavity to convert the wavelength of light emitted from the light emitting element.
Abstract translation: 发光器件通过包括至少在发光元件的上表面和上表面周边形成封装元件的处理来制造，至少去除位于发光元件的上表面上的封装元件的至少一部分并形成 具有围绕所述发光元件的周边的空腔，以及在所述空腔内部形成波长转换层，以转换从所述发光元件发射的光的波长。
-
公开(公告)号：US20150295146A1
公开(公告)日：2015-10-15
申请号：US14747640
申请日：2015-06-23
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/153 , H01L33/20 , H01L33/32 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2924/01078 , H01L2933/0041
Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.
Abstract translation: 发光器件包括至少一个半导体发光元件和形成在半导体发光元件的表面上的波长转换层，该波长转换层包括含有波长转换元件的树脂层，该波长转换元件用于转换从 半导体发光元件。 波长转换层覆盖半导体发光元件的上表面或上表面和侧表面。 树脂层中包含波长转换构件的无机材料或包含波长转换构件和无机填料的无机材料的含量为30质量％以上且99质量％以下。
-
公开(公告)号：US20150207046A1
公开(公告)日：2015-07-23
申请号：US14561626
申请日：2014-12-05
Applicant: NICHIA CORPORATION
Inventor： Takeshi IKEGAMI , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/502 , H01L33/486 , H01L33/501 , H01L33/505 , H01L33/508 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and reducing unevenness in light distribution color, and a method of manufacturing the same. A light emitting device 100 includes a light emitting element 20 with a supporting body which is composed of a semiconductor light emitting element 1 and a supporting body 10, and a phosphor layer 7 which continuously covers an upper surface and side surfaces of the semiconductor light emitting element 1, and side surfaces of the supporting body 10. The phosphor layer 7 is configured such that at least a lower portion of the side surface of the supporting body 10 is thinner than the upper surface and the side surface of the semiconductor light emitting element 1. Such a configuration of the phosphor layer can be formed by applying a spray-coating of a slurry containing phosphor particles and a thermosetting resin in a solvent on the semiconductor light emitting element 1 side of the light emitting element 20 which has the supporting body.
Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并减少分布颜色不均匀的发光器件及其制造方法。 发光器件100包括具有由半导体发光元件1和支撑体10构成的支撑体的发光元件20和连续地覆盖半导体发光元件1和支撑体10的上表面的发光元件20和发射 元件1和支撑体10的侧表面。荧光体层7被构造成使得支撑体10的侧表面的至少下部比半导体发光元件的上表面和侧表面更薄 荧光体层的这种构造可以通过在具有支撑体的发光元件20的半导体发光元件1侧上施加含有荧光体颗粒和热固性树脂的浆料的喷涂而形成 。
-
公开(公告)号：US20140061684A1
公开(公告)日：2014-03-06
申请号：US14015171
申请日：2013-08-30
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI , Hiroto TAMAKI , Tadaaki MIYATA
IPC: H01L33/62
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A light-emitting device may comprise a substrate, an electric wire fixed to the substrate, and a plurality of light-emitting diodes mounted to the electric wire. According to one embodiment, each of the plurality of light-emitting diodes is an LED chip, and the light-emitting diodes on the substrate are sealed individually or collectively by one or more sealing members. According to another embodiment, the substrate has a plurality of through holes, wherein a plurality of portions of the electric wire provided on a rear surface side of the substrate communicates with a front surface side of the substrate at the plurality of through holes of the substrate, and wherein the plurality of light-emitting diodes is respectively mounted to the respective portions of the electric wire that communicate with the front surface side of the substrate. Other embodiments relate to methods of manufacturing a light-emitting device.
Abstract translation: 发光装置可以包括基板，固定到基板的电线和安装到电线的多个发光二极管。 根据一个实施例，多个发光二极管中的每一个是LED芯片，并且基板上的发光二极管被一个或多个密封构件单独地或共同地密封。 根据另一实施例，基板具有多个通孔，其中设置在基板的背面侧的电线的多个部分与基板的表面侧在基板的多个通孔处连通 并且其中多个发光二极管分别安装到与基板的前表面侧连通的电线的各个部分。 其他实施例涉及制造发光器件的方法。
-
公开(公告)号：US20130181236A1
公开(公告)日：2013-07-18
申请号：US13739802
申请日：2013-01-11
Applicant: Nichia Corporation
Inventor： Hiroto TAMAKI , Eiko Minato , Takahiro Tani
IPC: H01L33/56
CPC classification number: H01L33/56 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting device has a base comprising at least one pair of leads having a silver-containing layer on their surfaces and being secured by a resin molded body, a light emitting element mounted on said leads, a protective film made of an inorganic material that covers the upper surface of said base, and a sealing resin disposed on the base surface via said protective film. The sealing resin has a first resin that covers said light emitting element, and a second resin having a higher hardness than said first resin that covers the boundaries between said resin molded body and said leads.
Abstract translation: 一种发光器件具有包括在其表面上具有含银层的至少一对引线并由树脂成型体固定的基体，安装在所述引线上的发光元件，由无机材料制成的保护膜， 覆盖所述基座的上表面，以及通过所述保护膜设置在基底表面上的密封树脂。 密封树脂具有覆盖所述发光元件的第一树脂和具有比覆盖所述树脂成型体和所述引线之间的边界的所述第一树脂更高的硬度的第二树脂。
-
-
-
-
-
-
-
-
-
Search Results
53
records
(took 0.031 seconds)
