公开(公告)号：US20160133809A1

公开(公告)日：2016-05-12

申请号：US14933208

申请日：2015-11-05

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/60 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/0095 ,  H01L33/56 ,  H01L2224/83191 ,  H01L2224/95 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A method for manufacturing a light emitting device, includes a first step of mounting a light emitting element on a support base with a bump; and a second step of clamping the support base and the light emitting element and pressing between a lower molding die and an upper molding die to plastically deform the bump, and injecting the compound of a cover member into a mold cavity between the lower molding die and the upper molding die and curing the compound to form the cover member that covers at least a lower surface of the light emitting element after the first step.

Abstract translation: 一种制造发光器件的方法，包括：将第一步骤用凸块安装在支撑基座上的发光元件; 以及第二步骤，夹持支撑基座和发光元件并在下模具和上模具之间挤压以使凸起塑性变形，并将盖构件的化合物注入到下模具和下模具之间的模腔中 上模制模具并固化该化合物以形成在第一步骤之后覆盖发光元件的至少下表面的覆盖构件。

公开(公告)号：US20150028373A1

公开(公告)日：2015-01-29

申请号：US14339534

申请日：2014-07-24

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Masafumi KURAMOTO ,  Masaki HAYASHI

IPC: H01L33/50 ,  H01L33/58

CPC classification number: H01L33/56 ,  H01L21/02565 ,  H01L21/02601 ,  H01L23/28 ,  H01L27/322 ,  H01L33/50 ,  H01L33/52 ,  H01L51/5268 ,  H01L51/5275 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element configured to emit visible light; a fluorescent substance excited by light from the light emitting element and configured to emit visible light; a translucent member containing a translucent base material, which provided on the fluorescent substance or configured to contain the fluorescent substance, and provided on the light emitting element; and a film provided on an upper surface of the translucent member, and configured as an agglutination of nanoparticles having a different refractive index from the base material.

Abstract translation: 发光器件包括：发光元件，被配置为发射可见光; 由来自发光元件的光激发并被配置为发射可见光的荧光物质; 包含设置在所述荧光体上或配置为容纳所述荧光物质并设置在所述发光元件上的半透明基材的透光性部件; 以及设置在所述半透明构件的上表面上并且被配置为具有与所述基材不同的折射率的纳米颗粒的凝集物的膜。

公开(公告)号：US20200049618A1

公开(公告)日：2020-02-13

申请号：US16598641

申请日：2019-10-10

Applicant: DAICEL CORPORATION ,  NICHIA CORPORATION

Inventor： Yasunobu NAKAGAWA ,  Takeshi YOSHIDA ,  Satoru OGAWA ,  Masafumi KURAMOTO ,  Masahide BANDO

IPC: G01N19/04 ,  H01L33/56 ,  C09J183/06 ,  G01N33/44 ,  C09J183/04

Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.

公开(公告)号：US20190189866A1

公开(公告)日：2019-06-20

申请号：US16216882

申请日：2018-12-11

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Toshifumi IMURA ,  Tomoki TANISADA

IPC: H01L33/50 ,  H01L23/29 ,  H01L33/52 ,  H01L33/56 ,  H01L23/00

CPC classification number: H01L33/508 ,  H01L23/295 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor element, a base body, a conductive adhesive member, and a sealing member. The semiconductor element includes a substrate, a semiconductor element structure provided on the substrate, and p-electrode and n-electrode provided on the semiconductor element structure. The semiconductor element is disposed on the base body. The conductive adhesive member electrically connects the p-electrode and the n-electrode to the base body. The sealing member is provided to cover the semiconductor element on an upper surface of the base body. The conductive adhesive member contains particles selected from a group of (i) surface-treated particles having a particle diameter of 1 nm or more and 100 μm or less and (ii) particles that coexist with a dispersing agent.

公开(公告)号：US20180175253A1

公开(公告)日：2018-06-21

申请号：US15896856

申请日：2018-02-14

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/64 ,  H01L23/00

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20180086950A1

公开(公告)日：2018-03-29

申请号：US15711284

申请日：2017-09-21

Applicant: Nichia Corporation

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09J9/02 ,  C09J171/02 ,  C08K3/08

CPC classification number: C09J9/02 ,  C08K3/08 ,  C08K2003/0806 ,  C09J171/02 ,  C09J2471/00 ,  C09J2483/00

Abstract: Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.

公开(公告)号：US20170283624A1

公开(公告)日：2017-10-05

申请号：US15477868

申请日：2017-04-03

Applicant: NICHIA CORPORATION

Inventor： Teppei KUNIMUNE ,  Masafumi KURAMOTO

IPC: C09D5/24 ,  B22F1/00 ,  B22F9/30 ,  C09D7/12

CPC classification number: C09D5/24 ,  B22F1/0055 ,  B22F1/0074 ,  B22F9/30 ,  B22F2201/03 ,  B22F2201/50 ,  B22F2301/255 ,  B22F2998/10 ,  C09D7/68 ,  H01B1/22

Abstract: There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.

公开(公告)号：US20170229615A1

公开(公告)日：2017-08-10

申请号：US15466268

申请日：2017-03-22

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohisa KISHIMOTO

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

公开(公告)号：US20150295153A1

公开(公告)日：2015-10-15

申请号：US14684468

申请日：2015-04-13

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Toshifumi IMURA ,  Tomoki TANISADA

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50

CPC classification number: H01L33/508 ,  H01L23/295 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The present invention provides a semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed.The semiconductor device (100) of the present invention is a semiconductor device including a base body (10), and a semiconductor element (20) bonded on the base body via an adhesive member (30), wherein the adhesive member (30) contains surface-treated particles (40), or particles (40) that coexist with a dispersing agent, and at least a part of the marginal portion (301) of the adhesive member is a region where the particles (40) are unevenly distributed.

Abstract translation: 本发明提供了一种半导体器件，其中抑制用于将半导体元件接合在基体上的粘合部件的湿扩散。 本发明的半导体装置（100）是具有基体（10）的半导体装置和通过粘接部件（30）与基体接合的半导体元件（20），其中，粘接部件（30） 表面处理颗粒（40）或与分散剂共存的颗粒（40），并且粘合剂构件的边缘部分（301）的至少一部分是颗粒（40）不均匀分布的区域。

公开(公告)号：US20150179537A1

公开(公告)日：2015-06-25

申请号：US14581826

申请日：2014-12-23

Applicant: Nichia Corporation

Inventor： Shuji SHIOJI ,  Masafumi KURAMOTO

IPC: H01L23/15 ,  H01L29/41

CPC classification number: H01L33/60 ,  H01L23/15 ,  H01L29/41 ,  H01L33/46 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/49113 ,  H01L2933/0058 ,  H01L2924/00

Abstract: To provide a semiconductor element that can have the high adhesion between a substrate made of an oxide or the like and a metal film, a semiconductor element includes a substrate made of an oxide, a semiconductor element structure provided on an upper surface of the substrate, and a metal film provided on a lower surface of the substrate, in which the metal film contains nanoparticles made of an oxide.

Abstract translation: 为了提供一种半导体元件，其可以在由氧化物等制成的基板和金属膜之间具有高粘附性，半导体元件包括由氧化物制成的基板，设置在基板的上表面上的半导体元件结构， 以及设置在基板的下表面上的金属膜，其中金属膜含有由氧化物制成的纳米颗粒。