公开(公告)号：US20110199407A1

公开(公告)日：2011-08-18

申请号：US12707827

申请日：2010-02-18

申请人： Satoshi Kaiho ,  Atsushi Kubota ,  Takashi Kado ,  Nobuaki Takahashi

发明人： Satoshi Kaiho ,  Atsushi Kubota ,  Takashi Kado ,  Nobuaki Takahashi

IPC分类号： B41J29/38

CPC分类号： B41J2/175 ,  B41J2/16585 ,  B41J2/17596 ,  B41J2/18 ,  B41J2/2114 ,  B41J3/543 ,  B41J25/003

摘要： The present invention provides, in an image forming apparatus configured to form an image on a recording medium with ejection liquids ejected from plural heads, a technique for enabling easy positioning of the respective plural heads. The image forming apparatus includes: plural heads including a reference head having a positioned section and configured to respectively eject ejection liquids onto a recording medium; a head base having plural head positioning sections on which the plural heads are respectively mounted to be positioned, whereon a reference-head positioning section on which the reference head should be mounted in cooperation with the positioned section of the reference head performs positioning at a degree of freedom of position adjustment lower than that of the other head positioning sections; and a conveying unit configured to convey the recording medium to a position opposed to the head base.

摘要翻译： 本发明提供一种图像形成装置，该图像形成装置被配置为在从多个头部喷出的喷射液体的记录介质上形成图像，能够容易地定位各个头部的技术。 图像形成装置包括：多个头部，包括具有定位部分的参考头部，并且被配置为分别将喷射液体喷射到记录介质上; 具有多个头部定位部分的头部基座，多个头部分别安装在该头部定位部分上，其中与参考头部的定位部分配合地安装参考头部的基准头定位部分以一定程度进行定位 位置调整自由度低于其他头部定位部分的自由度; 以及传送单元，其构造成将记录介质传送到与头部基座相对的位置。

公开(公告)号：US20110076722A1

公开(公告)日：2011-03-31

申请号：US12989600

申请日：2009-04-27

申请人： Nobuaki Takahashi

发明人： Nobuaki Takahashi

IPC分类号： C12P21/00 ,  C07K16/00 ,  C12N15/13 ,  C12N15/63 ,  C12N5/00

CPC分类号： C07K16/468 ,  A61K39/39591 ,  C07K16/2818 ,  C07K16/2878 ,  C07K2317/51 ,  C07K2317/56 ,  C07K2317/622 ,  C07K2317/624 ,  C07K2317/626 ,  C07K2317/64 ,  C07K2319/00

摘要： The present invention relates to a multivalent antibody comprising multiple heavy chain variable regions of antibody linked to each other via a linker comprising an amino acid sequence encoding an immunoglobulin domain or a fragment thereof.

摘要翻译： 本发明涉及包含通过包含编码免疫球蛋白结构域或其片段的氨基酸序列的接头彼此连接的多个抗体重链可变区的多价抗体。

公开(公告)号：US20110027987A1

公开(公告)日：2011-02-03

申请号：US12801458

申请日：2010-06-09

申请人： Nobuaki Takahashi ,  Masahiro Komuro

发明人： Nobuaki Takahashi ,  Masahiro Komuro

IPC分类号： H01L21/445

CPC分类号： C23C18/1651 ,  C23C18/1632 ,  C23C18/32 ,  C23C18/54 ,  H01L21/288 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05556 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment.

摘要翻译： 一种半导体器件的制造方法包括使用无电镀法在半导体衬底上形成多个金属膜的叠层结构。 金属膜的形成包括：使用第一镀槽进行包括还原反应的无电镀处理; 并且仅使用第二镀槽进行取代反应进行化学镀处理。 包括使用第一镀槽进行的还原反应的化学镀处理在遮蔽环境中进行，并且在非遮蔽环境中进行仅使用第二镀槽的取代反应进行的化学镀处理。

公开(公告)号：US07881605B2

公开(公告)日：2011-02-01

申请号：US12073004

申请日：2008-02-28

申请人： Takao Goto ,  Nobuaki Takahashi

发明人： Takao Goto ,  Nobuaki Takahashi

IPC分类号： G03B21/00

CPC分类号： G03B17/48 ,  G03B21/008

摘要： A camera with a built-in projector includes: a camera unit equipped with photographing components including an optical system; and a projector module equipped with a projecting optical system, with an optical axis extending along a longer side of the projector module running substantially parallel to an optical axis of the camera unit extending along a longer side of the camera unit.

摘要翻译： 具有内置投影仪的相机包括：配备有包括光学系统的拍摄部件的相机单元; 以及配备有投影光学系统的投影仪模块，沿着投影仪模块的较长边延伸的光轴基本上平行于相机单元的沿着相机单元的较长边延伸的光轴延伸。

公开(公告)号：US20090302430A1

公开(公告)日：2009-12-10

申请号：US12477178

申请日：2009-06-03

申请人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

发明人： Nobuaki Takahashi ,  Masahiro Komuro ,  Satoshi Matsui

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L21/3205

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13009 ,  H01L2224/131 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/13664 ,  H01L2224/17181 ,  H01L2924/00014

摘要： In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r3 from the circumference of the opening pattern to the central axis of the through-hole is smaller than the distance r1 in the through-hole. By providing the opening pattern, the conductive pattern is exposed at the bottom surface of the through-hole. The bump is located on the back surface side of the substrate, and is formed integrally with the through-electrode.

摘要翻译： 在该半导体装置中，通孔形成在基板上，位于导电图案的下方。 绝缘层位于通孔的底面。 导电图案位于基板的一个表面侧。 开口图案形成在位于通孔和导电图案之间的绝缘层中，其中从开口图案的周边到通孔的中心轴线的距离r3小于通孔中的距离r1 通孔。 通过设置开口图案，导电图案在通孔的底面露出。 凸块位于基板的背面侧，与贯通电极一体形成。

公开(公告)号：US20090164840A1

公开(公告)日：2009-06-25

申请号：US12335854

申请日：2008-12-16

申请人： Shingo Nagai ,  Nobuaki Takahashi ,  Fumitomo Ohsawa

发明人： Shingo Nagai ,  Nobuaki Takahashi ,  Fumitomo Ohsawa

IPC分类号： G06F11/14 ,  G06F12/00 ,  G06F17/30 ,  G06F12/02

CPC分类号： G06F11/1435 ,  G06F11/2074

摘要： There is provided a system including a cluster 11, a cluster 12 and an image server 20. A host 101a constituting the cluster 11 has a root file system 111a used to operate the host 101a in a local disk. The image server 20 has a root file system 221a used to operate the host 101a, and the host 101a virtually construct a root file system 121a by mounting the root file system 221a. When the root file system 111a is varied, the host 101a synchronizes the root file system 111a with the root file system 121a. The same applies to host 102a constituting the cluster 12.

摘要翻译： 提供了包括集群11，集群12和映像服务器20的系统。构成集群11的主机101a具有用于在本地磁盘中操作主机101a的根文件系统111a。 图像服务器20具有用于操作主机101a的根文件系统221a，并且主机101a通过安装根文件系统221a来虚拟地构建根文件系统121a。 当根文件系统111a变化时，主机101a将根文件系统111a与根文件系统121a同步。 这同样适用于构成集群12的主机102a。

公开(公告)号：US20090022619A1

公开(公告)日：2009-01-22

申请号：US12232196

申请日：2008-09-12

申请人： Masahiko Hamada ,  Takahiro Kamo ,  Shuji Okaguchi ,  Nobuaki Takahashi ,  Tetsuya Fukuba

发明人： Masahiko Hamada ,  Takahiro Kamo ,  Shuji Okaguchi ,  Nobuaki Takahashi ,  Tetsuya Fukuba

IPC分类号： C22C38/42 ,  C22C38/04 ,  C22C38/60

CPC分类号： C22C38/12 ,  B23K35/3053 ,  B23K35/36 ,  B23K35/362 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C38/14 ,  C22C38/16

摘要： A steel plate for submerged arc welding having good low temperature toughness at a fusion line vicinity part and a boundary with the base material in HAZ as well as at the base material and the weld metal is provided. The steel plate for submerged arc welding according to the invention contains, by mass, 0.03% to 0.09% C, 1.5% to 2.5% Mn, 0.005% to 0.025% Nb, 0.005% to 0.02% Ti, 0.01% to 0.06% Al, at most 0.0005% B, 0.001% to 0.008% N, at most 0.015% P, at most 0.015% S, and at most 0.006% O, and the balance consists of Fe and impurities. Therefore, the steel plate according to the present invention has good low temperature toughness not only at the fusion line vicinity part and the boundary with a base material in the HAZ but also in the base material and weld metal.

摘要翻译： 提供了一种在熔接线附近部分具有良好的低温韧性并且与HAZ中的基材以及基体材料和焊接金属的边界具有良好低温韧性的钢板。 根据本发明的埋弧焊用钢板以质量计含有0.03％〜0.09％的C，1.5％〜2.5％的Mn，0.005〜0.025％的Nb，0.005〜0.02％的Ti，0.01〜0.06％的Al ，至多0.0005％B，0.001％至0.008％N，至多0.015％P，至多0.015％S和至多0.006％O，余量由Fe和杂质组成。 因此，根据本发明的钢板不仅在熔接线附近部分和与HAZ中的基材的边界以及基材和焊接金属中具有良好的低温韧性。

公开(公告)号：US06948649B2

公开(公告)日：2005-09-27

申请号：US10247373

申请日：2002-09-20

申请人： Nobuaki Takahashi ,  Akio Yamamoto ,  Tomoaki Ikeda ,  Tetsuya Fukuba

发明人： Nobuaki Takahashi ,  Akio Yamamoto ,  Tomoaki Ikeda ,  Tetsuya Fukuba

IPC分类号： B21C37/08 ,  B21C37/30 ,  C21D7/12 ,  C22C38/00 ,  C22C38/58 ,  B23K31/02 ,  B21D35/00 ,  C21D9/08

CPC分类号： C21D7/12 ,  B21C37/0811 ,  B21C37/30 ,  C21D2211/002 ,  C21D2211/008

摘要： The high yield ratio problem intrinsic in high-strength steel pipes is solved and a method of producing a steel pipe, while securing the pipe roundness is provided. A steel pipe produced from a steel plate by forming and welding is subjected to 0.3 to 1.2% of expansion and then to 0.1 to 1.0% of reduction. The steel pipe produced by this method has a structure in which martensite and/or bainite accounts for more than 80% as expressed in terms of area percentage, and has a yield strength of not lower than 551 MPa and a yield ratio of not higher than 93%. The pipe reduction is desirably carried out at a lower work ratio as compared with the pipe expansion.

摘要翻译： 解决了高强度钢管固有的高屈服比问题，同时确保了管道圆度的确保方法。 通过成形和焊接由钢板制成的钢管的膨胀率为0.3〜1.2％，然后为0.1〜1.0％。 通过该方法制造的钢管具有以面积百分比表示的马氏体和/或贝氏体占80％以上的结构，屈服强度不低于551MPa，屈服比不高于 93％。 与管膨胀相比，希望以较低的加工比进行管道的还原。

公开(公告)号：US20050194694A1

公开(公告)日：2005-09-08

申请号：US11070089

申请日：2005-03-03

申请人： Nobuaki Takahashi

发明人： Nobuaki Takahashi

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07

CPC分类号： H01L25/0657 ,  H01L23/16 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15165 ,  H01L2924/15172 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising the multi-chip stack structure that involves improved degree of freedom in routing arrangement and has reduced thickness is provided. A semiconductor device, comprising: a substrate; a lower semiconductor chip provided on the substrate; an upper semiconductor chip provided on the lower semiconductor chip; and a silicon spacer with a rerouting disposed between the lower semiconductor chip and the upper semiconductor chip, and including a protruding portion protruding farther outward than an outer periphery of the lower semiconductor chip, is provided. Second electrode pads provided on the protruding portion and first electrode pads provided on the lower semiconductor chip are connected via interconnects including through electrodes of the silicon spacer with the rerouting.

摘要翻译： 提供了包括提高了布线布置自由度并且具有减小的厚度的多芯片堆叠结构的半导体器件。 一种半导体器件，包括：衬底; 设置在所述基板上的下半导体芯片; 设置在下半导体芯片上的上半导体芯片; 以及具有布置在下半导体芯片和上半导体芯片之间的重新布线的硅衬垫，并且包括比下半导体芯片的外周更向外突出的突出部分。 设置在突出部分上的第二电极焊盘和设置在下半导体芯片上的第一电极焊盘通过包括通过硅衬垫的电极与重新布线的互连而连接。

公开(公告)号：US06732404B2

公开(公告)日：2004-05-11

申请号：US09730706

申请日：2000-12-06

申请人： Hidetoshi Fukuoka ,  Nobuaki Takahashi

发明人： Hidetoshi Fukuoka ,  Nobuaki Takahashi

IPC分类号： A47L514

CPC分类号： A47L9/0411 ,  A47L9/08 ,  A47L9/246 ,  A47L9/2805 ,  A47L9/2842 ,  A47L9/2889

摘要： Pressurized filtered exhaust air from a motorized fan in a vacuum cleaner body passes on an exhaust path to a floor suction tool. The exhaust air is directed by the floor suction tool generally parallel to the surface to be cleaned to agitate dust and thus to improve cleaning performance. An electric motor in the floor suction tool drives a rotation brush. The exhaust air is also directed toward the rotation brush in the floor suction tool in a direction to add rotation force to the rotation brush. Feeder lines to the electric motor pass through the exhaust path so that the feeder lines are exposed only to filtered air. Passing the feeder lines through the exhaust path avoids the necessity to make special provision for the feeder lines. The exhaust path passes along a hose, and may optionally pass along one or more extension pipes on its way to the floor suction tool.

摘要翻译： 来自真空吸尘器主体的电动风扇的加压过滤的排出空气通过排气通道进入地板抽吸工具。 废气通过地板抽吸工具大致平行于要清洁的表面引导，以搅拌灰尘，从而提高清洁性能。 地板抽吸工具中的电动马达驱动旋转刷。 废气也沿着向旋转刷增加旋转力的方向朝向地板吸引工具中的旋转刷。 馈电线到电动机通过排气路径，使得馈线仅暴露于过滤空气中。 将送料线通过排气通道，避免了对送料线进行特殊处理的必要性。 排气通道沿着软管通过，并且可以可选地沿着一个或多个延伸管道在其到达地板抽吸工具的路上通过。