公开(公告)号：US08347031B2

公开(公告)日：2013-01-01

申请号：US12526620

申请日：2009-04-14

申请人： Yuichi Taguchi ,  Shinichi Hayashi

发明人： Yuichi Taguchi ,  Shinichi Hayashi

IPC分类号： G06F12/00

CPC分类号： G06F3/067 ,  G06F3/0613 ,  G06F3/0635 ,  G06F3/065 ,  G06F3/0664 ,  H04L47/10 ,  H04L47/266 ,  H04L47/30 ,  H04L47/50 ,  H04L49/901 ,  H04L49/9078

摘要： In a storage system in which computers are connected via a network, in order to avoid a state where communication quality is degraded due to poor performance of an apparatus constituting the network, for a transfer data amount, an amount of data sent out from a storage apparatus is suppressed. Moreover, the storage apparatus inhibits a read-ahead process, in accordance with the suppression of the sending out of the data. Furthermore, proper load allocation is realized by migrating a logical storage unit provided by the storage, to another network interface or a second storage apparatus, without changing a configuration of the network.

摘要翻译： 在通过网络连接计算机的存储系统中，为了避免由于构成网络的装置的性能差而导致通信质量下降的状态，对于传输数据量，从存储器发送的数据量 装置被抑制。 此外，存储装置根据发送数据的抑制来禁止预读处理。 此外，通过将由存储器提供的逻辑存储单元迁移到另一网络接口或第二存储装置而实现适当的负载分配，而不改变网络的配置。

公开(公告)号：US08334461B2

公开(公告)日：2012-12-18

申请号：US12262442

申请日：2008-10-31

申请人： Yuichi Taguchi ,  Teruaki Chino ,  Kiyoshi Oi

发明人： Yuichi Taguchi ,  Teruaki Chino ,  Kiyoshi Oi

IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K7/00

CPC分类号： H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/10674 ,  H01L2924/00

摘要： A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.

摘要翻译： 适于安装电子部件的布线板具有以下结构的形式：其中多个布线层一层叠置在一起而隔着绝缘层，并分别通过形成在绝缘层中的通孔相互连接。 在没有形成布线的区域中，通过该结构形成多个开口，在其厚度方向上延伸穿过该结构。 此外，阻焊层分别形成在最外面的布线层上，并且在最外面布线层中的期望位置限定出露出焊盘部分。

公开(公告)号：US20120306262A1

公开(公告)日：2012-12-06

申请号：US13480939

申请日：2012-05-25

申请人： Yuichi Taguchi

发明人： Yuichi Taguchi

IPC分类号： H02J17/00 ,  B60L1/00

CPC分类号： B60L3/00 ,  B60L53/12 ,  B60L2270/147 ,  H02J7/025 ,  H02J50/12 ,  Y02T10/7005 ,  Y02T10/7072 ,  Y02T90/122 ,  Y02T90/14

摘要： A shield device for a resonance type contactless power transmission system that reduces adverse influence on power transmission efficiency without unnecessarily increasing space for installing the shield device is provided. A shield device of the resonance type contactless power transmission system includes cylindrical shield members, which are provided in a power supply unit and a power receiving unit, respectively. The distance between the bottom of the shield member provided in the power supply unit and the primary-side resonance coil and the distance between the bottom of the shield member provided in the power receiving unit and the secondary-side resonance coil are both set to be greater than a distance between the primary-side resonance coil and the secondary-side resonance coil that allows power transmission at the maximum efficiency from the power supply unit to the power receiving unit.

摘要翻译： 提供一种用于谐振型非接触式电力传输系统的屏蔽装置，其减少对电力传输效率的不利影响，而不必增加用于安装屏蔽装置的空间。 谐振式非接触式电力传输系统的屏蔽装置包括分别设置在电源单元和电力接收单元中的圆筒形屏蔽构件。 设置在电源单元中的屏蔽构件的底部与初级侧共振线圈之间的距离以及设置在受电单元和次级侧共振线圈中的屏蔽构件的底部之间的距离都被设定为 大于初级侧共振线圈和次级侧共振线圈之间的距离，其能够以从电源单元到受电单元的最大效率进行电力传输。

公开(公告)号：US20120250977A1

公开(公告)日：2012-10-04

申请号：US13077810

申请日：2011-03-31

申请人： Amit K. Agrawal ,  Yuichi Taguchi ,  Srikumar Ramalingam

发明人： Amit K. Agrawal ,  Yuichi Taguchi ,  Srikumar Ramalingam

IPC分类号： G06K9/00

CPC分类号： G02B17/08 ,  G06T7/514

摘要： A three-dimensional (3D) location of a reflection point of a ray between a point in a scene (PS) and a center of projection (COP) of a camera of a catadioptric system is determined. The catadioptric system is non-central and includes the camera and a reflector, wherein a surface of the reflector is a quadric surface rotationally symmetric around an axis of symmetry. The 3D location of the reflection point is determined based on a law of reflection, an equation of the reflector, and an equation describing a reflection plane defined by the COP, the PS, and a point of intersection of a normal to the reflector at the reflection point with the axis of symmetry.

摘要翻译： 确定场景（PS）中的点与反射折射系统的照相机的投影中心（COP）之间的光线的反射点的三维（3D）位置。 反射折射系统是非中心的，并且包括相机和反射器，其中反射器的表面是围绕对称轴线旋转对称的二次曲面。 反射点的3D位置是基于反射定律，反射器的方程和描述由COP，PS和由反射器的法线在 反射点与对称轴。

公开(公告)号：US08271991B2

公开(公告)日：2012-09-18

申请号：US11970004

申请日：2008-01-07

申请人： Toru Tanaka ,  Yuichi Taguchi ,  Jun Mizuno

发明人： Toru Tanaka ,  Yuichi Taguchi ,  Jun Mizuno

IPC分类号： G06F9/46 ,  G06F13/00

CPC分类号： G06F3/0665 ,  G06F3/061 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/067 ,  G06F11/3433 ,  G06F11/3485

摘要： A method of balancing a load in a computer system having at least one storage system, and a management computer, each of the storage systems having physical disks and a disk controller, the load balancing method including the steps of: setting at least one of the physical disks as a parity group; providing a storage area of the set parity group as at least one logical volumes to the host computer; calculating a logical volume migration time when a utilization ratio of the parity group becomes equal to or larger than a threshold; and choosing, as a data migration source volume, one of the logical volumes included in the parity group that has the utilization ratio equal to or larger than the threshold, by referring to the calculated logical volume migration time, the data migration source volume being the logical volume from which data migrates.

摘要翻译： 一种在具有至少一个存储系统的计算机系统中平衡负载的方法，以及管理计算机，每个存储系统具有物理盘和盘控制器，所述负载平衡方法包括以下步骤： 物理磁盘作为奇偶校验组; 将所述设置的奇偶校验组的存储区域作为至少一个逻辑卷提供给所述主计算机; 当奇偶校验组的利用率变得等于或大于阈值时，计算逻辑卷迁移时间; 并且通过参考所计算的逻辑卷迁移时间，将数据迁移源卷选择为具有等于或大于阈值的利用率的奇偶校验组中包括的逻辑卷之一，数据迁移源卷是 数据迁移的逻辑卷。

公开(公告)号：US08212355B2

公开(公告)日：2012-07-03

申请号：US12760419

申请日：2010-04-14

申请人： Masahiro Sunohara ,  Yuichi Taguchi

发明人： Masahiro Sunohara ,  Yuichi Taguchi

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L21/768 ,  H01L23/48

CPC分类号： H01L23/481 ,  H01L21/6835 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3185 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/6835 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05568 ,  H01L2224/13009 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13025 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2224/13099

摘要： A semiconductor package includes a semiconductor device, and a wiring board where the semiconductor device is mounted. The semiconductor device includes a semiconductor substrate, a piercing electrode configured to pierce the semiconductor substrate and electrically connect the wiring board and the semiconductor device, and a ring-shaped concave part provided so as to surround the piercing electrode, the ring-shaped concave part being configured to open to a wiring board side of the semiconductor substrate.

摘要翻译： 半导体封装包括半导体器件和安装半导体器件的布线板。 半导体器件包括半导体衬底，穿孔电极，其被构造成穿透半导体衬底并电连接布线板和半导体器件;以及环形凹部，其设置成围绕穿刺电极，环形凹部 被配置为向半导体衬底的布线板侧开口。

公开(公告)号：US08134786B2

公开(公告)日：2012-03-13

申请号：US12826823

申请日：2010-06-30

申请人： Yuichi Taguchi ,  Amit K. Agrawal ,  Srikumar Ramalingam

发明人： Yuichi Taguchi ,  Amit K. Agrawal ,  Srikumar Ramalingam

IPC分类号： G02B17/00 ,  G06K9/00 ,  G06F7/60

CPC分类号： G02B17/08 ,  G02B27/0012

摘要： Embodiment of invention discloses a system and a method for determining a three-dimensional (3D) location of a folding point of a ray between a point in a scene (PS) and a center of projection (COP) of a camera of a catadioptric system. One embodiment maps the catadioptric system, including 3D locations of the PS and the COP on a two-dimensional (2D) plane defined by an axis of symmetry of a folding optical element and the PS to produce a conic and 2D locations of the PS and COP on the 2D plane, and determines a 2D location of the folding point on the 2D plane based on the conic, the 2D locations of the PS and the COP. Next, the embodiment determines the 3D location of the folding point from the 2D location of the folding point on the 2D plane.

摘要翻译： 发明的实施方式公开了一种用于确定场景（PS）中的点与反射折射系统的照相机的投影中心（COP）之间的光线的折叠点的三维（3D）位置的系统和方法 。 一个实施例将反射折射系统（包括PS和COP的3D位置）映射在由折叠光学元件和PS的对称轴限定的二维（2D）平面上，以产生PS的圆锥和2D位置， COP在2D平面上，并且基于二次曲线，PS和COP的2D位置来确定2D平面上的折叠点的2D位置。 接下来，该实施例从2D平面上的折叠点的2D位置确定折叠点的3D位置。

公开(公告)号：US08100555B2

公开(公告)日：2012-01-24

申请号：US12851722

申请日：2010-08-06

申请人： Mitsutoshi Higashii ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

发明人： Mitsutoshi Higashii ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

IPC分类号： F21V1/00

CPC分类号： F21V11/16 ,  F21K9/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/16195

摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.

摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。

公开(公告)号：US20110246130A1

公开(公告)日：2011-10-06

申请号：US12751366

申请日：2010-03-31

申请人： Yuichi Taguchi ,  Tim Marks

发明人： Yuichi Taguchi ,  Tim Marks

IPC分类号： G06F17/18 ,  G06F19/00

CPC分类号： B25J9/1694

摘要： Embodiments of the invention disclose a system and a method for determining a pose of a probe relative to an object by probing the object with the probe, comprising steps of: determining a probability of the pose using Rao-Blackwellized particle filtering, wherein a probability of a location of the pose is represented by a location of each particle, and a probability of an orientation of the pose is represented by a Gaussian distribution over orientation of each particle conditioned on the location of the particle, wherein the determining is performed for each subsequent probing until the probability of the pose concentrates around a particular pose; and estimating the pose of the probe relative to the object based on the particular pose.

摘要翻译： 本发明的实施例公开了一种用于通过用探针探测物体来确定探针相对于物体的姿势的系统和方法，包括以下步骤：使用Rao-Blackwellized粒子滤波来确定姿势的概率，其中概率 姿势的位置由每个粒子的位置表示，姿势取向的概率由调整在粒子位置上的每个粒子的取向上的高斯分布表示，其中对每个随后的粒子进行确定 探测到姿势集中在特定姿势周围的概率; 以及基于特定姿势估计探针相对于物体的姿态。

公开(公告)号：US20110227218A1

公开(公告)日：2011-09-22

申请号：US13116623

申请日：2011-05-26

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/498

CPC分类号： H01L23/147 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/85455 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.

摘要翻译： 在用于封装的硅衬底中，设置有通孔，其中填充有用于容纳电子器件的芯片的空腔的底表面的通孔到衬底的背面。 在空腔的底面侧的贯通电极的端部具有与形成包括电子器件的芯片的电路的布线的连接部。 用于封装的硅衬底的特征在于，（1）包括薄膜布线作为布线，并且连接部分被连接到薄膜布线的导体加强和/或（2）引线接合部分被包括为 通过在空腔的底面侧引线接合贯通电极的端部而形成布线和连接部。