公开(公告)号：US20190189605A1

公开(公告)日：2019-06-20

申请号：US16329821

申请日：2017-08-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Leisen ,  Markus Pindl ,  Simon Jerebic

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/52

CPC classification number: H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/62

Abstract: An arrangement includes a carrier; an optoelectronic component arranged on the carrier; and a material arranged on the carrier, wherein the carrier includes at least one structural element that hinders flow of the material in a flow direction, the structural element extends transversely to the flow direction, and the structural element has a rounding radius in a plane perpendicular to the transverse extent of the structural element less than 20 μm.

公开(公告)号：US20190027655A1

公开(公告)日：2019-01-24

申请号：US16037388

申请日：2018-07-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Martin Brandl

IPC: H01L33/50

Abstract: A method produces a plurality of conversion elements including: A) providing a first carrier; B) applying a first element to the first carrier using a first application technique, the first element including a conversion material, the first application technique being different from compression molding; C) applying a second element to the first carrier by a second application technique, the second element including quantum dots, the quantum dots being introduced into a matrix material and being different from the conversion material, the second application technique being molding or compression molding; D) hardening of the matrix material; E) optionally, rearranging the arrangement produced according to step D) to a second carrier; and F) separating so that a plurality of conversion elements are generated.

公开(公告)号：US09966370B2

公开(公告)日：2018-05-08

申请号：US15036794

申请日：2014-10-23

Applicant: OSRAM Opto Semiconductors Gmbh

Inventor： Jürgen Moosburger ,  Markus Pindl ,  Simon Jerebic ,  Frank Singer

IPC: H01L33/48 ,  H01L25/00 ,  H01L33/46 ,  H01L33/60 ,  H01L33/54

CPC classification number: H01L25/50 ,  H01L33/46 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

公开(公告)号：US09865785B2

公开(公告)日：2018-01-09

申请号：US15039303

申请日：2014-11-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  G10L2015/223 ,  H01L24/48 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.

公开(公告)号：US09793442B2

公开(公告)日：2017-10-17

申请号：US15034017

申请日：2014-11-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Gruendl ,  Tobias Gebuhr ,  Markus Pindl

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.

公开(公告)号：US20170243850A1

公开(公告)日：2017-08-24

申请号：US15589427

申请日：2017-05-08

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Thomas BEMMERL ,  Simon Jerebic ,  Markus Pindl

IPC: H01L23/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  H01L25/16 ,  H01L33/32 ,  H01L33/06 ,  H01L23/31 ,  H01L21/56 ,  H01L33/62 ,  H01L33/56

CPC classification number: H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

Abstract: An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.

公开(公告)号：US20150255313A1

公开(公告)日：2015-09-10

申请号：US14436578

申请日：2013-10-14

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Martin Brandl ,  Markus Boss ,  Markus Pindl ,  Simon Jerebic ,  Herbert Brunner ,  Tobias Gebuhr

IPC: H01L21/56 ,  H01L21/78

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.

Abstract translation: 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。

公开(公告)号：US11031531B2

公开(公告)日：2021-06-08

申请号：US16478996

申请日：2018-01-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Markus Pindl

IPC: H01L33/54 ,  H01L33/20 ,  H01L33/48 ,  H01L33/40

Abstract: An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.

公开(公告)号：US10950765B2

公开(公告)日：2021-03-16

申请号：US16491146

申请日：2018-03-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Markus Burger ,  Markus Boss ,  Matthias Lermer

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/00

Abstract: A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.

公开(公告)号：US10937825B2

公开(公告)日：2021-03-02

申请号：US15959425

申请日：2018-04-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Burger ,  Markus Pindl ,  Markus Boss

IPC: H01L27/146 ,  G02B3/08 ,  G02B6/42 ,  G02B6/43 ,  G02B7/02

Abstract: A method of producing an optoelectronic device includes providing an optical element including an optical lens and including a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, and the receptacle section of the frame includes a bearing face at an inner side; inserting an optoelectronic component and a transparent intermediate element into the receptacle space; placing the intermediate element onto the bearing face; and securing the component and the intermediate element to the frame.