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公开(公告)号：US20150102368A1
公开(公告)日：2015-04-16
申请号：US14575913
申请日：2014-12-18
发明人： Ralph Wirth , Alexander Linkov
CPC分类号： H01L25/0753 , H01L27/15 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.
摘要翻译： 光电子部件可用于混合具有不同波长的电磁辐射，特别是在远场中。 光电子部件包括载体。 第一半导体芯片具有用于在第一光谱范围内发射电磁辐射的第一辐射出射表面，并且在载体上设置第二半导体芯片作为用于在第二光谱范围内发射电磁辐射的第二辐射出射表面。 在半导体芯片的远离载体的辐射出射表面上设置漫射层。
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公开(公告)号：US20150097198A1
公开(公告)日：2015-04-09
申请号：US14385116
申请日：2013-02-20
发明人： Stefan Illek , Matthias Sabathil , Alexander Linkov , Thomas Bleicher , Norwin von Malm , Wolfgang Mönch
CPC分类号： H01L33/58 , F21Y2101/00 , F21Y2105/00 , F21Y2115/10 , G02B6/0015 , G02B6/0018 , G02B6/0025 , G02F1/133603 , G02F1/133605 , G02F1/133606 , G02F1/133611 , G02F1/133615 , G02F2001/133607 , H01L25/0753 , H01L33/44 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/644 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： In at least one embodiment, a surface light source includes one or a more optoelectronic semiconductor chips having a radiation main side for generating a primary radiation. A scattering body is disposed downstream of the radiation main side along a main emission direction of the semiconductor chips. The scatting body is designed for scattering the primary radiation. A main emission direction of the scattering body is oriented obliquely with respect to the main emission direction of the semiconductor chip.
摘要翻译： 在至少一个实施例中，表面光源包括具有用于产生主辐射的辐射主侧的一个或多个光电子半导体芯片。 散射体沿着半导体芯片的主发射方向设置在辐射主侧的下游。 散粒体设计用于散射初级辐射。 散射体的主发射方向相对于半导体芯片的主发射方向倾斜取向。
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公开(公告)号：US20150028361A1
公开(公告)日：2015-01-29
申请号：US14376165
申请日：2013-02-08
IPC分类号： H01L31/16 , H01L31/0232 , H01L33/60
CPC分类号： H01L31/16 , H01L31/022408 , H01L31/02325 , H01L31/02327 , H01L33/46 , H01L33/52 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An optoelectronic semiconductor device includes at least one radiation-emitting and/or radiation-receiving semiconductor chip including a radiation passage surface and a mounting surface opposite the radiation passage surface, wherein the mounting surface includes a first electrical contact structure and a second electrical contact structure electrically insulated from the first electrical contact structure, and wherein the radiation passage surface is free of contact structures, a reflective sheath surrounding the at least one semiconductor chip at least in sections, and a protective sheath surrounding the at least one semiconductor chip and/or the reflective sheath at least in sections.
摘要翻译： 光电子半导体器件包括至少一个辐射发射和/或辐射接收半导体芯片，其包括辐射通道表面和与辐射通道表面相对的安装表面，其中安装表面包括第一电接触结构和第二电接触结构 与第一电接触结构电绝缘，并且其中辐射通道表面不具有接触结构，至少部分包围至少一个半导体芯片的反射护套和围绕至少一个半导体芯片的保护护套和/或 反射护套至少在部分。
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公开(公告)号：US20140246690A1
公开(公告)日：2014-09-04
申请号：US14181104
申请日：2014-02-14
摘要： An optoelectronic semiconductor component includes one or more light-emitting diode chips. The light-emitting diode chip has a main radiation side. A diaphragm is arranged downstream of the main radiation side along a main radiation direction of the light-emitting diode chip. The diaphragm is mounted on or in a component housing. The main radiation side has a mean edge length of at least 50 μm. The diaphragm can be switched from light-impervious to light-pervious. The diaphragm comprises precisely one opening region for radiation transmission. The semiconductor component can be used as a flashlight for a mobile image recording device.
摘要翻译： 光电子半导体部件包括一个或多个发光二极管芯片。 发光二极管芯片具有主辐射侧。 沿着发光二极管芯片的主辐射方向在主辐射侧的下游配置隔膜。 隔膜安装在组件外壳上或组件外壳中。 主辐射侧具有至少50μm的平均边缘长度。 隔膜可以从不透光到透光的切换。 隔膜包括精确的一个用于辐射传播的开口区域。 半导体元件可以用作移动图像记录装置的手电筒。
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公开(公告)号：US20130140580A1
公开(公告)日：2013-06-06
申请号：US13750966
申请日：2013-01-25
发明人： Ralph Wirth , Alexander Linkov
IPC分类号： H01L33/30
CPC分类号： H01L25/0753 , H01L27/15 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.
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公开(公告)号：US10580941B2
公开(公告)日：2020-03-03
申请号：US15788645
申请日：2017-10-19
发明人： Michael Binder , Alexander Linkov , Thomas Zeiler , Peter Brick
摘要： An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner. The radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60° and 70° to the mounting face. The base member has a thickness which amounts to at most 250 μm.
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公开(公告)号：US10355174B2
公开(公告)日：2019-07-16
申请号：US15738427
申请日：2016-07-12
发明人： Markus Maute , Lutz Höppel , Jürgen Moosburger , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov , Johannes Baur
IPC分类号： H01L33/20 , H01L33/24 , H01L33/30 , H01L33/38 , H01L33/40 , H01L33/46 , H01L33/60 , H01L33/62
摘要： A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
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公开(公告)号：US20180233634A1
公开(公告)日：2018-08-16
申请号：US15944328
申请日：2018-04-03
CPC分类号： H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
摘要： A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.
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公开(公告)号：US10050022B2
公开(公告)日：2018-08-14
申请号：US15342261
申请日：2016-11-03
发明人： Ralph Wirth , Alexander Linkov
IPC分类号： H01L33/60 , H01L33/56 , H01L33/54 , H01L25/075 , H01L33/50 , H01L27/15 , H01L33/48 , H01L33/58 , H01L33/30 , H01L33/32
摘要： An optoelectronic component for mixing electromagnetic radiation having different wavelengths, for example, for the far field is disclosed. In an embodiment the optoelectronic component includes a carrier, at least one first semiconductor chip arranged on the carrier and having a first radiation exit surface for emitting electromagnetic radiation in a first spectral range and at least one second semiconductor chip arranged on the carrier and having a second radiation exit surface for emitting electromagnetic radiation in a second spectral range, wherein a diffusing layer is arranged on the first and second radiation exit surfaces of the semiconductor chips that face away from the carrier and wherein a reflecting layer is arranged between the first semiconductor chip and the second semiconductor chip, the first and second radiation exit surfaces being free from the reflecting layer at least in regions.
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公开(公告)号：US20180182926A1
公开(公告)日：2018-06-28
申请号：US15738427
申请日：2016-07-12
发明人： Markus Maute , Lutz Höppel , Jürgen Moosburger , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov , Johannes Baur
CPC分类号： H01L33/46 , H01L33/20 , H01L33/24 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2933/0083 , H01L2933/0091
摘要： A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
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