公开(公告)号：US08026603B2

公开(公告)日：2011-09-27

申请号：US11408072

申请日：2006-04-21

申请人： Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

发明人： Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC分类号： H01L23/52

CPC分类号： H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

摘要： An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

摘要翻译： 因此，提供了与柔性包装的互连结构相关的集成电路和制造方法的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US07354178B2

公开(公告)日：2008-04-08

申请号：US11223557

申请日：2005-09-09

申请人： Wei-Kuo Han ,  Ra-Min Tain ,  Chin-Lung Chen ,  Shyi-Ching Liau

发明人： Wei-Kuo Han ,  Ra-Min Tain ,  Chin-Lung Chen ,  Shyi-Ching Liau

IPC分类号： F21V7/00

CPC分类号： F21V7/09 ,  F21Y2115/10 ,  G03B21/2013 ,  G03B21/2033 ,  G03B21/208 ,  Y10S362/80

摘要： A structure of illuminating unit includes a point-like light-emitting device, having an optical axis. An initial-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The point-like light-emitting device is located at the convergent opening end and the optical axis is toward the divergent end for emitting light. The initial-stage conoid-like reflective surface and the optical axis include an initial-stage included angle. A final-stage conoid-like reflective surface has a convergent opening end and a divergent opening end. The convergent opening end of the final-stage conoid-like reflective surface is coupled with the divergent opening end of the initial-stage conoid-like reflective surface. The final-stage conoid-like reflective surface and the optical axis include a final-stage included angle. The initial-stage included angle is larger than the final-stage included angle.

摘要翻译： 照明单元的结构包括具有光轴的点状发光装置。 初级锥形反射面具有收敛的开口端和发散的开口端。 点状发光装置位于会聚开口端，光轴朝向发光端的发散端。 初级锥形反射面和光轴包括初始阶段夹角。 最后阶段的锥形反射表面具有收敛的开口端和发散的开口端。 最终级锥形反射表面的会聚开口端与初始阶段锥形反射表面的发散开口端相连。 最后阶段的锥形反射表面和光轴包括最终级夹角。 初始包角大于最终级夹角。

公开(公告)号：US20070128845A1

公开(公告)日：2007-06-07

申请号：US11408072

申请日：2006-04-21

申请人： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

发明人： Yung-Yu Hsu ,  Chih-Yuan Chen ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC分类号： H01L21/4763 ,  H01L23/48

CPC分类号： H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

摘要： An interconnect structure of an integrated circuit and manufacturing method therefor are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

摘要翻译： 提供了一种集成电路的互连结构及其制造方法，涉及柔性封装的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US08810031B2

公开(公告)日：2014-08-19

申请号：US12982046

申请日：2010-12-30

申请人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

发明人： Chi-Shih Chang ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L23/552 ,  H01L23/60 ,  H01L23/642 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.

摘要翻译： 提供具有堆叠结构的电子设备。 电子设备包括第一电子层，设置在第一电子层上的第二电子层和至少一个柱。 第一电子层具有第一界面，并且包括第一基板和设置在第一基板上的第一装置层。 第一接口位于第一基板和第一器件层之间，并且第一器件层具有与第一接口相对的表面。 该柱布置在第​​一器件层中，并且从第一界面延伸到第一器件层的表面。

公开(公告)号：USRE43626E1

公开(公告)日：2012-09-04

申请号：US12859141

申请日：2010-08-18

申请人： Ra-Min Tain ,  Tzong-Che Ho ,  Shyi-Ching Liau

发明人： Ra-Min Tain ,  Tzong-Che Ho ,  Shyi-Ching Liau

IPC分类号： F21V29/00 ,  H01L29/22

CPC分类号： H05B33/0857 ,  F21K9/00 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/67 ,  F21V29/677 ,  F21V29/74 ,  F21Y2107/30 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803

摘要： An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle which is coupled to the lampshade includes heat pipes for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.

摘要翻译： LED灯包括LED芯片，轴和灯罩。 LED芯片安装在轴的表面上。 耦合到灯罩的轴包括用于将由LED芯片产生的热量传递到灯罩外部并获得更好散热的热管。

公开(公告)号：US07948072B2

公开(公告)日：2011-05-24

申请号：US12180360

申请日：2008-07-25

申请人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

发明人： Ra-Min Tain ,  Shu-Ming Chang ,  Shyi-Ching Liau ,  Wei-Chung Lo ,  Rong-Shen Lee ,  Chi-Shih Chang

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/562 ,  H01L25/50 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer-to-wafer stacking having a hermetic structure formed therein is provided. The wafer stacking includes a first wafer, including a first substrate and a first device layer having thereon at least one chip and at least one low-k material layer, a second wafer disposed above the first wafer and having a second substrate, and a closed structure disposed on the at least one chip and arranged inside a cutting edge of the at least one chip, wherein the closed structure is extended from one side of the first device layer far from the first substrate to the other side thereof adjacent to the first substrate.

摘要翻译： 提供了其中形成有密封结构的晶片到晶片堆叠。 晶片堆叠包括第一晶片，其包括第一衬底和其上具有至少一个芯片和至少一个低k​​材料层的第一器件层，设置在第一晶片上方并具有第二衬底的第二晶片，以及闭合 结构设置在所述至少一个芯片上并且布置在所述至少一个芯片的切割边缘内，其中所述封闭结构从所述第一器件层的远离所述第一衬底的一侧延伸到与所述第一衬底相邻的另一侧 。

公开(公告)号：US07586187B2

公开(公告)日：2009-09-08

申请号：US11473271

申请日：2006-06-23

申请人： Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

发明人： Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC分类号： H01L23/04

CPC分类号： H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

摘要翻译： 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US20090156001A1

公开(公告)日：2009-06-18

申请号：US12379223

申请日：2009-02-17

申请人： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuan Cheng

发明人： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuan Cheng

IPC分类号： H01L21/768

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/09909 ,  H01L2924/00

摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

公开(公告)号：US07545039B2

公开(公告)日：2009-06-09

申请号：US11410986

申请日：2006-04-26

申请人： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

发明人： Yung-Yu Hsu ,  Rong-Chang Feng ,  Ra-Min Tain ,  Shyi-Ching Liau ,  Ji-Cheng Lin ,  Shan-Pu Yu ,  Shou-Lung Chen ,  Chih-Yuah Cheng

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/4644 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2201/09909 ,  H01L2924/00

摘要： A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

摘要翻译： 提供一种用于减小通孔应力的结构及其制造方法。 使用栅格结构中的应力块与绝缘材料的主要部分直接接触，具有高的热膨胀系数，使厚度方向上的一个或多个导线或通孔被固定。 因此，由温度加载引起的剪切应力可以被应力块阻挡或吸收。

公开(公告)号：US07375384B2

公开(公告)日：2008-05-20

申请号：US11797789

申请日：2007-05-08

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/385 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.

摘要翻译： 本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。 背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分 平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。