公开(公告)号：US08022530B2

公开(公告)日：2011-09-20

申请号：US12265305

申请日：2008-11-05

申请人： Chao-Wen Shih

发明人： Chao-Wen Shih

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/03912

摘要： A package substrate having an electrically connecting structure are provided. The package substrate include: a package substrate substance with at least a surface having a plurality of electrically connecting pads formed thereon, allowing an insulating protective layer to be formed on the surface of the package substrate substance and the electrically connecting pads and formed with a plurality of openings corresponding in position to the electrically connecting pads so as to expose a portion of the electrically connecting pads, respectively; and a metal layer provided on an exposed portion of the electrically connecting pads, walls of the openings of the insulating protective layer, and a circular portion of the insulating protective layer encircling each of the openings thereof, and provided with a slope corresponding in position to a bottom rim of each of the openings. Accordingly, solder bleeding and short circuits are prevented.

摘要翻译： 提供具有电连接结构的封装基板。 封装基板包括：至少具有形成在其上的多个电连接焊盘的表面的封装基板物质，允许在封装基板物质和电连接焊盘的表面上形成绝缘保护层并形成多个 的开口对应于电连接焊盘的位置，以分别暴露电连接焊盘的一部分; 以及金属层，其设置在所述电连接焊盘的露出部分，所述绝缘保护层的所述开口的壁以及所述绝缘保护层的围绕其每个所述开口的圆形部分，并且设置有对应于 每个开口的底边缘。 因此，防止了焊料渗出和短路。

公开(公告)号：US07964801B2

公开(公告)日：2011-06-21

申请号：US12055546

申请日：2008-03-26

申请人： Chao-Wen Shih

发明人： Chao-Wen Shih

IPC分类号： H05K1/02

CPC分类号： H05K3/389 ,  H05K3/28 ,  H05K3/4644 ,  H05K2203/121 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T428/24917

摘要： A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a metal ion end; and a dielectric layer formed above the reactant and the circuit board, thus forming a metallic bond between the metal ion end of the reactant and the circuit layer and forming a chemical bond between the polymer end of the reactant and the dielectric layer. Owing to enhanced bonding between the dielectric layer and the circuit board, electrical performance of the circuit board structure is improved, and the demand for fine circuits is met.

摘要翻译： 公开了一种电路板结构及其制造方法，包括：电路板，其上具有电路层; 形成在电路层的表面上的反应物，其中反应物是具有聚合物末端和金属离子末端的有机金属聚合物; 以及在反应物和电路板上形成的电介质层，从而在反应物的金属离子端和电路层之间形成金属键，并在反应物的聚合物端和电介质层之间形成化学键。 由于电介质层和电路板之间的接合增强，电路板结构的电气性能得到改善，满足了对精细电路的需求。

公开(公告)号：US09236322B2

公开(公告)日：2016-01-12

申请号：US13444558

申请日：2012-04-11

申请人： Hsien-Wei Chen ,  Chung-Ying Yang ,  Chao-Wen Shih ,  Kai-Chiang Wu

发明人： Hsien-Wei Chen ,  Chung-Ying Yang ,  Chao-Wen Shih ,  Kai-Chiang Wu

IPC分类号： H01L23/34 ,  H01L23/367

CPC分类号： H01L23/367 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81424 ,  H01L2924/014 ,  H01L2924/00014

摘要： Apparatus and methods for forming a heat spreader on a substrate to release heat for a semi-conductor package are disclosed. The apparatus comprises a substrate. A dielectric layer is formed next to the substrate and in contact with a surface of the substrate. A heat spreader is formed next to the substrate and in contact with another surface of the substrate. A passivation layer is formed next to the dielectric layer. A connection pad is placed on top of the passivation layer. The substrate may comprise additional through-silicon-vias. The contact surface between the substrate and the heat spreader may be a scraggy surface. The packaging method further proceeds to connect a chip to the connection pad by way of a connection device such as a solder ball or a bump.

摘要翻译： 公开了一种用于在基板上形成散热器以释放用于半导体封装的热量的装置和方法。 该装置包括基板。 在基板的旁边形成介电层，与基板的表面接触。 散热器形成在基板的旁边并与基板的另一个表面接触。 在电介质层的旁边形成钝化层。 连接焊盘放置在钝化层的顶部。 衬底可以包括另外的通硅通孔。 基板和散热器之间的接触表面可能是肮脏的表面。 包装方法还进一步通过诸如焊球或凸块的连接装置将芯片连接到连接焊盘。

公开(公告)号：US08519537B2

公开(公告)日：2013-08-27

申请号：US12813212

申请日：2010-06-10

申请人： Shin-Puu Jeng ,  Kim Hong Chen ,  Shang-Yun Hou ,  Chao-Wen Shih ,  Cheng-Chieh Hsieh ,  Chen-Hua Yu

发明人： Shin-Puu Jeng ,  Kim Hong Chen ,  Shang-Yun Hou ,  Chao-Wen Shih ,  Cheng-Chieh Hsieh ,  Chen-Hua Yu

IPC分类号： H01L23/13 ,  H01L23/538 ,  H01L23/488

CPC分类号： H01L25/50 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die.

摘要翻译： 提供了使用插入器的3D半导体封装。 在一个实施例中，提供了具有电耦合到插入器的第一侧的第一管芯的插入器和电耦合到插入件的第二侧的第二管芯。 插入器电耦合到诸如封装衬底，高密度互连，印刷电路板等的下面的衬底。 衬底具有腔，使得第二管芯位于腔内。 使用空腔可以允许使用更小的导电凸块，从而允许使用更多数量的导电凸块。 散热器可以放置在空腔内以帮助从第二模具散热。

公开(公告)号：US07948085B2

公开(公告)日：2011-05-24

申请号：US12016593

申请日：2008-01-18

申请人： Chao-Wen Shih ,  Zhao-Chong Zeng

发明人： Chao-Wen Shih ,  Zhao-Chong Zeng

IPC分类号： H05K1/02 ,  H05K3/00 ,  B32B3/10

CPC分类号： H05K3/243 ,  H01L2224/05018 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0577 ,  Y10T428/24273

摘要： A circuit board structure and a fabrication method of the same are disclosed according to the present invention. The circuit board structure includes: a carrier board with at least one surface formed with a circuit layer having electrically connecting pads; a first solder mask formed on the carrier board and the circuit layer and formed with first openings for exposing the electrically connecting pads; and a second solder mask formed on the first solder mask and formed with second openings for exposing the first openings and the electrically connecting pads. The first solder mask is made of a high-insulation photosensitive material characterized by presence or absence of impurities, such as microparticles, to have enhanced fluidity for being filled in the circuit layer, thereby preventing metal ions migration and subsequent metal hypha electricity discharge which might otherwise affect electrical performance, therefore the present invention is applicable to fine circuit fabrication.

摘要翻译： 根据本发明公开了一种电路板结构及其制造方法。 电路板结构包括：承载板，其至少一个表面形成有具有电连接焊盘的电路层; 形成在所述载体板和所述电路层上并形成有用于暴露所述电连接焊盘的第一开口的第一焊料掩模; 以及形成在第一焊料掩模上并形成有用于暴露第一开口和电连接焊盘的第二开口的第二焊料掩模。 第一焊料掩模由高绝缘感光材料制成，其特征在于存在或不存在诸如微粒之类的杂质，以提高填充在电路层中的流动性，从而防止金属离子迁移和随后的金属菌丝放电，这可能 否则会影响电气性能，因此本发明适用于精细电路制造。

公开(公告)号：US20100096750A1

公开(公告)日：2010-04-22

申请号：US12289122

申请日：2008-10-21

申请人： Chao-Wen Shih ,  Ying-Chih Chan

发明人： Chao-Wen Shih ,  Ying-Chih Chan

IPC分类号： H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/421 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09563 ,  H05K2201/09581 ,  H01L2924/00

摘要： A packaging substrate is disclosed, which comprises: a substrate body, wherein a surface thereof has a plurality of conductive pads and a solder mask disposed on the surface and having a plurality of openings to expose the conductive pads; dielectric rings disposed on the inner walls of the openings and extending to parts of the surface of the solder mask surrounding the openings; and metal bumps disposed in the openings and on the conductive pads exposed thereby, and combined with the dielectric rings.

摘要翻译： 公开了一种封装基板，其包括：基板主体，其表面具有多个导电焊盘和布置在该表面上的焊接掩模，并且具有多个开口以暴露导电焊盘; 介质环设置在开口的内壁上并延伸到围绕开口的焊料掩模表面的一部分; 以及金属凸块，其设置在开口中和由此暴露的导电焊盘上，并与介质环组合。

公开(公告)号：US20090308652A1

公开(公告)日：2009-12-17

申请号：US12476977

申请日：2009-06-02

申请人： Chao-Wen Shih

发明人： Chao-Wen Shih

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/243 ,  H05K1/116 ,  H05K3/108 ,  H05K3/3452 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2203/0574

摘要： A package substrate having double-sided circuits and a method of manufacturing the same are proposed. The package substrate includes a core board having a plated through hole, a plurality of first electrical contact pads, and a first solder mask layer formed on the core board. A first wiring layer and a second wiring layer are disposed on two opposite surfaces of the core board, respectively, and electrically connected to the plated through hole. A portion of the first wiring layer is exposed from a first opening formed in the first solder mask layer. The first electrical contact pads are disposed on the exposed portion of the first wiring layer. The top surface of the first electrical contact pads is higher than that of the first wiring layer to thereby allow a semiconductor chip to be mounted on the electrical contact pads for improving electrical connection.

摘要翻译： 提出了具有双面电路的封装基板及其制造方法。 封装基板包括具有电镀通孔的芯板，多个第一电接触焊盘和形成在芯板上的第一焊料掩模层。 第一布线层和第二布线层分别设置在芯板的两个相对的表面上，并且电连接到电镀通孔。 第一布线层的一部分从形成在第一焊料掩模层中的第一开口露出。 第一电接触焊盘设置在第一布线层的露出部分上。 第一电接触焊盘的顶表面高于第一布线层的顶表面，从而允许将半导体芯片安装在电接触焊盘上以改善电连接。

公开(公告)号：US20090065246A1

公开(公告)日：2009-03-12

申请号：US11898103

申请日：2007-09-10

申请人： Chao-Wen Shih

发明人： Chao-Wen Shih

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K3/465 ,  H05K3/0023 ,  H05K3/0035 ,  H05K3/045 ,  H05K2201/0376 ,  Y10T29/49155

摘要： A circuit board disclosed in the present invention includes a core board on which a first circuit layer is placed, wherein the first circuit layer has a plurality of conductive pads; and at least one built-up structure covering the surface of the circuit board, which comprises a dielectric layer, a second circuit layer, and a plurality of conductive vias without being surrounded by annular metal rings. The conductive vias are conducted with the conductive pads of the first circuit layer and the second circuit layer. Besides, the surface of the second circuit layer is in the same height as the surface of the dielectric layer. Also, the present invention provides a method for manufacturing the above-mentioned circuit board structure. Therefore, a circuit board having fine circuits can be formed, and the shape of the circuit can be ensured efficiently. Moreover, electric performances of the circuit board can be improved.

摘要翻译： 本发明公开的电路板包括其上放置有第一电路层的芯板，其中第一电路层具有多个导电焊盘; 以及覆盖电路板的表面的至少一个堆积结构，其包括介电层，第二电路层和多个导电通孔，而不被环形金属环包围。 导电通孔与第一电路层和第二电路层的导电焊盘一起导电。 此外，第二电路层的表面与介电层的表面的高度相同。 此外，本发明提供一种制造上述电路板结构的方法。 因此，可以形成具有精细电路的电路板，并且可以有效地确保电路的形状。 此外，可以提高电路板的电气性能。

公开(公告)号：US20080176035A1

公开(公告)日：2008-07-24

申请号：US12016593

申请日：2008-01-18

申请人： Chao-Wen Shih ,  Zhao-Chong Zeng

发明人： Chao-Wen Shih ,  Zhao-Chong Zeng

IPC分类号： H05K1/02 ,  B32B3/10 ,  H05K3/00

CPC分类号： H05K3/243 ,  H01L2224/05018 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09436 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0577 ,  Y10T428/24273

摘要： A circuit board structure and a fabrication method of the same are disclosed according to the present invention. The circuit board structure includes: a carrier board with at least one surface formed with a circuit layer having electrically connecting pads; a first solder mask formed on the carrier board and the circuit layer and formed with first openings for exposing the electrically connecting pads; and a second solder mask formed on the first solder mask and formed with second openings for exposing the first openings and the electrically connecting pads. The first solder mask is made of a high-insulation photosensitive material characterized by presence or absence of impurities, such as microparticles, to have enhanced fluidity for being filled in the circuit layer, thereby preventing metal ions migration and subsequent metal hypha electricity discharge which might otherwise affect electrical performance, therefore the present invention is applicable to fine circuit fabrication.

摘要翻译： 根据本发明公开了一种电路板结构及其制造方法。 电路板结构包括：承载板，其至少一个表面形成有具有电连接焊盘的电路层; 形成在所述载体板和所述电路层上并形成有用于暴露所述电连接焊盘的第一开口的第一焊料掩模; 以及形成在第一焊料掩模上并形成有用于暴露第一开口和电连接焊盘的第二开口的第二焊料掩模。 第一焊料掩模由高绝缘感光材料制成，其特征在于存在或不存在诸如微粒之类的杂质，以提高填充在电路层中的流动性，从而防止金属离子迁移和随后的金属菌丝放电，这可能 否则会影响电气性能，因此本发明适用于精细电路制造。

公开(公告)号：US20070281557A1

公开(公告)日：2007-12-06

申请号：US11759210

申请日：2007-06-06

申请人： Chao-Wen Shih

发明人： Chao-Wen Shih

IPC分类号： H01R4/02

CPC分类号： H01L21/4853 ,  H01L21/4846 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/13006 ,  H01L2224/13562 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/0367 ,  H05K2201/0391 ,  H05K2201/09381 ,  H05K2201/09436 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05552

摘要： A method of fabricating an electrical connecting structure of a circuit board is disclosed. The method includes: providing a circuit board having a plurality of first and a plurality of second conductive pads; forming on the circuit board a solder mask having a plurality of openings to thereby expose the first and the second conductive pads; forming an metal adhesive layer on the first and the second conductive pads; forming a conductive layer on the circuit board and the metal adhesive layer; forming on the conductive layer a resistive layer, wherein a plurality of openings are formed in the resistive layer to expose the conductive layer on the second conductive pads; forming a metal post by electroplating through the conductive layer on the second conductive pads; removing the resistive layer and the conductive layer covered underneath; and forming a soldering layer on the metal post. This invention discloses a method of forming different connecting elements on a circuit board.

摘要翻译： 公开了一种制造电路板的电连接结构的方法。 该方法包括：提供具有多个第一和多个第二导电焊盘的电路板; 在所述电路板上形成具有多个开口的焊料掩模，从而暴露所述第一和第二导电焊盘; 在第一和第二导电焊盘上形成金属粘合剂层; 在电路板和金属粘合剂层上形成导电层; 在所述导电层上形成电阻层，其中在所述电阻层中形成多个开口以暴露所述第二导电焊盘上的导电层; 通过电镀穿过第二导电焊盘上的导电层形成金属柱; 去除覆盖在下面的电阻层和导电层; 并在金属柱上形成焊接层。 本发明公开了一种在电路板上形成不同连接元件的方法。