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    Method of improving sheet resistivity of printed conductive inks
    24.
    发明授权
    Method of improving sheet resistivity of printed conductive inks 有权
    提高印刷导电油墨的薄层电阻率的方法

    公开(公告)号：US09374907B2

    公开(公告)日：2016-06-21

    申请号：US13925438

    申请日：2013-06-24

    Applicant: XEROX CORPORATION

    Inventor： Gabriel Iftime ,  Yiliang Wu ,  Naveen Chopra ,  Cuong Vong ,  Michael D'Amato ,  Sandra J. Gardner ,  Kurt I. Halfyard ,  Adrien P. Côté

    IPC: B05D5/12 ,  H05K3/12 ,  B05D3/02 ,  B05D3/12 ,  H05K1/09

    CPC classification number: H05K3/1283 ,  B05D3/02 ,  B05D3/12 ,  B05D5/12 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0245 ,  H05K2203/1131 ,  H05K2203/1545

    Abstract: A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

    Abstract translation: 在衬底上形成印刷图案的方法包括：用包含导电材料，热塑性粘合剂和溶剂的导电油墨将图案印刷到基材上，固化印刷图案，并通过将印刷图案馈送通过 熔融体系在约20℃至约130℃的温度下操作，高于热塑性粘合剂的玻璃化转变温度，至少120℃，压力为约50psi至约1500psi， 以及通过熔化系统的进料速率为约1m / min至约100m / min。 该方法可以连续进行。 该方法提高了印刷油墨的薄层电阻率。

    SOLDER MASK INK COMPOSITION
    25.
    发明申请
    SOLDER MASK INK COMPOSITION 有权
    焊膏掩模组合物

    公开(公告)号：US20160060471A1

    公开(公告)日：2016-03-03

    申请号：US14471893

    申请日：2014-08-28

    Applicant: XEROX CORPORATION

    Inventor： Yiliang Wu ,  Bryan A. Nerger

    IPC: C09D11/102 ,  C08K5/06 ,  C09D163/00

    CPC classification number: C09D11/102 ,  C08G59/06 ,  C08G2650/58 ,  C08K5/06 ,  C09D163/00

    Abstract: A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and greater than 30 cps at a shear rate of 495 s−1 and a temperature of 25° C.

    Abstract translation: 公开了一种焊接掩模油墨组合物。 焊料掩模油墨组合物包括环氧树脂; 相对于焊料掩模油墨组合物的总重量为至少20重量％的溶剂; 和任选的非离子表面活性剂。 油墨组合物在剪切速率为10s-1时的粘度小于1000cps，剪切速率为495s -1，温度为25℃时粘度大于30cps。

    Dielectric composition for thin-film transistors
    27.
    发明授权
    Dielectric composition for thin-film transistors 有权
    薄膜晶体管的介电组成

    公开(公告)号：US09058981B2

    公开(公告)日：2015-06-16

    申请号：US14142035

    申请日：2013-12-27

    Applicant: Xerox Corporation

    Inventor： Yiliang Wu ,  Ping Liu ,  Anthony James Wigglesworth ,  Nan-Xing Hu

    IPC: H01B3/18 ,  H01L21/02 ,  H01B3/30 ,  H01B3/42 ,  H01B3/44 ,  H01L51/05 ,  H01B3/46 ,  H01L51/00

    CPC classification number: H01L21/02126 ,  H01B3/306 ,  H01B3/42 ,  H01B3/447 ,  H01B3/46 ,  H01L21/02118 ,  H01L21/02282 ,  H01L51/0036 ,  H01L51/052 ,  H01L51/0545

    Abstract: An electronic device, such as a thin-film transistor, includes a substrate and a dielectric layer formed from a dielectric composition. The dielectric composition includes a dielectric material, a crosslinking agent, and a thermal acid generator. In particular embodiments, the dielectric material comprises a lower-k dielectric material and a higher-k dielectric material. When deposited, the lower-k dielectric material and the higher-k dielectric material form separate phases. The thermal acid generator allows the dielectric layer to be cured at relatively lower temperatures and/or shorter time periods, permitting the selection of lower-cost substrate materials that would otherwise be deformed by the curing of the dielectric layer.

    Abstract translation: 诸如薄膜晶体管的电子器件包括由电介质组合物形成的衬底和电介质层。 电介质组合物包括电介质材料，交联剂和热酸发生剂。 在特定实施例中，介电材料包括较低介电常数材料和较高介电常数材料。 当沉积时，较低k电介质材料和较高介电材料形成分离相。 热酸发生器允许电介质层在相对较低的温度和/或更短的时间段内固化，允许选择否则通过电介质层的固化而变形的较低成本的基底材料。

    METHOD OF FORMING METAL NANOPARTICLE DISPERSION AND DISPERSION FORMED THEREBY
    28.
    发明申请
    METHOD OF FORMING METAL NANOPARTICLE DISPERSION AND DISPERSION FORMED THEREBY 审中-公开
    形成金属纳米颗粒分散体和形成分散体的方法

    公开(公告)号：US20140377457A1

    公开(公告)日：2014-12-25

    申请号：US13925562

    申请日：2013-06-24

    Applicant: Xerox Corporation

    Inventor： Ping Liu ,  Yiliang Wu ,  Anthony James Wigglesworth

    IPC: C09D11/00

    CPC classification number: C09D11/52 ,  B22F1/0022 ,  B22F1/02 ,  B22F3/22 ,  B22F2998/10 ,  C09D11/54 ,  B22F9/24 ,  B22F2003/248

    Abstract: A metal nanoparticle dispersion is made by mixing ingredients. The ingredients comprise a solvent; a plurality of metal nanoparticles, the metal nanoparticles comprising an oxide formed thereon; and a reducing agent. The reducing agent is included in an amount sufficient to react with the oxide to significantly increase a conductivity of a metal film that is formable from the nanoparticle dispersion using a deposition and heating process compared with the conductivity of a metal film formable from the same nanoparticle composition without the reducing agent using the same deposition and heating process. Methods for making the metal nanoparticle dispersion, as well as for making a film from the dispersion, are also disclosed.

    Abstract translation: 通过混合成分制备金属纳米颗粒分散体。 成分包括溶剂; 多个金属纳米颗粒，所述金属纳米颗粒包含在其上形成的氧化物; 和还原剂。 还原剂的含量足以与氧化物反应，以显着提高使用沉积和加热方法从纳米颗粒分散体形成的金属膜的导电性，与可从相同纳米颗粒组合物形成的金属膜的电导率相比较 没有还原剂使用相同的沉积和加热过程。 还公开了制备金属纳米颗粒分散体以及用于从分散体制备薄膜的方法。

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