公开(公告)号：US20080157353A1

公开(公告)日：2008-07-03

申请号：US11618417

申请日：2006-12-29

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/11334 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/83194 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0379 ,  H05K2201/10424 ,  H05K2203/0191 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic device package interconnect for electrically connecting a plurality of substrates is provided. The microelectronic device package interconnect comprises an insulative layer positioned on a substrate, wherein the insulative layer has an opening extending through the insulative layer to the substrate. The microelectronic device package interconnect further comprises solder positioned in the opening.

摘要翻译： 提供了用于电连接多个基板的微电子器件封装互连。 微电子器件封装互连件包括位于衬底上的绝缘层，其中绝缘层具有延伸穿过绝缘层到衬底的开口。 微电子器件封装互连件还包括位于开口中的焊料。

公开(公告)号：US20070170599A1

公开(公告)日：2007-07-26

申请号：US11337985

申请日：2006-01-24

申请人： Masazumi Amagai ,  Masako Watanabe

发明人： Masazumi Amagai ,  Masako Watanabe

IPC分类号： H01L23/48

CPC分类号： H01L23/4985 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/11334 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0191 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A tape for use as a carrier in semiconductor assembly, which has one or more base sheets 101 of polymeric, preferably thermoplastic, material having first (101a) and second (101b) surfaces. A polymeric adhesive film (102, 104) and a foil (103, 105) of different, preferably inert, material are attached to the base sheet on both the first and second surface sides; they thus provide a thickness (120) to the tape. A plurality of holes is formed through the thickness of the tape; the holes are preferably tapered with an angle between about 70° and 80° with the second tape surface. A reflow metal element (301), with a preferred diameter (302) about equal to the tape thickness, is held in each of the holes.

摘要翻译： 用作半导体组件中的载体的胶带，其具有一个或多个具有第一（101a）和第二（101b）表面的聚合物，优选热塑性材料的基片101。 不同的，优选惰性的材料的聚合物粘合膜（102,104）和箔（103,105）在第一和第二表面侧上附着到基片上; 因此它们为带提供厚度（120）。 通过带的厚度形成多个孔; 这些孔优选地与第二带表面以约70°和80°之间的角度渐缩。 具有大约等于带厚度的优选直径（302）的回流金属元件（301）被保持在每个孔中。

公开(公告)号：US20060214314A1

公开(公告)日：2006-09-28

申请号：US11090104

申请日：2005-03-24

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/29

CPC分类号： H05K3/3478 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件（1700），其包括具有轮廓（1711）的工件（1201）和多个接触焊盘（1205）以及具有多个端子焊盘（1702）的外部部分（1701）。 该部件与工件间隔开，端子焊盘分别对准工件接触焊盘。 回流元件（1203）将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料（1204）填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，材料具有基本上与工件的轮廓一致的轮廓（1711），并且基本上没有空隙填充空间（1707）。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。

公开(公告)号：US20050127498A1

公开(公告)日：2005-06-16

申请号：US11050234

申请日：2005-02-03

申请人： Masazumi Amagai ,  Akira Karashima

发明人： Masazumi Amagai ,  Akira Karashima

IPC分类号： H01L21/58 ,  H01L21/68 ,  H01L23/31 ,  H01L23/498 ,  H01L23/34

CPC分类号： H01L21/6836 ,  H01L23/3114 ,  H01L23/4985 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a semiconductor chip having an active and a passive surface, the passive surface adhesively attached to a substrate film by means of a multilayer composite; this composite comprising a metal foil having first and second surfaces and an adhesive layer attached on each of these surfaces. The multilayer composite has an average modulus larger than the modulus of the encapsulating molding compound used in the semiconductor device. By applying the composite to assembling face-up chip-scale devices, stress in solder joints is reduced and solder fatigue life enhanced.

摘要翻译： 一种半导体器件，包括具有有源和无源表面的半导体芯片，所述被动表面借助于多层复合材料粘附到基底膜上; 该复合材料包括具有第一表面和第二表面的金属箔，以及粘合层附着在这些表面的每一个上。 多层复合材料的平均模量大于在半导体器件中使用的封装模塑料的模量。 通过将复合材料应用于面朝上的芯片级装置，焊接点的应力降低，焊料疲劳寿命提高。

公开(公告)号：US06297076B1

公开(公告)日：2001-10-02

申请号：US08234073

申请日：1994-04-28

申请人： Masazumi Amagai ,  Kazuyoshi Ebe ,  Hideo Senoo

发明人： Masazumi Amagai ,  Kazuyoshi Ebe ,  Hideo Senoo

IPC分类号： H01L2144

CPC分类号： H01L23/4951 ,  C08F220/12 ,  C09J7/22 ,  C09J7/38 ,  C09J133/064 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/293 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed is a process for preparing a semiconductor device comprising the steps of adhering a back surface of a wafer, a front surface of which has been formed a circuit, onto the radiation curable adhesive layer, dicing the wafer into chips, rinsing, drying, irradiating the adhesive layer with radiation to cure said adhesive layer, expanding the adhesive sheet if necessary to make the chips apart from each other, then picking up the chips, mounting the picked chips on a lead frame, bonding, and molding to give such a structure that the back surfaces of the chips are partially or wholly in contact with a package molding resin, wherein the radiation curable adhesive layer comprises 100 parts by weight of an acrylic adhesive composed of a copolymer of an acrylic ester and an OH group-containing polymerizable monomer and 50-200 parts by weight of a radiation polymerizable compound having two or more unsaturated bonds, and the radiation curable adhesive layer has an elastic modulus of not less than 1×109 dyn/cm2 after curing by irradiation with radiation.

摘要翻译： 公开了一种制备半导体器件的方法，包括以下步骤：将其前表面形成电路的晶片的背面粘附到辐射固化粘合剂层上，将晶片切割成芯片，漂洗，干燥，照射 具有辐射固化所述粘合剂层的粘合剂层，如果需要，使粘合片膨胀以使芯片彼此分开，然后拾取芯片，将拾取的芯片安装在引线框架上，粘合和模制以形成这样的结构 芯片的后表面部分或全部与封装模制树脂接触，其中辐射固化粘合剂层包含100重量份由丙烯酸酯和含OH基的可聚合单体的共聚物组成的丙烯酸粘合剂 和50-200重量份具有两个或更多个不饱和键的辐射聚合性化合物，并且所述可辐射固化粘合剂层的弹性模量不为 通过辐射照射固化后小于1×10 9 dyn / cm 2。

公开(公告)号：US20110024899A1

公开(公告)日：2011-02-03

申请号：US12510781

申请日：2009-07-28

申请人： Kenji MASUMOTO ,  Masazumi Amagai ,  Masayuki Yoshino ,  Yukio Moriyama

发明人： Kenji MASUMOTO ,  Masazumi Amagai ,  Masayuki Yoshino ,  Yukio Moriyama

IPC分类号： H01L23/498 ,  H01L21/98

CPC分类号： H01L23/5389 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Various embodiments provide semiconductor devices having cavity substrate structures for package-on-package assembly and methods for their fabrication. In one embodiment, the cavity substrate structure can include at least one top interconnect via formed within a top substrate. The top substrate can be disposed over a base substrate having at least one base interconnect via that is not aligned with the top interconnect via. Semiconductor dies can be assembled in an open cavity of the top substrate and attached to a base center portion of the base substrate of the cavity substrate structure. A top semiconductor package can be mounted over the top substrate of the cavity substrate structure.

摘要翻译： 各种实施例提供了具有用于封装封装组件的空腔衬底结构的半导体器件及其制造方法。 在一个实施例中，空腔衬底结构可以包括在顶部衬底内形成的至少一个顶部互连通孔。 顶部衬底可以设置在具有至少一个基部互连的基底衬底上，该衬底不与顶部互连通孔对准。 半导体管芯可以组装在顶部衬底的开放空腔中并且附接到空腔衬底结构的基底衬底的基部中心部分。 顶部半导体封装可以安装在空腔衬底结构的顶部衬底上。

公开(公告)号：US07701071B2

公开(公告)日：2010-04-20

申请号：US11090104

申请日：2005-03-24

申请人： Masako Watanabe ,  Masazumi Amagai

发明人： Masako Watanabe ,  Masazumi Amagai

IPC分类号： H01L23/48

CPC分类号： H05K3/3478 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device (1700), which comprises a workpiece (1201) with an outline (1711) and a plurality of contact pads (1205) and further an external part (1701) with a plurality of terminal pads (1702). This part is spaced from the workpiece, and the terminal pads are aligned with the workpiece contact pads, respectively. A reflow element (1203) interconnects each of the contact pads with its respective terminal pad. Thermoplastic material (1204) fills the space between the workpiece and the part; this material adheres to the workpiece, the part and the reflow elements. Further, the material has an outline (1711) substantially in line with the outline of the workpiece, and fills the space (1707) substantially without voids. Due to the thermoplastic character of the filling material, the finished device can be reworked, when the temperature range for reflowing the reflow elements is reached.

摘要翻译： 一种半导体器件（1700），其包括具有轮廓（1711）的工件（1201）和多个接触焊盘（1205）以及具有多个端子焊盘（1702）的外部部分（1701）。 该部件与工件间隔开，端子焊盘分别对准工件接触焊盘。 回流元件（1203）将每个接触焊盘与其相应的端子焊盘互连。 热塑性材料（1204）填充工件与零件之间的空间; 该材料粘附到工件，部件和回流元件上。 此外，材料具有基本上与工件轮廓相一致的轮廓（1711），并且基本上没有空隙填充空间（1707）。 由于填充材料的热塑性特征，当达到回流元件的温度范围时，可以对成品装置进行再加工。

公开(公告)号：US20070243098A1

公开(公告)日：2007-10-18

申请号：US11578827

申请日：2004-07-29

申请人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

发明人： Tsukasa Ohnishi ,  Tokuro Yamaki ,  Masazumi Amagai ,  Masako Watanabe

IPC分类号： C22C13/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  C22C13/00

摘要： [Problem]Mobile electronic equipment is often dropped during use or transport, and the soldered joints of electronic parts sometimes peel off due to the impact when dropped. In addition, they undergo heat cycles in which internal coils, resistors, and the like generate heat and soldered joints increase in temperature during operation of electronic equipment and cool off during periods of non-use. With a conventional Sn—Ag base lead-free solder, the impact resistance and resistance to heat cycles of minute portions such as solder bumps were not adequate. The present invention provides a lead-free solder alloy, bumps of which have excellent impact resistance and resistance to heat cycles. Means for Solving the Problem The present invention is a lead-free solder alloy comprising 0.1—less than 2.0 mass % of Ag, 0.01-0.1 mass % of Cu, 0.005-0.1 mass % of Zn, and a remainder of Sn, to which Ga, Ge, or P may be added, and to which Ni or Co may be further added.

摘要翻译： [问题]移动电子设备在使用或运输过程中经常掉落，电子部件的焊接接头在掉线时有时会因为冲击而脱落。 此外，它们经历热循环，其中内部线圈，电阻器等产生热量和焊接接头在电子设备操作期间温度升高，并在不使用期间冷却。 使用常规的Sn-Ag基底无铅焊料，耐冲击性和耐冲击等微小部分的热循环不足。 本发明提供一种无铅焊料合金，其具有优异的耐冲击性和耐热循环性。 解决问题的手段本发明是一种无铅焊料合金，其包含0.1质量％以下的Ag，0.01质量％以下的Cu，0.01〜0.1质量％的Cu，0.005〜0.1质量％的Zn和余量的Sn， 可以添加Ga，Ge或P，并且可以进一步添加Ni或Co。

公开(公告)号：US07042070B2

公开(公告)日：2006-05-09

申请号：US10612129

申请日：2003-07-02

申请人： Chee Kiang Yew ,  Masazumi Amagai

发明人： Chee Kiang Yew ,  Masazumi Amagai

IPC分类号： H01L23/495

CPC分类号： H01L23/3142 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for attaching an integrated circuit chip to an organic substrate comprising the steps of providing an integrated circuit chip having an active and a passive surface, said active surface including a protective polymer layer; activating said polymer layer by exposing it to reactive ion etching plasma, thereby increasing the surface roughness and imparting affinity to adhesion; providing an electrically insulating substrate having first and second surfaces; and contacting said second surface of said substrate to said activated polymer layer on said chip, whereby strong adhesion is exerted at the interface between said layer and said substrate, directly attaching said substrate to said chip.

摘要翻译： 一种用于将集成电路芯片附着到有机基板的方法，包括以下步骤：提供具有有源和无源表面的集成电路芯片，所述活性表面包括保护性聚合物层; 通过将其暴露于反应离子蚀刻等离子体来活化所述聚合物层，从而增加表面粗糙度并赋予粘合亲和力; 提供具有第一和第二表面的电绝缘基板; 并使所述基板的所述第二表面与所述芯片上的所述活化聚合物层接触，从而在所述层与所述基板之间的界面处施加强烈的粘附力，将所述基板直接连接到所述芯片上。

公开(公告)号：US06784022B2

公开(公告)日：2004-08-31

申请号：US10120757

申请日：2002-04-11

申请人： Norito Umehara ,  Masazumi Amagai

发明人： Norito Umehara ,  Masazumi Amagai

IPC分类号： H01L2148

CPC分类号： H01L21/6836 ,  H01L23/4334 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A method of producing semiconductor devices including the steps of providing a semiconductor wafer of substantially uniform thickness 22, providing a heat-radiating plate 22, and attaching the heat-radiating plate 20 to the semiconductor wafer. The assembled wafer and heat-radiating plate are diced into individual semiconductor integrated circuits having individual heat radiating plates attached thereto.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：提供基本均匀的厚度的半导体晶片22，提供散热板22，并将散热板20附接到半导体晶片。 将组装的晶片和散热板切割成具有附接到其上的各个散热板的单独的半导体集成电路。