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    Methods for Assembling Electronic Devices With Adhesive
    23.
    发明申请
    Methods for Assembling Electronic Devices With Adhesive 有权
    用粘合剂组装电子设备的方法

    公开(公告)号：US20150282329A1

    公开(公告)日：2015-10-01

    申请号：US14231454

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： John J. Baker

    IPC: H05K3/28 ,  H05K3/30

    CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

    Aligned nanotube bearing composite material
    28.
    发明授权
    Aligned nanotube bearing composite material 有权
    对齐纳米管轴承复合材料

    公开(公告)号：US07534648B2

    公开(公告)日：2009-05-19

    申请号：US11479246

    申请日：2006-06-29

    Applicant: Nachiket Raravikar ,  Ravindra Tanikella

    Inventor： Nachiket Raravikar ,  Ravindra Tanikella

    IPC: H01L21/00

    CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

    Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

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