公开(公告)号：US3717742A

公开(公告)日：1973-02-20

申请号：US3717742D

申请日：1970-06-26

Applicant: CIRCA TRAN INC

Inventor： FOTTLER S

IPC: B23K1/005 ,  H05K1/02 ,  H05K3/34 ,  H05K13/04 ,  B23K1/02

CPC classification number: H05K13/0465 ,  B23K1/0053 ,  H05K1/0212 ,  H05K3/3426 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/09709 ,  H05K2201/10651 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/1581 ,  Y02P70/613

Abstract: The printed circuit board includes a base made of an infrared radiation transparent material and, on one side of the base, electrical conductors. Between the base and the electrical conductors is an infrared radiation-absorbing interface. The interface and the conductors are bonded to the base by pressure and heat or by heating the board with infrared radiation transmitted through the base and onto the interface which converts the infrared radiation to heat to complete the bonding cure cycle. Electronic components having leads shaped as supporting feet may be reflow soldered to the conductors by similarly transmitting infrared radiation through the base onto the interface. The heat required for soldering is then carried by the conductors from the interface to the solder by thermal conduction. The components are not exposed to the infrared radiation, and no shields or special solders are needed to solder the components to the printed circuit board.

Abstract translation: 印刷电路板包括由红外辐射透明材料制成的基座，并且在基座的一侧上是电导体。 在基底和电导体之间是红外辐射吸收界面。 界面和导体通过压力和热量被接合到基座上，或者通过红外辐射加热板，并将红外辐射传递到接口上，将红外辐射转换成热，从而完成粘合固化循环。 具有形状为支撑脚的引线的电子部件可以通过将红外辐射通过基底传输到界面上而被回流焊接到导体。 然后，焊接所需的热量由导体通过导热从界面承载到焊料。 这些部件不暴露于红外辐射，并且不需要屏蔽或特殊焊料来将部件焊接到印刷电路板。

公开(公告)号：US3590348A

公开(公告)日：1971-06-29

申请号：US3590348D

申请日：1969-12-29

Applicant: ERIE TECHNOLOGICAL PROD INC

Inventor： BERTICS JOHN P

IPC: H01G2/06 ,  H05K3/30 ,  H05K3/34 ,  H01G1/00

CPC classification number: H01G2/06 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/2036

Abstract: Ceramic disc capacitors for printed circuit boards having radial leads in the plane of the disc and integral standoff feet between the leads.

公开(公告)号：US3294951A

公开(公告)日：1966-12-27

申请号：US27687763

申请日：1963-04-30

Applicant: UNITED AIRCRAFT CORP

Inventor： OLSON KALMAR O

IPC: B23K1/005 ,  H05K3/34 ,  H05K13/04

CPC classification number: B23K1/0056 ,  H05K3/3421 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2203/044 ,  H05K2203/092 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

公开(公告)号：US3198718A

公开(公告)日：1965-08-03

申请号：US10310461

申请日：1961-04-14

Applicant: LOCKHEED AIRCRAFT CORP

Inventor： QUINN ROSS A

IPC: H01C1/16 ,  H01C7/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01C7/00 ,  H01C1/16 ,  H05K1/167 ,  H05K1/182 ,  H05K3/4046 ,  H05K3/4076 ,  H05K2201/0317 ,  H05K2201/09981 ,  H05K2201/10174 ,  H05K2201/10651 ,  H05K2203/0315

公开(公告)号：US3058037A

公开(公告)日：1962-10-09

申请号：US79380459

申请日：1959-02-17

Applicant: BURROUGHS CORP

Inventor： NAAB GERARD A ,  SARLO JR FRANK J

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K1/0271 ,  H05K1/18 ,  H05K3/3447 ,  H05K2201/068 ,  H05K2201/10522 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/1446

公开(公告)号：US11646157B2

公开(公告)日：2023-05-09

申请号：US17383485

申请日：2021-07-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichiro Tanaka ,  Hiroki Awata

IPC: H01G4/232 ,  H05K1/18 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H05K1/185 ,  H01G4/30 ,  H05K2201/10015 ,  H05K2201/10651

Abstract: A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

公开(公告)号：US20180320832A1

公开(公告)日：2018-11-08

申请号：US15973922

申请日：2018-05-08

Applicant: LEDVANCE GmbH

Inventor： Bernhard Rieder ,  Christoph Strauss ,  Florian Wagner ,  Xiongqiang He

IPC: F21K9/278 ,  H05K1/18

CPC classification number: F21K9/278 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2201/10651

Abstract: A light engine for a tube lamp has a substrate defining a longitudinal direction, having at least three conductive traces extending in the longitudinal direction. At least two of the conductive traces are divided into a plurality of trace sections. The light engine further includes a plurality of semiconductor light emitting elements, each light emitting element having two electric terminals and being arranged perpendicular to the longitudinal direction and electrically connected with a first electric terminal to one of the conductive traces and with a second electric terminal to another one of the conductive traces.

公开(公告)号：US20180310409A1

公开(公告)日：2018-10-25

申请号：US15841324

申请日：2017-12-14

Applicant: BOSJOB COMPANY LTD.

Inventor： Liang-huan WENG ,  Min-hsiang WENG

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  B23K9/10

CPC classification number: H05K1/18 ,  B23K9/1006 ,  H05K1/0263 ,  H05K1/144 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10522 ,  H05K2201/10651 ,  H05K2201/10901

Abstract: A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.

公开(公告)号：US20180263121A1

公开(公告)日：2018-09-13

申请号：US15913094

申请日：2018-03-06

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Sisay Tadele ,  Helmut Hoppe ,  Alexander Dauth ,  Gerd Bräuchle

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01G2/06 ,  H01G2/106 ,  H01G9/06 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09027 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10901 ,  H05K2201/2018 ,  H05K2201/2045

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

公开(公告)号：US09831035B2

公开(公告)日：2017-11-28

申请号：US14529337

申请日：2014-10-31

Applicant: Deere & Company

Inventor： Christopher J. Schmit ,  Neal D. Clements ,  Andrew D. Wieland

IPC: H01G2/08 ,  H01G4/32 ,  H01G4/38 ,  H01G4/228 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G2/08 ,  H01G4/228 ,  H01G4/32 ,  H01G4/38 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2201/10651

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.