公开(公告)号：US20080267488A1

公开(公告)日：2008-10-30

申请号：US11979514

申请日：2007-11-05

Applicant: Yuan-Chi Lin ,  Shih-Fang Lin

Inventor： Yuan-Chi Lin ,  Shih-Fang Lin

IPC: G06K9/00

CPC classification number: G01B11/0608 ,  G01R31/2893

Abstract: An apparatus and a method for monitoring overlapped objects are disclosed. The monitoring apparatus comprises a projection device and a camera for projecting images to a target plane at different angles and shooting the pictures from the target plane. When an object is placed on the target plane, the pictures present the part of the image overlapping the surface of the object for determining whether there are overlapped objects or not.

Abstract translation: 公开了一种用于监视重叠物体的装置和方法。 监视装置包括投影装置和相机，用于以不同的角度将图像投影到目标平面并从目标平面拍摄图像。 当物体放置在目标平面上时，图像呈现与物体表面重叠的部分图像，以确定是否存在重叠物体。

公开(公告)号：US20080243383A1

公开(公告)日：2008-10-02

申请号：US11999310

申请日：2007-12-04

Applicant: Ching-Fang Lin

Inventor： Ching-Fang Lin

IPC: G01C21/16 ,  G01S5/00

CPC classification number: G01C21/165 ,  G01S13/9303 ,  G01S13/94 ,  G01S19/15 ,  G08G5/0078 ,  G08G5/0086 ,  G08G5/045

Abstract: Collision with ground/water/terrain and midair obstacles is one of the common causes of severe aircraft accidents. The various data from the coremicro AHRS/INS/GPS Integration Unit, terrain data base, and object detection sensors are processed to produce collision warning audio/visual messages and collision detection and avoidance of terrain and obstacles through generation of guidance commands in a closed-loop system. The vision sensors provide more information for the Integrated System, such as, terrain recognition and ranging of terrain and obstacles, which plays an important role to the improvement of the Integrated Collision Avoidance System.

Abstract translation: 与地面/水/地形和空中障碍物的碰撞是严重飞机事故的常见原因之一。 处理核心AHRS / INS / GPS集成单元，地形数据库和物体检测传感器的各种数据，以产生碰撞警告音频/视觉消息和碰撞检测，避免地形和障碍物通过生成指导命令， 循环系统。 视觉传感器为集成系统提供了更多的信息，例如地形识别和地形和障碍物的范围，这对改进综合碰撞避免系统起着重要的作用。

公开(公告)号：US20080211075A1

公开(公告)日：2008-09-04

申请号：US11950921

申请日：2007-12-05

Applicant: Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

Inventor： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC: H01L23/04 ,  H01L21/71

CPC classification number: H01L27/14618 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/148 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01028

Abstract: A structure of semiconductor device package having inter-adhesion with gap comprising: a chip with bonding pads and a sensor area embedded into a substrate with die window and inter-connecting through holes, wherein a RDL is formed over the substrate for coupling between the bonding pads and the inter-connecting through holes; a multiple rings (dam bar) formed over the substrate, the RDL, and the bonding pads area except the sensor area; an adhesive glues fill into the space of the multiple ring except the sensor area; and a transparency material bonded on the top of the multiple ring and the adhesive glues, wherein the adhesive glues adhesion between the transparency material and the multiple rings.

Abstract translation: 一种具有间隙的粘合性的半导体器件封装的结构，包括：具有接合焊盘的芯片和嵌入到具有模具窗口和互连通孔的衬底中的传感器区域，其中，RDL形成在衬底上，用于在接合 垫和相互连接的通孔; 形成在基板上的多个环（阻挡条），RDL和除了传感器区域之外的接合焊盘区域; 粘合剂胶水填充到除了传感器区域之外的多个环的空间中; 以及粘合在多个环的顶部上的透明材料和胶粘剂，其中粘合剂胶合透明材料和多个环之间的粘附。

公开(公告)号：US20080197480A1

公开(公告)日：2008-08-21

申请号：US11979104

申请日：2007-10-31

Applicant: Wen-Kun Yang ,  Diann-Fang Lin

Inventor： Wen-Kun Yang ,  Diann-Fang Lin

IPC: H01L23/04 ,  H01L21/00

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/0715 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provides a semiconductor device package with the multi-chips comprising a substrate with a die receiving through hole, a conductive connecting through holes structure and coupled the first contact pads on an upper surface and second contact pads on a lower surface of the substrate through a conductive connecting through holes. A first die having first bonding pads is disposed within the die receiving through hole. A first adhesion material is formed under the die and a second adhesion material is filled in the gap between the die and sidewall of the die receiving though holes of the substrate. Then, a first conductive wire is formed to couple the first bonding pads and the first contact pads. Further, a second die having second bonding pads is attached on the first die. A second conductive wire is formed to couple the second bonding pads and the first contact pads. A plurality of dielectric layer is formed on the first and second bonding wire, the first and second die and the substrate.

Abstract translation: 本发明提供了一种半导体器件封装，其中多芯片包括具有裸片接纳通孔的衬底，导电连接通孔结构，并将上表面上的第一接触焊盘和衬底的下表面上的第二接触焊盘 通过导电连接通孔。 具有第一接合焊盘的第一管芯设置在管芯接收通孔内。 第一粘合材料形成在模具下方，并且第二粘合材料填充在通过基板的孔的模具和模具的侧壁之间的间隙中。 然后，形成第一导线以耦合第一接合焊盘和第一接触焊盘。 此外，具有第二接合焊盘的第二管芯被附接在第一管芯上。 形成第二导线以耦合第二接合焊盘和第一接触焊盘。 在第一和第二接合线，第一和第二管芯和基板上形成多个电介质层。

公开(公告)号：US20080197478A1

公开(公告)日：2008-08-21

申请号：US11677489

申请日：2007-02-21

Applicant: Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu

Inventor： Wen-Kun Yang ,  Diann-Fang Lin ,  Tung-Chuan Wang ,  Hsien-Wen Hsu

IPC: H01L23/043

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a semiconductor device package with the die receiving through hole and connecting through holes structure comprising a substrate with a die receiving through hole, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A die is disposed within the die receiving through hole. A first adhesion material is formed under the die and a second adhesion material is filled in the gap between the die and sidewall of the die receiving though hole of the substrate. Further, a bonding wire is formed to couple and the bonding pads and the first contact pads. A dielectric layer is formed on the bonding wire, the die and the substrate.

Abstract translation: 本发明提供了一种半导体器件封装，其具有管芯接收通孔并且连接通孔结构，该孔结构包括具有管芯接纳通孔的基板，连接通孔结构和上表面上的第一接触焊盘以及下表面上的第二接触焊盘 底物。 模具设置在模具接收通孔内。 第一粘合材料形成在模具下面，第二粘合材料填充在基板的模具和模具的侧壁之间的间隙中。 此外，形成接合线以连接和接合焊盘和第一接触焊盘。 在接合线，芯片和基板上形成电介质层。

公开(公告)号：US20080191335A1

公开(公告)日：2008-08-14

申请号：US11755293

申请日：2007-05-30

Applicant: Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

Inventor： Wen-Kun Yang ,  Jui-Hsien Chang ,  Hsien-Wen Hsu ,  Diann-Fang Lin

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L21/6835 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/16235 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A thick dielectric layer is formed on the die and the substrate except the micro lens, bonding pads and contact pads. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. And core paste is filled into the gap between the die edge and the sidewall of the die through hole of the substrate. A transparent cover is disposed on the die and the thick dielectric layer by adhesion to create a gap between the transparent cover.

Abstract translation: 本发明提供一种封装结构，其包括具有通孔的基板和在其上形成的接触通孔结构，其中端子焊盘形成在接触通孔结构下方，并且接触焊盘形成在 基质。 具有微透镜区域的模具通过粘附设置在模具通孔内。 除了微透镜，接合焊盘和接触焊盘之外，在裸片和基板上形成厚的电介质层。 在芯片和基板上形成引线接合，其中引线接合耦合到管芯和接触焊盘。 并且核芯浆料填充到芯片边缘和基板的管芯通孔的侧壁之间的间隙中。 通过粘合将透明盖设置在模具和厚介电层上，以在透明盖之间产生间隙。

公开(公告)号：US07409290B2

公开(公告)日：2008-08-05

申请号：US11102523

申请日：2005-04-08

Applicant: Ching-Fang Lin

Inventor： Ching-Fang Lin

IPC: G01C21/26 ,  G01C21/00

CPC classification number: G01C21/005 ,  G01C21/165

Abstract: A improved positioning and navigation method and system thereof can substantially solve the problems encountered in global positioning system-only and inertial navigation system-only, such as loss of global positioning satellite signal, sensibility to jamming and spoofing, and inertial solution's drift over time, in which the velocity and acceleration from an inertial navigation processor and an attitude and heading solution from an AHRS processor are used to aid the code and carrier phase tracking of the global positioning system satellite signals, so as to enhance the performance of the global positioning and inertial integration system, even in heavy jamming and high dynamic environments and when the GPS satellite signals are not available.

Abstract translation: 改进的定位和导航方法及其系统可以基本上解决仅在全球定位系统和惯性导航系统中遇到的问题，例如全球定位卫星信号的丢失，干扰和欺骗的敏感度以及随时间推移的惯性解的漂移， 其中使用来自惯性导航处理器的速度和加速度以及来自AHRS处理器的姿态和方向解决方案来辅助全球定位系统卫星信号的码和载波相位跟踪，以便增强全球定位的性能， 惯性集成系统，即使在重型干扰和高动态环境下，以及当GPS卫星信号不可用时。

公开(公告)号：US07357532B2

公开(公告)日：2008-04-15

申请号：US11324457

申请日：2006-01-03

Applicant: Ying-Fang Lin ,  Yueh-Jen Chen

Inventor： Ying-Fang Lin ,  Yueh-Jen Chen

IPC: F21V19/02

CPC classification number: G03B21/2046 ,  G03B21/145

Abstract: A lamp module mounted on a housing is provided. The lamp module includes a lamp and a lamp sleeve. The plane perpendicular to an optical of the lamp has an x-axis direction and a y-axis direction mutually perpendicular to each other. The lamp is mounted within the lamp sleeve, and a positioning piece is formed at one end of the lamp sleeve for mounting the lamp sleeve on the housing. The positioning piece at least includes a first surface and a second surface respectively parallel to the x-axis direction and the y-axis direction. At least one of the first surface and the second surface is equipped with an adjustable apparatus for adjusting the alignment of the lamp by moving the positioning piece along the direction(s) of the x-axis or/and the y-axis. The adjustable apparatus comprises a positioning component, a fastener and an elastic component.

Abstract translation: 提供安装在壳体上的灯模块。 灯模块包括灯和灯套。 垂直于灯的光学的平面具有彼此相互垂直的x轴方向和y轴方向。 灯安装在灯套内，并且定位件形成在灯套的一端，用于将灯套安装在外壳上。 定位片至少包括分别平行于x轴方向和y轴方向的第一表面和第二表面。 第一表面和第二表面中的至少一个装备有可调节装置，用于通过沿x轴或/和y轴的方向移动定位件来调节灯的对准。 可调节装置包括定位部件，紧固件和弹性部件。

公开(公告)号：US07354160B2

公开(公告)日：2008-04-08

申请号：US11563694

申请日：2006-11-28

Applicant: Ying-Fang Lin

Inventor： Ying-Fang Lin

IPC: G03B21/20 ,  G03B21/30

CPC classification number: G03B5/00 ,  G03B21/142 ,  G03B21/28

Abstract: A projector includes illumination optics for providing light beams, a light modulating apparatus for receiving and modulating the light beams provided by the illumination optics, a projection lens for projecting an image of the light beams received from the light modulating apparatus, a first adjusting device for adjusting a position of the illumination optics and adjusting an angle of incidence of the light beams emitted onto the light modulating apparatus, and a second adjusting device for adjusting a position of the projection lens in response to the adjustment of the position of the illumination optics for creating an offset of a position of the image projected by the projection lens.

Abstract translation: 投影仪包括用于提供光束的照明光学装置，用于接收和调制由照明光学装置提供的光束的光调制装置，用于投射从光调制装置接收的光束的图像的投影透镜;第一调节装置， 调节照明光学器件的位置并调节发射到光调制装置上的光束的入射角;以及第二调节装置，用于响应于调节照明光学器件的位置而调整投影透镜的位置， 产生由投影透镜投影的图像的位置的偏移。

公开(公告)号：US20070246811A1

公开(公告)日：2007-10-25

申请号：US11732853

申请日：2007-04-04

Applicant: Fang-Lin Tsai ,  Ho-Yi Tsai ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

Inventor： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Han-Ping Pu ,  Cheng-Hsu Hsiao

IPC: H01L23/02 ,  H01L21/00

CPC classification number: H01L25/105 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01077 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A stack structure of semiconductor packages and a method for fabricating the stack structure are provided. A plurality of electrical connection pads and dummy pads are formed on a surface of a substrate of an upper semiconductor package and at positions corresponding to those around an encapsulant of a lower semiconductor package. Solder balls are implanted to the electrical connection pads and the dummy pads. The upper semiconductor package is mounted on the lower semiconductor package. The upper semiconductor package is electrically connected to the lower semiconductor package by the solder balls implanted to the electrical connection pads, and the encapsulant of the lower semiconductor package is surrounded and confined by the solder balls implanted to the dummy pads. Thereby, the upper semiconductor package is properly and securely positioned on the lower semiconductor package, without the occurrence of misalignment between the upper and lower semiconductor packages.

Abstract translation: 提供半导体封装的堆叠结构以及制造叠层结构的方法。 在上半导体封装的衬底的表面上和与下半导体封装的密封剂周围的位置对应的位置处形成多个电连接焊盘和虚拟焊盘。 将焊球植入电连接焊盘和虚拟焊盘。 上半导体封装安装在下半导体封装上。 上半导体封装通过注入电连接焊盘的焊球电连接到下半导体封装，并且下半导体封装的密封剂被植入到虚拟焊盘中的焊球围绕并限制。 因此，上半导体封装被适当且牢固地定位在下半导体封装上，而不会发生上下半导体封装之间的未对准。