公开(公告)号：US20010018922A1

公开(公告)日：2001-09-06

申请号：US09816707

申请日：2001-03-23

Applicant: Semitool, Inc.

Inventor： Michael Jolley

IPC: B08B003/00 ,  B08B005/00

CPC classification number: H01L21/02074 ,  C23G1/20 ,  H01L21/02063 ,  Y10S134/902

Abstract: In a method for cleaning a copper surface of a semiconductor wafer or article, nitrogen gas is bubbled or dissolved into a strong alkaline solution, displacing dissolved oxygen from the solution. A nitrogen gas environment is provided over the copper surface. The alkaline solution is then applied to the copper surface. The copper etch rate is greatly reduced. The method is useful in removing residual polishing slurry after a chemical-mechanical polishing step, and for removing residues left in via holes after plasma etching.

公开(公告)号：US20040055895A1

公开(公告)日：2004-03-25

申请号：US10667802

申请日：2003-09-22

Applicant: Semitool, Inc.

Inventor： Zhongmin Hu ,  Thomas L. Ritzdorf ,  Lyndon W. Graham

IPC: C25D003/50 ,  C25D007/06 ,  C25D003/56

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract translation: 本发明涉及将贵金属合金沉积到微电子工件上的方法和组合物。 在本发明的一个特定方面，铂金属合金由酸性电镀组合物电化学沉积在工件的表面上。 当与高k电介质材料组合时，电镀组合物可用于电容器结构。

公开(公告)号：US20040040857A1

公开(公告)日：2004-03-04

申请号：US10448982

申请日：2003-05-31

Applicant: Semitool, Inc.

Inventor： Lin Lin Chen ,  Thomas Taylor

IPC: C25D005/02

CPC classification number: H01L21/76843 ,  H01L21/2885 ,  H01L21/76868 ,  H01L21/76873 ,  H01L2221/1089 ,  H05K3/423

Abstract: A process for applying a metallization interconnect structure to a semiconductor workpiece having a barrier layer deposited on a surface thereof is set forth. The process includes the forming of an ultra-thin metal seed layer on the barrier layer. The ultra-thin seed layer having a thickness of less than or equal to about 500 Angstroms. The ultra-thin seed layer is then enhanced by depositing additional metal thereon to provide an enhanced seed layer. The enhanced seed layer has a thickness at all points on sidewalls of substantially all recessed features distributed within the workpiece that is equal to or greater than about 10% of the nominal seed layer thickness over an exteriorly disposed surface of the workpiece.

Abstract translation: 阐述了将金属化互连结构应用于具有沉积在其表面上的阻挡层的半导体工件的方法。 该方法包括在阻挡层上形成超薄金属种子层。 超薄种子层具有小于或等于约500埃的厚度。 然后通过在其上沉积附加金属以提供增强的种子层来增强超薄籽晶层。 增强的种子层在分布在工件内的基本上所有凹陷特征的侧壁上的所有点处具有等于或大于在工件的外部设置表面上的标称种子层厚度的约10％的厚度。

公开(公告)号：US20040040573A1

公开(公告)日：2004-03-04

申请号：US10655210

申请日：2003-09-04

Applicant: Semitool, Inc.

Inventor： Eric Bergman ,  Dana Scranton ,  Eric Lund ,  Worm Lind

IPC: C25F001/00

CPC classification number: B08B3/12 ,  Y10S134/902

Abstract: A system for processing a workpiece includes an inner chamber pivotably supported within an outer chamber. The inner chamber has an opening to allow liquid to drain out. A motor pivots the inner chamber to bring the opening at or below the level of liquid in the inner chamber. As the inner chamber turns, liquid drains out. Workpieces within the inner chamber are supported on a holder or a rotor, which may be fixed or rotating. Multi processes may be performed within the inner chamber, reducing the need to move the workpieces between various apparatus and reducing risk of contamination.

Abstract translation: 用于处理工件的系统包括可枢转地支撑在外室内的内室。 内室具有开口以允许液体排出。 电动机使内腔枢转，使开口处于内腔液面之下或之下。 当内室转动时，液体排出。 内腔内的工件支撑在可固定或旋转的支架或转子上。 多个工艺可以在内腔内执行，减少了在各种装置之间移动工件的需要，并降低了污染的风险。

公开(公告)号：US20030205254A1

公开(公告)日：2003-11-06

申请号：US10420659

申请日：2003-04-21

Applicant: Semitool, Inc.

Inventor： Eric J. Bergman ,  Mignon P. Hess

IPC: B08B003/00

CPC classification number: H01L21/02054 ,  B08B3/02 ,  B08B3/08 ,  B08B7/00 ,  B08B2203/005 ,  B08B2230/01 ,  H01L21/02052 ,  H01L21/6704 ,  Y10S134/902

Abstract: An apparatus for supplying a mixture of a treatment liquid and ozone for treatment of a surface of a workpiece, and a corresponding method are set forth. The preferred embodiment of the apparatus comprises a liquid supply line that is used to provide fluid communication between a reservoir containing the treatment liquid and a treatment chamber housing the workpiece. A heater is disposed to heat the workpiece, either directly or indirectly. Preferably, the workpiece is heated by heating the treatment liquid that is supplied to the workpiece. One or more nozzles accept the treatment liquid from the liquid supply line and spray it onto the surface of the workpiece while an ozone generator provides ozone into an environment containing the workpiece.

Abstract translation: 提供了一种用于提供处理液和臭氧的混合物用于处理工件表面的设备以及相应的方法。 该装置的优选实施例包括液体供应管线，其用于在容纳处理液体的容器和容纳工件的处理室之间提供流体连通。 设置加热器以直接或间接地加热工件。 优选地，通过加热供给到工件的处理液来加热工件。 一个或多个喷嘴接受来自液体供应管线的处理液并将其喷射到工件的表面上，同时臭氧发生器将臭氧加入到包含工件的环境中。

公开(公告)号：US20030188447A1

公开(公告)日：2003-10-09

申请号：US10397946

申请日：2003-03-25

Applicant: Semitool, Inc.

Inventor： Gordon R. Nelson ,  Jeffry A. Davis ,  Raymon F. Thompson ,  Eric J. Bergman

IPC: F26B017/24

CPC classification number: H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S269/903

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

公开(公告)号：US20030102019A1

公开(公告)日：2003-06-05

申请号：US10199998

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Trevor Henke ,  Craig Meuchel ,  Marvin Bernt

IPC: B08B003/00

CPC classification number: H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

Abstract: A centrifugal spray processor for processing semiconductor wafers uses larger numbers of spray nozzles. Each spray nozzle delivers a reduced volume of liquid, to reduce consumption of liquid process chemicals. The nozzles operate at a higher back pressure. The increased number of nozzles, offset nozzle patterns and groupings of nozzles, lower nozzle flow rates, and higher nozzle back pressures, provide improved processing results. The improved spray system may be provided as a retrofit kit.

Abstract translation: 用于处理半导体晶片的离心喷雾处理器使用更大数量的喷嘴。 每个喷嘴可以减少液体的体积，以减少液态工艺化学品的消耗。 喷嘴在较高的背压下工作。 喷嘴数量的增加，喷嘴图案的偏移以及喷嘴的分组，喷嘴流速的降低以及喷嘴背压的提高提供了改进的处理结果。 改进的喷雾系统可以作为改装套件提供。

公开(公告)号：US20030051972A1

公开(公告)日：2003-03-20

申请号：US10199997

申请日：2002-07-19

Applicant: Semitool, Inc.

Inventor： Jeffry Davis

IPC: B65G015/64 ,  B65G021/22 ,  B65G047/22 ,  B65G047/24

CPC classification number: H01L21/67754 ,  H01L21/67057 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707

Abstract: An automated processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress wafers. Immersion and spin process modules are located in the process bay. A process robot moves between the indexer bay and process bay to carry wafers to and from the process modules. The wafers are processed within a carrier, reducing the potential for physical damage to the wafers. The process robot hands the carrier off to a rotor, in the spin process modules, or to an immersion elevator in the immersion module. Both spin and immersion processing are performed within an automated system.

Abstract translation: 自动处理系统具有与清洁空气封闭体内的处理室垂直对准的分度器托架。 索引器托架中的索引器为进行中的工作晶片提供放样或存储。 浸入和旋转工艺模块位于工艺槽中。 过程机器人在分度器托架和过程间隔之间移动，以将晶片运送到过程模块和从过程模块运送晶片。 晶片在载体内进行处理，减少晶片的物理损坏的可能性。 过程机器人将载体关闭到转子，旋转过程模块中，或者浸入浸入式模块中的浸入式电梯。 旋转和浸没处理均在自动化系统中进行。

公开(公告)号：US20030045095A1

公开(公告)日：2003-03-06

申请号：US09880715

申请日：2001-06-12

Applicant: Semitool, Inc.

Inventor： Thomas L. Ritzdorf ,  Lyndon W. Graham ,  Robert W. Batz JR.

IPC: H01L021/44 ,  H01L021/4763

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D5/10 ,  C25D5/18 ,  C25D5/50 ,  C25D7/123 ,  H01L21/76877 ,  H01L21/76883

Abstract: A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed micro-structures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties.

公开(公告)号：US20030002961A1

公开(公告)日：2003-01-02

申请号：US10205158

申请日：2002-07-25

Applicant: Semitool, Inc.

Inventor： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC: B65G049/07

CPC classification number: H01L21/67754 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S134/902 ,  Y10S414/139 ,  Y10S414/14

Abstract: A processor for processing articles, such as semiconductor wafers, includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. An article extraction mechanism adapted to seal with the pod removes articles from the pod without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism adapted to seal with a pod in the interface section. The article insertion mechanism allows insertion of the articles into the pod after processing by at least one processing station.