公开(公告)号：US06426470B1

公开(公告)日：2002-07-30

申请号：US09764464

申请日：2001-01-17

申请人： Donald S. Farquhar ,  Robert M. Japp ,  John M. Lauffer ,  Konstantinos I. Papathomas

发明人： Donald S. Farquhar ,  Robert M. Japp ,  John M. Lauffer ,  Konstantinos I. Papathomas

IPC分类号： H05K111

CPC分类号： H05K3/429 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2201/09645 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method and structure relating to multisegmented plated through holes. A substrate includes a dielectric layer sandwiched between a first laminate layer and a second laminate layer. A through hole is formed through the substrate. The through hole passes through nonplatable dielectric material within the dielectric layer. As a result, subsequent seeding and electroplating of the through hole results in a conductive metal plating forming at a wall of the through hole on a segment of the first laminate layer and on a segment of the second laminate layer, but not on the nonplatable dielectric material of the dielectric layer. Thus, the conductive metal plating is not continuous from the first laminate layer to the second laminate layer.

摘要翻译： 涉及多段电镀通孔的方法和结构。 基板包括夹在第一层叠层和第二层叠层之间的电介质层。 穿过基板形成通孔。 通孔穿过介电层内的不可电介质材料。 结果，随后的通孔的接种和电镀导致在第一层压层的段上的通孔的壁上和第二层压层的段上形成导电金属电镀，而不在不可电绝缘的电介质 电介质层的材料。 因此，导电金属电镀从第一层叠层到第二层叠层不是连续的。

公开(公告)号：US06370012B1

公开(公告)日：2002-04-09

申请号：US09652596

申请日：2000-08-30

申请人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

发明人： Sylvia Adae-Amoakoh ,  John M. Lauffer ,  Michael D. Lowell ,  Voya R. Markovich ,  Joseph J. Sniezek

IPC分类号： H01G4228

CPC分类号： H05K1/053 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/162 ,  H05K3/403 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0919 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y10T29/417 ,  H01L2924/00

摘要： A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

摘要翻译： 能够形成较大的电路板或类似结构的内部部分以提供电容的并联电容器结构。 或者，电容器可以用作互连器以互连两个不同的电子部件（例如，芯片载体，电路板，甚至半导体芯片），同时仍然为一个或多个所述部件提供期望的电容水平。 电容器包括至少一个内部导电层，在内部导体的相对侧上添加两个附加的导体层，以及无机介电材料（优选地，在第二导体层的外表面上的氧化物层或适用于诸如钛酸钡的适当介电材料 第二导体层）。 此外，电容器包括无机介电材料顶部的外部导体层，从而在内部和附加的导电层和外部导体之间形成并联的电容器。

公开(公告)号：US06204453B1

公开(公告)日：2001-03-20

申请号：US09203956

申请日：1998-12-02

申请人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

发明人： Kenneth Fallon ,  Miguel A. Jimarez ,  Ross W. Keesler ,  John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  Irv Memis ,  Jim P. Paoletti ,  Marybeth Perrino ,  John A. Welsh ,  William E. Wilson

IPC分类号： H05K103

CPC分类号： H05K3/44 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09554 ,  H05K2203/0733

摘要： A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials and connected to the vias and plated through holes. A border may be around the board or card including a metal layer terminating in from the edge of one of the dielectric layers. A copper foil is provided with clearance holes. First and second layers of photoimageable curable dielectric material is disposed on opposite sides of the copper which are photoimageable material. The patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. At the clearance holes in the copper, through holes are developed where holes were patterned in both dielectric layers. Thereafter, the surfaces of the photoimageable material, vias and through holes are metalized by copper plating. This is preferably done by protecting the remainder of the circuitry with photoresist and utilizing photolithographic techniques. The photoresist is thereafter removed, leaving a circuit board or card having metalization on both sides, vias extending from both sides to the copper layer in the center, plated through holes connecting the two outer circuitized copper layers.

摘要翻译： 形成印刷电路板或电路卡的方法设置有用作夹在一对可光成像的电介质层之间的电力平面的金属层。 光刻图形金属填充的通孔和光成像的电镀通孔位于光图案化材料中，信号电路位于每个介电材料的表面上，并连接到通孔和电镀通孔。 边界可以在板或卡周围，包括从电介质层之一的边缘终止的金属层。 铜箔上设有间隙孔。 可光成像的可固化介电材料的第一和第二层设置在作为可光成像的材料的铜的相对侧上。 图案在可光成象材料的第一层和第二层上显影，以通过通孔显露金属层。 在铜中的间隙孔处，通孔被开发成在两个电介质层中图案化孔。 此后，可光成像材料，通孔和通孔的表面通过镀铜进行金属化。 这优选通过用光致抗蚀剂和利用光刻技术保护电路的其余部分来实现。 然后去除光致抗蚀剂，留下在两侧具有金属化的电路板或卡，其中心的两侧延伸到铜层，通孔连接两个外部电路化的铜层。

公开(公告)号：US08242376B2

公开(公告)日：2012-08-14

申请号：US12854252

申请日：2010-08-11

申请人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

发明人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

IPC分类号： H05K1/03

CPC分类号： H01L21/4857 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/383 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2203/0353 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12556 ,  Y10T428/12993 ,  H01L2224/0401

摘要： A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

摘要翻译： 其中两个导电层（例如，电镀铜箔）被结合（例如层压）到电介质层的电路化衬底。 物理地结合到电介质的两个箔表面中的每一个是光滑的（例如，优选通过化学处理），并且在其上包括薄的有机层，而两个箔的外表面也是光滑的（例如，优选也使用化学处理 步）。 这些导电层中的一个可以用作接地或电压平面，而另一个可以用作具有多个单独信号线作为其一部分的信号平面。 还提供了使用这种电路化基板的电气组件和信息处理系统。

公开(公告)号：US07977034B1

公开(公告)日：2011-07-12

申请号：US12657394

申请日：2010-01-20

申请人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

发明人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

IPC分类号： H05K3/02 ,  H05K3/06

CPC分类号： H05K3/4641 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/44 ,  H05K3/445 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0143 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

摘要翻译： 使用连续辊式制造电路化基板的装置和方法，其中导体层被馈送到装置中，可光成像电介质层被施加到导体层的相对侧，穿过复合材料形成通孔， 然后在电介质上添加金属层，然后在其中形成图案（例如电路）。 除了这些之外，还进行了几个操作以形成最终终端产品，电路化基板（例如，印刷电路板），同时产品的导体层保持为固体形式，直到与连续层的最终分离 。

公开(公告)号：US20100328868A1

公开(公告)日：2010-12-30

申请号：US12854252

申请日：2010-08-11

申请人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

发明人： John M. Lauffer ,  Voya R. Markovich ,  Michael Wozniak

IPC分类号： H05K5/00 ,  H05K1/18

CPC分类号： H01L21/4857 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/383 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2203/0353 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12556 ,  Y10T428/12993 ,  H01L2224/0401

摘要： A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.

摘要翻译： 其中两个导电层（例如，电镀铜箔）被结合（例如层压）到电介质层的电路化衬底。 物理地结合到电介质的两个箔表面中的每一个是光滑的（例如，优选通过化学处理），并且在其上包括薄的有机层，而两个箔的外表面也是光滑的（例如，优选也使用化学处理 步）。 这些导电层中的一个可以用作接地或电压平面，而另一个可以用作具有多个单独信号线作为其一部分的信号平面。 还提供了使用这种电路化基板的电气组件和信息处理系统。

公开(公告)号：US07841741B2

公开(公告)日：2010-11-30

申请号：US11730404

申请日：2007-04-02

申请人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

发明人： Benson Chan ,  John E. Kozol ,  John M. Lauffer ,  How T. Lin

IPC分类号： F21S4/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21K9/69 ,  F21V29/85 ,  F21W2131/202 ,  F21W2131/205 ,  F21Y2115/10 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/10106

摘要： An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such assemblies may be used within an LED lamp, as also provided herein. The lamp is ideal for use within medical and dental environments to assure optimal light onto a patient located at a specified distance from the lamp.

摘要翻译： 一种LED照明组件，包括安装在公共的可弯曲的散热构件上的多个单独的LED，该散热构件被设计成在操作期间从LED移除热量并且还被形成（弯曲）以提供期望的光的方向和强度。 如本文也提供的，LED灯内可以使用若干这样的组件。 该灯是理想的在医疗和牙科环境中使用，以确保最佳的光照射到距离灯具指定距离的患者。

公开(公告)号：US07827682B2

公开(公告)日：2010-11-09

申请号：US11110920

申请日：2005-04-21

申请人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

发明人： John M. Lauffer ,  Voya R. Markovich ,  James J. McNamara, Jr. ,  Peter A. Moschak

IPC分类号： H05K3/10 ,  G03F7/16

CPC分类号： H05K3/4641 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/427 ,  H05K3/44 ,  H05K3/445 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0143 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.

摘要翻译： 使用连续辊式制造电路化基板的装置和方法，其中导体层被馈送到装置中，可光成像电介质层被施加到导体层的相对侧，穿过复合材料形成通孔， 然后在电介质上添加金属层，然后在其中形成图案（例如电路）。 除了这些之外，还进行了几个操作以形成最终终端产品，电路化基板（例如，印刷电路板），同时产品的导体层保持为固体形式，直到与连续层的最终分离 。

公开(公告)号：US07791897B2

公开(公告)日：2010-09-07

申请号：US12283146

申请日：2008-09-09

申请人： Rabindra N. Das ,  John M. Lauffer ,  Irving Memis ,  Steven G. Rosser

发明人： Rabindra N. Das ,  John M. Lauffer ,  Irving Memis ,  Steven G. Rosser

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K1/023 ,  H05K1/0234 ,  H05K1/167 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T29/4913 ,  Y10T428/12493 ,  Y10T428/24917 ,  Y10T428/31511

摘要： A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

摘要翻译： 多层嵌入式电容和电阻基板芯。 提供至少一层电阻材料。 电阻材料层具有嵌入其中的导电材料层。 在电阻材料层上设置至少一层高介电常数的电容材料层。 通孔由激光形成。

公开(公告)号：US07629559B2

公开(公告)日：2009-12-08

申请号：US11305073

申请日：2005-12-19

申请人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

发明人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

IPC分类号： H05B1/02

CPC分类号： H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

摘要： A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

摘要翻译： 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。