公开(公告)号：US07993969B2

公开(公告)日：2011-08-09

申请号：US11463799

申请日：2006-08-10

申请人： Jens Pohl ,  Michael Bauer

发明人： Jens Pohl ,  Michael Bauer

IPC分类号： H01L25/10 ,  H01L23/40 ,  H01L23/488 ,  B65B35/50

CPC分类号： H05K3/303 ,  H01L23/49816 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10515 ,  H05K2203/048 ,  H05K2203/083 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to a method in which components (101, 102) are provided, movement elements (104) are in each case applied to surfaces of a number of the components (101), and the components (101, 102) are stacked, so that one or a plurality of the movement elements (104) are situated between adjacent components (101, 102) and the components (101, 102) are held in their position by connecting elements (103).

摘要翻译： 本发明涉及一种其中提供部件（101,102）的方法，每种情况下运动元件（104）施加到多个部件（101）的表面，并且部件（101,102）被堆叠， 使得一个或多个运动元件（104）位于相邻部件（101,102）之间，并且部件（101,102）通过连接元件（103）保持在其位置。

公开(公告)号：US20080017967A1

公开(公告)日：2008-01-24

申请号：US11780786

申请日：2007-07-20

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H05K1/141 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/3512

摘要： An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.

摘要翻译： 封装在封装构造中的电子电路包括：具有第一电子元件的下部子组件，第一布线载体，具有第一再分布层的第一壳体和布置在第一再分布层上的焊球布置，以及上部 子组件具有安装在下部子组件上的第二电子元件。 一种封装在封装结构中的电子电路的制造方法，其特征在于，包括：通过辐射交联热塑性粘合剂将第一电子元件的上侧粘接到第一再分布层的下侧。

公开(公告)号：US20060273443A1

公开(公告)日：2006-12-07

申请号：US11444530

申请日：2006-06-01

申请人： Michael Bauer ,  Jens Pohl

发明人： Michael Bauer ,  Jens Pohl

IPC分类号： H01L23/24

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。

公开(公告)号：US07919857B2

公开(公告)日：2011-04-05

申请号：US11867132

申请日：2007-10-04

申请人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

发明人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

IPC分类号： H01L23/06 ,  H01L23/552 ,  H01L21/00

CPC分类号： G01L19/0069 ,  G01L19/147 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.

摘要翻译： 塑料外壳包括塑料外表面，并且塑料外壳的下侧包括外部接触区域，外部接触件布置在其上。 塑料外表面被与下侧隔开的封闭金属层覆盖，其中塑料外表面和封闭金属层之间的边界层包括外壳的塑料的露出的导电夹杂物。

公开(公告)号：US07749864B2

公开(公告)日：2010-07-06

申请号：US11866853

申请日：2007-10-03

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/30

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US20080242057A1

公开(公告)日：2008-10-02

申请号：US11866853

申请日：2007-10-03

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/304

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US20080045063A1

公开(公告)日：2008-02-21

申请号：US11867132

申请日：2007-10-04

申请人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

发明人： Michael Bauer ,  Peter Strobel ,  Jens Pohl ,  Christian Stuempfl ,  Ludwig Heitzer

IPC分类号： H01R13/15

CPC分类号： G01L19/0069 ,  G01L19/147 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.

摘要翻译： 塑料外壳包括塑料外表面，并且塑料外壳的下侧包括外部接触区域，外部接触件布置在其上。 塑料外表面被与下侧隔开的封闭金属层覆盖，其中塑料外表面和封闭金属层之间的边界层包括外壳的塑料的露出的导电夹杂物。

公开(公告)号：US20070105394A1

公开(公告)日：2007-05-10

申请号：US11504782

申请日：2006-08-16

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/31

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

摘要翻译： 涂覆包括至少一个半导体芯片的结构的方法包括在待涂覆结构的区域上静电沉积涂层颗粒。 首先将涂层颗粒施加到载体上，然后将涂层颗粒带电涂覆颗粒。 包括至少一个半导体芯片的结构被静电充电到与载体相反的极性。 然后将载体和/或结构沿待涂覆结构的区域的方向彼此移动，直到涂层颗粒跳到要涂覆的结构的区域并粘附在那里。 涂覆颗粒通过用涂覆颗粒加热该区域而液化以形成涂层。

公开(公告)号：US20070042568A1

公开(公告)日：2007-02-22

申请号：US11465547

申请日：2006-08-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/00

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US07656018B2

公开(公告)日：2010-02-02

申请号：US11444530

申请日：2006-06-01

申请人： Michael Bauer ,  Jens Pohl

发明人： Michael Bauer ,  Jens Pohl

IPC分类号： H01L23/24

CPC分类号： H01L23/5389 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73203 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3011

摘要： A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

摘要翻译： 用于电子部件的包装包括合成包装化合物。 这种合成包装化合物包括其上侧的上外接触件和其下侧上的下外接触件，其中上外接触件通过传导路径电连接到下外触头。 合成包装化合物包括塑料与填料颗粒的混合物。 导电路径由自由导电金属夹杂物形成。 填料颗粒中含有金属有机化合物或无机络合物。 夹杂物是由金属有机化合物或无机络合物的光分解形成的。