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    SYSTEM AND METHOD FOR CONTINUOUS MODEL-BASED COST ESTIMATING
    31.
    发明申请
    SYSTEM AND METHOD FOR CONTINUOUS MODEL-BASED COST ESTIMATING 有权

    公开(公告)号：US20220108363A1

    公开(公告)日：2022-04-07

    申请号：US17499730

    申请日：2021-10-12

    申请人： Hung Viet Nguyen ,  Paul S. Martin

    发明人： Hung Viet Nguyen ,  Paul S. Martin

    IPC分类号： G06Q30/02

    摘要： A system and method of model-based estimating comprising: receiving a master estimate, including a plurality of master subitem estimates; generating a model estimate, including a plurality of model subitem estimates; generating a subjectives estimate, including a plurality of subjectives subitem estimates; receiving a model update; determining which of said model subitem estimates and said subjectives subitem estimates is impacted by said model update; determining one or more cost updates to said model subitem estimates and said subjectives subitem estimates; updating at least one of said model subitem estimates and said subjectives subitem estimate, based at least in part upon said step of determining one or more cost updates to said model subitem estimates and said subjectives subitem estimates.

    Light emitting device with molded wavelength converting layer
    32.
    发明授权
    Light emitting device with molded wavelength converting layer 有权
    具有模制波长转换层的发光器件

    公开(公告)号：US08771577B2

    公开(公告)日：2014-07-08

    申请号：US12706149

    申请日：2010-02-16

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： B29C43/18

    CPC分类号： H01L33/504 ,  B29C43/18 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/0075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.

    摘要翻译： 包括波长转换材料的柔性膜位于光源上。 柔性膜符合预定的形状。 在一些实施例中，光源是安装在支撑衬底上的发光二极管。 二极管与模具中的压痕对准，使得柔性膜设置在支撑基板和模具之间。 透明成型材料设置在支撑基板和模具之间。 将支撑基板和模具压在一起以使模制材料填充凹陷。 柔性膜符合光源或模具的形状。

    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER
    34.
    发明申请
    LED WITH SILICONE LAYER AND LAMINATED REMOTE PHOSPHOR LAYER 审中-公开
    LED与硅胶层和层压式远距离磷酸盐层

    公开(公告)号：US20110031516A1

    公开(公告)日：2011-02-10

    申请号：US12537909

    申请日：2009-08-07

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L33/00 ,  H01L21/56

    CPC分类号： H01L33/507 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/16 ,  H01L2933/0041

    摘要： A method for fabricating a light emitting device is described where an array of flip-chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.

    摘要翻译： 描述了一种用于制造发光器件的方法，其中倒装芯片发光二极管（LED）管芯的阵列安装在基座晶片上。 在每个LED管芯上同时模制半球形的第一硅氧烷层。 将预先形成的柔性荧光体层，包括注入硅氧烷的荧光体粉末层压在第一硅氧烷层上，以符合半球形第一硅氧烷层的外表面。 然后在荧光体层上模制硅树脂透镜。 通过预处理荧光体层，可以使荧光体层具有非常严格的公差并进行测试。 通过模制的半球状硅氧烷层将荧光体层与LED芯片分开，颜色与视角是恒定的，并且荧光体不会被热降解。 柔性荧光体层可以包括多个不同的荧光体层，并且可以包括反射器或其它层。

    Accurate alignment of an LED assembly
    35.
    发明授权
    Accurate alignment of an LED assembly 有权
    LED组件的准确对准

    公开(公告)号：US07795051B2

    公开(公告)日：2010-09-14

    申请号：US11626280

    申请日：2007-01-23

    申请人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

    发明人： Cresente S. Elpedes ,  Zainul Fiteri bin Aziz ,  Paul S. Martin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48465

    摘要： An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.

    摘要翻译： LED组件包括散热器和底座。 散热器具有可焊接润湿的顶部配合表面，并且底座具有可焊接润湿的底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 底座焊接在散热器顶部。 在焊料回流期间，熔融焊料使得底座与散热器的顶部配合表面对齐。 LED组件还可以包括具有顶部配合表面的衬底，并且散热器还可以包括底部配合表面。 顶部和底部配合表面具有基本相同的形状和面积。 散热器焊接在基板上。 在焊料回流期间，熔融焊料使得散热器与衬底的顶部配合表面对齐。

    Acoustic headsets
    38.
    发明授权
    Acoustic headsets 失效
    声学耳机

    公开(公告)号：US3934674A

    公开(公告)日：1976-01-27

    申请号：US501688

    申请日：1974-08-29

    申请人： Sidney X. Shore ,  Paul S. Martin

    发明人： Sidney X. Shore ,  Paul S. Martin

    IPC分类号： A61B7/02 ,  H04R5/033

    CPC分类号： A61B7/02 ,  H04R5/033 ,  H04R1/1016 ,  H04R1/1075 ,  H04R1/345

    摘要： Acoustic headsets, especially for transmitting sound from stereo transducers to the listener's ears, include two tubes, earpieces at first ends of the tubes, and a frame for constraining the tubes into a convenient U-shape near the wearer's face. The headset has resilient arms at the sides of the U-shaped frame, and more particularly, the arms have resilient inner and outer strips along respective ones of said tubes, facing toward and away from the center line of the frame. The strips are interconnected at their extremities, and in the exemplary embodiment the inner and outer strips of each arm are interconnected by a bridge between the extremities of the strips.

    摘要翻译： 声学耳机，特别是用于将声音从立体声传声器传输到收听者的耳朵，包括两个管，管的第一端的耳机和用于将管限制在靠近佩戴者脸部的方便的U形的框架。 耳机在U形框架的侧面具有弹性臂，更具体地，臂具有沿着相应的一个所述管的弹性内部和外部带，面向和远离框架的中心线。 条带在它们的末端互连，并且在示例性实施例中，每个臂的内部条带和外部条带通过条带末端之间的桥连接。

    Silicone based reflective underfill and thermal coupler
    39.
    发明授权
    Silicone based reflective underfill and thermal coupler 有权
    硅基反射底部填充和热耦合器

    公开(公告)号：US08471280B2

    公开(公告)日：2013-06-25

    申请号：US12613924

    申请日：2009-11-06

    申请人： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    发明人： Rafael I. Aldaz ,  Grigoriy Basin ,  Paul S. Martin ,  Michael Krames

    IPC分类号： H01L23/29

    CPC分类号： H01L33/62 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/60 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

    摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.

    摘要翻译： 在一个实施例中，倒装芯片LED形成有从其n层和p层的底表面延伸的高密度的金柱。 金柱结合到底座电极。 然后将底部填充材料模制以填充LED底部和底座之间的空隙。 底部填充物包含硅氧烷模塑料基料和约70-80重量％的氧化铝（或其它合适的材料）。 氧化铝的导热系数比典型的硅胶底部填充物的热导率高出约25倍，这主要是二氧化硅。 氧化铝是白色粉末。 底部填充剂还可以含有约5-10重量％的TiO 2以增加反射率。 LED灯由反射底层填充物向上反射，底部填充物有效地将热量传导到底座。 底部填充物也随机化光散射，改善光提取。 分布式金柱和底层填料在生长衬底剥离过程中支持LED层。

    LED wafer with laminated phosphor layer
    40.
    发明授权
    LED wafer with laminated phosphor layer 有权
    LED晶圆与叠层荧光粉层

    公开(公告)号：US08232117B2

    公开(公告)日：2012-07-31

    申请号：US12771809

    申请日：2010-04-30

    申请人： Grigoriy Basin ,  Paul S. Martin

    发明人： Grigoriy Basin ,  Paul S. Martin

    IPC分类号： H01L21/00

    CPC分类号： H01L33/0079 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/22 ,  H01L33/50 ,  H01L2224/14 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012

    摘要： An LED wafer with a growth substrate is attached to a carrier substrate by, for example, a heat-releasable adhesive so that the LED layers are sandwiched between the two substrates. The growth substrate is then removed, such as by laser lift-off. The exposed surface of the LED layers is then etched to improve light extraction. A preformed phosphor sheet, matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet, LED layers, and, optionally, the carrier substrate are then diced to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

    摘要翻译： 具有生长衬底的LED晶片通过例如可热剥离的粘合剂附接到载体衬底，使得LED层夹在两个衬底之间。 然后去除生长衬底，例如通过激光剥离。 然后蚀刻LED层的暴露表面以改善光提取。 然后将与LED相匹配的预成型荧光体片固定到暴露的LED层。 然后对磷光体片，LED层和任选的载体衬底进行切割以分离LED。 LED芯片通过加热或其他方式从载体基板释放，并且使用拾放机将各个LED芯片安装在底座晶片上。 然后将底座晶片切割以产生单独的LED。 有源层可以产生蓝光，并且蓝光和荧光光可以产生具有预定白点的白光。