公开(公告)号：US08554413B2

公开(公告)日：2013-10-08

申请号：US13134736

申请日：2011-06-15

申请人： Yasuhiko Mukai ,  Hideki Kabune ,  Kouichi Nakamura ,  Masashi Hori

发明人： Yasuhiko Mukai ,  Hideki Kabune ,  Kouichi Nakamura ,  Masashi Hori

IPC分类号： A01B69/00

CPC分类号： B62D5/0409 ,  B62D5/008 ,  B62D5/0484

摘要： A VGRS device checks whether assist control of an EPS device for assisting steering operation of a steering wheel is being stopped. If the assist control of the EPS device is being stopped, a speed increase ratio is determined so that the rotation angle of the output shaft is less than the rotation angle of the input shaft. A VGRS motor is controlled and driven based on a determined speed increase ratio. Thus, steering operation of the steering wheel can be controlled appropriately so that the steering operation of the steering wheel can be continued with relatively small torque. It is less likely that a driver will erroneously feel that the steering wheel is locked.

摘要翻译： VGRS装置检查是否停止用于辅助方向盘的转向操作的EPS装置的辅助控制。 如果EPS装置的辅助控制停止，则确定增速比，使得输出轴的旋转角度小于输入轴的旋转角度。 基于确定的速度增加率来控制和驱动VGRS电动机。 因此，可以适当地控制方向盘的转向操作，从而能够以相对小的扭矩继续转向操纵。 驾驶员不太可能会错误地感觉到方向盘被锁定。

公开(公告)号：US08188933B2

公开(公告)日：2012-05-29

申请号：US12639238

申请日：2009-12-16

申请人： Kouichi Nakamura ,  Takumi Naruse ,  Fumio Fukushima ,  Kuniaki Kiyosue

发明人： Kouichi Nakamura ,  Takumi Naruse ,  Fumio Fukushima ,  Kuniaki Kiyosue

IPC分类号： H01Q7/08

CPC分类号： H01Q7/00 ,  H01Q1/38

摘要： An antenna unit includes an antenna formed on a magnetic sheet. A transmission circuit includes an inductor, a matching capacitor, and the antenna connected in series, and a reception circuit includes the antenna, the matching capacitor, a resistor, and a capacitor connected in series. The antenna is formed as one turn, and the size of the antenna and the resistor involves a predetermined relationship.

摘要翻译： 天线单元包括形成在磁性片上的天线。 传输电路包括电感器，匹配电容器和串联连接的天线，并且接收电路包括天线，匹配电容器，电阻器和串联连接的电容器。 天线形成一圈，并且天线和电阻器的尺寸涉及预定的关系。

公开(公告)号：US08076785B2

公开(公告)日：2011-12-13

申请号：US11474406

申请日：2006-06-26

申请人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

发明人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。

公开(公告)号：US20110278723A1

公开(公告)日：2011-11-17

申请号：US13195325

申请日：2011-08-01

申请人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

发明人： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC分类号： H01L23/498

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

摘要： A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

摘要翻译： 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。

公开(公告)号：US20080188058A1

公开(公告)日：2008-08-07

申请号：US12098710

申请日：2008-04-07

申请人： Takao NISHIMURA ,  Kouichi Nakamura

发明人： Takao NISHIMURA ,  Kouichi Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L21/67126 ,  H01L21/67144 ,  H01L21/6715 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/3003 ,  H01L2224/30151 ,  H01L2224/30156 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75317 ,  H01L2224/756 ,  H01L2224/75743 ,  H01L2224/75745 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83001 ,  H01L2224/8303 ,  H01L2224/83047 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a method for manufacturing a semiconductor device which includes at least supplying an adhesive for bonding an electronic component which has a plurality of bumps with a substrate which has a plurality of bonding pads corresponding to the bumps, to at least a portion of the substrate, between the electronic component and the substrate, flow-casting the adhesive on the substrate by a flow-casting unit, in such a manner that the expression S1/S0>1 is satisfied, where S0 is the total contact surface area with the substrate of the adhesive supplied to the substrate, and S1 is the total contact surface area with the substrate of the adhesive after the flow-casting, and curing the adhesive while making the adhesive contact with the electronic component and the substrate in a state where the bumps are abutted against the bonding pads.

摘要翻译： 本发明提供一种制造半导体器件的方法，该方法至少包括将具有多个凸起的电子部件与具有多个与该凸起相对应的焊盘的基板接合的粘合剂，至少部分 电子部件和基板之间的基板通过流铸单元将粘合剂流延在基板上，使得表达式S 1 / S 0 < SUB >> 1满足，其中S 是与提供给基板的粘合剂的基材的总接触表面积，S 1 <1是总接触表面积 与流延铸造之后的粘合剂基材一起固化，同时使粘合​​剂在凸起抵靠接合焊盘的状态下与电子部件和基板接触。

公开(公告)号：US06203890B1

公开(公告)日：2001-03-20

申请号：US09500266

申请日：2000-02-08

申请人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

发明人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

IPC分类号： B41M540

CPC分类号： B41M5/38214 ,  B41M5/42 ,  B41M5/423 ,  B41M5/44 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24901 ,  Y10T428/24934 ,  Y10T428/249953 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31 ,  Y10T428/31855

摘要： A co-winding type thermal transfer sheet is constituted by forming on one surface side of a substrate film a heat-fusible ink layer comprising a pigment and a particulate binder, and causing a tracing paper to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer. The thus constituted co-winding type thermal transfer sheet is capable of providing an original image which can be reproduced by use of a blueprint process so as to provide blueprint images having a high precision and a high contrast. In addition, a co-winding type thermal transfer sheet may also be constituted by forming a heat-fusible ink layer on one surface side of a substrate film and causing a transparent resin sheet to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer containing a cross-linking agent. The thus constituted co-winding type thermal transfer sheet is capable of providing an image excellent in wear resistance on the transparent resin sheet. The transparent resin sheet after the image formation may be used as an OHP (overhead projector) sheet without contaminating the sheet having no liquid absorbing property.

摘要翻译： 共卷绕型热转印片是通过在基材膜的一个表面侧上形成包含颜料和颗粒状粘合剂的热熔性油墨层而构成的，并且使可追踪纸可剥离地结合到热熔油墨层上 通过粘合剂层的介质。 这样构成的共绕线式热转印片能够提供可以通过蓝图处理再现的原始图像，以便提供具有高精度和高对比度的蓝图。另外，共同绕组型 热转印片也可以通过在基材膜的一个表面侧上形成热熔性油墨层，并且通过含有交叉的粘合剂层的介质使透明树脂片材可剥离地结合到热熔性油墨层上 链接代理。 这样构成的共绕线式热转印片能够提供透明树脂片上耐磨性优异的图像。 图像形成后的透明树脂片可以用作OHP（高射投影仪）片，而不会污染不具有液体吸收性的片。

公开(公告)号：US5958021A

公开(公告)日：1999-09-28

申请号：US593288

申请日：1996-01-29

申请人： Kiyoyuki Tsuchiyama ,  Hideyuki Yamada ,  Kouichi Nakamura

发明人： Kiyoyuki Tsuchiyama ,  Hideyuki Yamada ,  Kouichi Nakamura

IPC分类号： G06F13/12 ,  G06F13/40 ,  H03K19/173 ,  G06F13/00

CPC分类号： G06F13/4072

摘要： An input-output interface circuit operative in three different modes which utilizes a first signal selector, operative selectively in an external signal output mode and an internal signal transmission mode, having one output terminal to which a signal is transmitted from a signal processor and first and second output terminals, a second signal selector, operative selectively in an external signal input mode and an internal signal transmission mode, having one output terminal through which a signal input to the signal processor is transmitted and first and second output terminals, the first output terminal of the first signal selector being connected to the external input-output terminal by an external output signal transmission channel; the second output terminal of the first signal selector being connected to the first input terminal of the second signal selector by an internal signal transmission channel; and the external input-output terminal being connected to the second input terminal of the second signal selector by an external input signal transmission channel.

摘要翻译： 一种以三种不同模式工作的输入 - 输出接口电路，它们利用第一信号选择器，其选择性地在外部信号输出模式和内部信号传输模式中操作，具有从信号处理器向其发送信号的一个输出端， 第二输出端子，第二信号选择器，其选择性地在外部信号输入模式和内部信号传输模式中操作，具有一个输出端子，通过该输出端子输入信号处理器的信号以及第一和第二输出端子， 的第一信号选择器通过外部输出信号传输通道连接到外部输入 - 输出端; 第一信号选择器的第二输出端通过内部信号传输通道连接到第二信号选择器的第一输入端; 并且外部输入输出端子通过外部输入信号传输通道连接到第二信号选择器的第二输入端子。

公开(公告)号：US5948511A

公开(公告)日：1999-09-07

申请号：US686221

申请日：1996-07-23

申请人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

发明人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

IPC分类号： B32B3/00 ,  B41M5/26 ,  B41M5/382 ,  B41M5/392 ,  B41M5/40 ,  B41M5/42 ,  B41M5/44

CPC分类号： B41M5/38214 ,  B41M5/42 ,  B41M5/423 ,  B41M5/44 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24901 ,  Y10T428/24934 ,  Y10T428/249953 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31 ,  Y10T428/31855

摘要： A co-winding type thermal transfer sheet is constituted by forming on one surface side of a substrate film a heat-fusible ink layer comprising a pigment and a particulate binder, and causing a tracing paper to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer. The thus constituted co-winding type thermal transfer sheet is capable of providing an original image which can be reproduced by use of a blueprint process so as to provide blueprint images having a high precision and a high contrast.In addition, a co-winding type thermal transfer sheet may also be constituted by forming a heat-fusible ink layer on one surface side of a substrate film and causing a transparent resin sheet to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer containing a cross-linking agent. The thus constituted co-winding type thermal transfer sheet is capable of providing an image excellent in wear resistance on the transparent resin sheet. The transparent resin sheet after the image formation may be used as an OHP (overhead projector) sheet. without contaminating the sheet having no liquid absorbing property.

公开(公告)号：US5916851A

公开(公告)日：1999-06-29

申请号：US894712

申请日：1997-08-11

申请人： Kunihiko Hosonuma ,  Yasushi Naitoh ,  Toru Imori ,  Kouichi Nakamura

发明人： Kunihiko Hosonuma ,  Yasushi Naitoh ,  Toru Imori ,  Kouichi Nakamura

IPC分类号： C10M135/00 ,  C10M135/18 ,  C10M141/08 ,  C10M141/10 ,  C10M139/00 ,  C10M141/12

CPC分类号： C10M135/18 ,  C10M135/00 ,  C10M141/08 ,  C10M141/10 ,  C10M2207/284 ,  C10M2207/285 ,  C10M2207/287 ,  C10M2207/288 ,  C10M2207/289 ,  C10M2219/02 ,  C10M2219/022 ,  C10M2219/024 ,  C10M2219/062 ,  C10M2219/066 ,  C10M2219/068 ,  C10M2219/082 ,  C10M2219/083 ,  C10M2219/087 ,  C10M2219/088 ,  C10M2219/089 ,  C10M2219/10 ,  C10M2219/102 ,  C10M2219/104 ,  C10M2219/106 ,  C10M2219/108 ,  C10M2223/045 ,  C10N2210/02 ,  C10N2210/04 ,  C10N2210/05 ,  C10N2210/06 ,  C10N2240/10 ,  C10N2240/101 ,  C10N2240/104 ,  C10N2240/106

摘要： There is disclosed a lubricating oil for internal combustion engine which comprises:a mineral oil and/or a synthetic lubricating oil as a base oil, and oxymolybdenum dithiocarbamate sulfide expressed by the chemical formula (1): ##STR1## wherein R.sub.1 or R.sub.1 and R.sub.3 denote a branched aliphatic hydrocarbon group having not less than fourteen carbons, and R.sub.2 through R.sub.4 or R.sub.2 and R.sub.4 denote an aliphatic hydrocarbon group having not less than four carbons, in the amount of 0.005 to 0.2% by weight, when calculated as molybdenum (Mo).

摘要翻译： PCT No.PCT / JP96 / 03760 Sec。 371日期1997年8月11日 102（e）日期1997年8月11日PCT 1996年12月24日PCT公布。 公开号WO97 / 23587 日期1997年7月3日公开了一种内燃机用润滑油，其特征在于，含有矿物油和/或合成润滑油作为基础油，以及由化学式（1）表示的二硫代氨基甲酸硫氧化钼：其中R1或R1 R3表示具有不少于14个碳原子的支链脂族烃基，R2至R4或R2和R4表示不少于4个碳的脂族烃基，当以钼计算时为0.005至0.2重量％ （Mo）。

公开(公告)号：US5573833A

公开(公告)日：1996-11-12

申请号：US413268

申请日：1995-03-30

申请人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

发明人： Hirokatsu Imamura ,  Masafumi Hayashi ,  Kouichi Nakamura ,  Hirokazu Kaneko ,  Shigeki Umise ,  Kenichiro Suto ,  Hiromi Watanabe

IPC分类号： B32B3/00 ,  B41M5/26 ,  B41M5/382 ,  B41M5/392 ,  B41M5/40 ,  B41M5/42 ,  B41M5/44

CPC分类号： B41M5/38214 ,  B41M5/42 ,  B41M5/423 ,  B41M5/44 ,  Y10S428/913 ,  Y10S428/914 ,  Y10T428/24901 ,  Y10T428/24934 ,  Y10T428/249953 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/31 ,  Y10T428/31855

摘要： A co-winding type thermal transfer sheet is constituted by forming on one surface side of a substrate film a heat-fusible ink layer comprising a pigment and a particulate binder, and causing a tracing paper to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer. The thus constituted co-winding type thermal transfer sheet is capable of providing an original image which can be reproduced by use of a blueprint process so as to provide blueprint images having a high precision and a high contrast.In addition, a co-winding type thermal transfer sheet may also be constituted by forming a heat-fusible ink layer on one surface side of a substrate film and causing a transparent resin sheet to be peelably bonded onto the heat-fusible ink layer by the medium of an adhesive layer containing a cross-linking agent. The thus constituted co-winding type thermal transfer sheet is capable of providing an image excellent in wear resistance on the transparent resin sheet. The transparent resin sheet after the image formation may be used as an OHP (overhead projector) sheet. without contaminating the sheet having no liquid absorbing property.