公开(公告)号：US09134433B2

公开(公告)日：2015-09-15

申请号：US13814369

申请日：2011-08-09

Applicant: Takao Nishimura ,  Kenichiro Kino

Inventor： Takao Nishimura ,  Kenichiro Kino

IPC: G01T1/178 ,  G21C17/04 ,  G01T1/167 ,  G21C17/02 ,  G01T7/02 ,  G21C17/06 ,  G21C1/02

CPC classification number: G01T1/167 ,  G01T7/02 ,  G21C1/022 ,  G21C17/02 ,  G21C17/022 ,  G21C17/06

Abstract: A nuclear reactor fuel integrity monitor includes: a γ-ray detector which detects γ-ray of a specific radionuclide of a subject measurement medium of a nuclear reactor; a sample container which retains the subject measurement medium therein and surrounds the circumference of the γ-ray detector; and a measurement control device which performs a control so that a predetermined amount of the subject measurement medium is introduced into the sample container and calculates a concentration of the specific radionuclide from γ-ray data per each unit time detected by the γ-ray detector and a volume of the subject measurement medium introduced into the sample container.

Abstract translation: 核反应堆燃料完整性监视器包括：γ射线检测器，其检测核反应堆的被测量介质的特定放射性核素的γ射线; 样本容器，其将被检测体介质保持在其中并且包围γ射线检测器的周围; 以及测量控制装置，其进行控制，使得将预定量的被摄体测量介质引入到样本容器中，并根据由γ射线检测器检测的每单位时间的γ射线数据计算特定放射性核素的浓度;以及 将被测量介质的体积引入到样品容器中。

公开(公告)号：US09076559B2

公开(公告)日：2015-07-07

申请号：US12995568

申请日：2009-04-03

Applicant: Takao Nishimura ,  Ryuji Umehara

Inventor： Takao Nishimura ,  Ryuji Umehara

IPC: G21C9/00 ,  G21C17/022 ,  G21D3/08 ,  G21D1/00

CPC classification number: G21C17/0225 ,  G21D1/00 ,  G21D3/08 ,  Y02E30/40

Abstract: An object is to reduce radiation exposure in a nuclear plant. A nuclear plant 1 is a nuclear power generating plant where steam is generated by thermal energy generated by nuclear fission of a nuclear fuel 2C in a nuclear reactor 2, and a turbine 8 is driven by the steam to generate heat by a power generator 10. After a nuclear plant 1 is newly constructed, when a primary cooling system of the nuclear reactor 2 raises the temperature to around a power operation temperature for the first time, zinc is injected into a primary coolant C1 present in the primary cooling system by a zinc injector 20.

Abstract translation: 目的是减少核电厂的辐射暴露。 核电站1是核发电厂，其中通过核反应堆2中的核燃料2C的核裂变产生的热能产生蒸汽，并且涡轮8由蒸汽驱动以通过发电机10产生热量。 新建核电厂1后，当核反应堆2的主冷却系统首次将温度升高到功率运行温度附近时，锌通过锌一次冷却系统中的一次冷却剂C1注入 注射器20。

公开(公告)号：US08810043B2

公开(公告)日：2014-08-19

申请号：US13195325

申请日：2011-08-01

Applicant: Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

Inventor： Takao Nishimura ,  Yoshikazu Kumagaya ,  Akira Takashima ,  Kouichi Nakamura ,  Kazuyuki Aiba

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/14 ,  H01L2224/1411 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17107 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05541 ,  H01L2224/05005

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract translation: 半导体器件包括具有设置有外部连接端子焊盘的主表面的半导体元件。 半导体元件经由设置在外部连接端子焊盘上的多个凸形外部连接端子和连接构件连接到支撑板上的导电层; 并且连接构件通常覆盖凸形外部连接端子。

公开(公告)号：US08404980B2

公开(公告)日：2013-03-26

申请号：US12824117

申请日：2010-06-25

Applicant: Takao Nishimura ,  Kouichi Nakamura

Inventor： Takao Nishimura ,  Kouichi Nakamura

IPC: H05K1/16

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/5382 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48475 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract translation: 设置在半导体器件中的中继板包括第一端子和通过布线连接到第一端子的多个第二端子。 连接到第一端子的布线在路上分开，使得布线连接到每个第二端子。

公开(公告)号：US08134240B2

公开(公告)日：2012-03-13

申请号：US12557986

申请日：2009-09-11

Applicant: Takao Nishimura ,  Yoshiaki Narisawa

Inventor： Takao Nishimura ,  Yoshiaki Narisawa

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L23/3128 ,  H01L23/4952 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48482 ,  H01L2224/48487 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49426 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2224/85181 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2224/4554

Abstract: To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21A arranged on its surface; and a first semiconductor element 11A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10, wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11A (i.e., at least one of the electrodes 21 and 22), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.

Abstract translation: 为了提供防止相邻导线之间的接触以提高布线布局设计的灵活性的小型高性能半导体器件，以及制造半导体器件的有效方法。 半导体器件包括：衬底10，其具有布置在其表面上的电极21A; 以及第一半导体元件11A，其包括布置在其表面上并由衬底10支撑的电极22，其中第一线41通过第一凸块31连接到衬底10上的至少一个电极和半导体元件 11A（即，电极21和22中的至少一个），并且第二线42通过第二凸块32连接到线41的接合部分。

公开(公告)号：US08076769B2

公开(公告)日：2011-12-13

申请号：US12275848

申请日：2008-11-21

Applicant: Takao Nishimura ,  Yoshikazu Kumagaya

Inventor： Takao Nishimura ,  Yoshikazu Kumagaya

IPC: H01L23/48

CPC classification number: H01L23/16 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/573 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/10152 ,  H01L2224/10165 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0275 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0311 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/20751

Abstract: A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.

Abstract translation: 半导体器件包括半导体元件; 与半导体元件的电子电路形成部分相对设置的板构件; 以及在所述半导体元件和所述板状部件之间以压缩状态配置的弹性体，其中，所述弹性体在所述弹性体的延伸方向的一端具有至少一个第一突出部，所述第一突出部与所述弹性体相对地形成 半导体元件的电子电路形成部分，并且半导体元件和板构件通过粘合剂紧固。

公开(公告)号：US20110075785A1

公开(公告)日：2011-03-31

申请号：US12995568

申请日：2009-04-03

Applicant: Takao Nishimura ,  Ryuji Umehara

Inventor： Takao Nishimura ,  Ryuji Umehara

IPC: G21C9/00

CPC classification number: G21C17/0225 ,  G21D1/00 ,  G21D3/08 ,  Y02E30/40

Abstract: An object is to reduce radiation exposure in a nuclear plant. A nuclear plant 1 is a nuclear power generating plant where steam is generated by thermal energy generated by nuclear fission of a nuclear fuel 2C in a nuclear reactor 2, and a turbine 8 is driven by the steam to generate heat by a power generator 10. After a nuclear plant 1 is newly constructed, when a primary cooling system of the nuclear reactor 2 raises the temperature to around a power operation temperature for the first time, zinc is injected into a primary coolant C1 present in the primary cooling system by a zinc injector 20.

Abstract translation: 目的是减少核电厂的辐射暴露。 核电站1是核发电厂，其中通过核反应堆2中的核燃料2C的核裂变产生的热能产生蒸汽，并且涡轮8由蒸汽驱动以通过发电机10产生热量。 新建核电厂1后，当核反应堆2的主冷却系统首次将温度升高到功率运行温度附近时，锌通过锌一次冷却系统中的一次冷却剂C1注入 注射器20。

公开(公告)号：US07884459B2

公开(公告)日：2011-02-08

申请号：US12210645

申请日：2008-09-15

Applicant: Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

Inventor： Eiji Yoshida ,  Takao Ohno ,  Yoshito Akutagawa ,  Koji Sawahata ,  Masataka Mizukoshi ,  Takao Nishimura ,  Akira Takashima ,  Mitsuhisa Watanabe

IPC: H01L23/02

CPC classification number: H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/13008 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Abstract translation: 提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。 在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。 通过蚀刻形成孔，电极焊盘用作蚀刻停止层。 埋入电极形成在孔中。 该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

公开(公告)号：US07880276B2

公开(公告)日：2011-02-01

申请号：US11969402

申请日：2008-01-04

Applicant: Takao Nishimura ,  Kazuyuki Aiba

Inventor： Takao Nishimura ,  Kazuyuki Aiba

IPC: H01L23/495

CPC classification number: H01L24/32 ,  H01L21/563 ,  H01L23/564 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/75743 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.

Abstract translation: 电子部件经由凸块安装在主表面上并且电子部件的周边的至少一部分被树脂覆盖的布线基板，所述布线基板包括设置在至少一部分周边的坝体 在电路板的主表面上安装电子部件的区域; 其中与树脂接触的坝的表面具有连续形成曲线的构造。

公开(公告)号：US20100258926A1

公开(公告)日：2010-10-14

申请号：US12824117

申请日：2010-06-25

Applicant: Takao Nishimura ,  Kouichi Nakamura

Inventor： Takao Nishimura ,  Kouichi Nakamura

IPC: H01L23/49 ,  H01L23/495

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/5382 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48475 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract translation: 设置在半导体器件中的中继板包括第一端子和通过布线连接到第一端子的多个第二端子。 连接到第一端子的布线在路上分开，使得布线连接到每个第二端子。