公开(公告)号：US20050173410A1

公开(公告)日：2005-08-11

申请号：US10998392

申请日：2004-11-29

申请人： Hisakazu Okajima ,  Mitsuru Ohta

发明人： Hisakazu Okajima ,  Mitsuru Ohta

IPC分类号： H05B3/10 ,  H01L21/00 ,  H01L21/02 ,  H01L21/205 ,  H05B3/02 ,  H05B3/12 ,  H05B3/14 ,  H05B3/68 ,  H05B3/74

CPC分类号： H05B3/143 ,  H01L21/67103

摘要： An object of the present invention is to provide a heater having a ceramic substrate with a through hole formed therein so that the uniformity of temperature on the heating face of the substrate can be improved and the use life of the ceramic substrate can be improved upon thermal cycles. A ceramic heater comprises a substrate made of a ceramic material and having a heating face where three or more zones 3C, 3F are allocated, heating resistances corresponding to the zones, respectively, and terminals 5C electrically connected to the heating resistances, respectively. Three or more holes 4 are formed in the substrate. Distances of the terminals 5C and the wall surfaces facing the holes 4 are 8 mm or more, respectively. The heating resistance 15 intersects a straight line 16 connecting the center of the terminal and the center 4a of the hole in a plan view.

摘要翻译： 本发明的目的是提供一种加热器，其具有形成有通孔的陶瓷基板，从而可以提高基板的加热面上的温度均匀性，并且可以提高陶瓷基板的使用寿命 周期。 陶瓷加热器包括由陶瓷材料制成的基板，并且具有分别具有三个或更多个区域3C，3F的加热面，分别对应于这些区域的加热电阻和分别与加热电阻电连接的端子5C 。 在基板上形成三个以上的孔4。 端子5C和面向孔4的壁面的距离分别为8mm以上。 加热电阻15在平面图中与连接端子的中心和孔的中心4a的直线16相交。

公开(公告)号：US06918530B2

公开(公告)日：2005-07-19

申请号：US10348471

申请日：2003-01-21

申请人： Masayuki Shinkai ,  Takahiro Ishikawa ,  Masahiro Kida ,  Mitsuru Ohta

发明人： Masayuki Shinkai ,  Takahiro Ishikawa ,  Masahiro Kida ,  Mitsuru Ohta

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K35/00 ,  B23K35/30 ,  B23K103/18 ,  C04B37/02 ,  C22C5/02 ,  H01R4/02 ,  B23K31/02

CPC分类号： C04B37/026 ,  B23K1/0008 ,  B23K1/19 ,  B23K1/20 ,  B23K35/004 ,  B23K35/3013 ,  B32B18/00 ,  B32B2309/022 ,  B32B2311/04 ,  B32B2311/18 ,  B32B2311/22 ,  B32B2311/24 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2235/6581 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/366 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/55 ,  C04B2237/64 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/765 ,  C04B2237/84 ,  C04B2237/86 ,  H01R4/02

摘要： A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.

摘要翻译： 包含陶瓷基材1和金属构件7的接合构件，其结合在一起，其中包含Au的焊料材料5经由活性金属层设置在陶瓷基材1的表面上，活性金属层和焊料 材料5通过加热熔化以形成预涂层6，金属构件7经由包含纯金属的插入金属层设置在预涂层6的表面上，该纯金属可形成具有比Au低的合金， Au或纯金属和Au的合金，并且插入金属层和插入金属层和预涂层6之间的界面附近的至少一部分通过加热熔化以将金属构件7和预涂层 第6层。

公开(公告)号：US06869689B2

公开(公告)日：2005-03-22

申请号：US10846277

申请日：2004-05-14

申请人： Tomoyuki Fujii ,  Mitsuru Ohta ,  Tsuneaki Ohashi

发明人： Tomoyuki Fujii ,  Mitsuru Ohta ,  Tsuneaki Ohashi

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K101/36 ,  C04B37/02 ,  H01L21/683 ,  H01R4/04 ,  H01R4/62 ,  H01R39/02 ,  H01L23/48 ,  B32B15/04 ,  B22B1/04 ,  B22B7/04

CPC分类号： H01R4/62 ,  C04B35/581 ,  C04B35/645 ,  C04B37/026 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/40 ,  C04B2237/68 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/84 ,  H01L2924/0002 ,  H01R4/04 ,  H01R39/022 ,  H01R39/027 ,  Y10T428/12375 ,  Y10T428/12486 ,  Y10T428/12493 ,  Y10T428/12528 ,  Y10T428/12535 ,  Y10T428/12681 ,  Y10T428/12868 ,  Y10T428/198 ,  Y10T428/31678 ,  H01L2924/00

摘要： A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium metal. The invention further provides a joined structure of a metal member and a ceramic member. The metal member has a tip face and a side face. A hollow is formed in the ceramic member. A joining layer is formed between a bottom surface facing the hollow and the tip face of the member, and further formed between a side wall surface facing the hollow and the side face of the member. The joining layer has a metal adhesive layer containing at least indium metal.

摘要翻译： 金属端子和陶瓷构件的接合结构在端子和陶瓷构件之间具有接合层。 接合层具有至少含有铟金属的金属粘合剂层。 本发明还提供一种金属构件和陶瓷构件的接合结构。 金属构件具有尖端面和侧面。 陶瓷构件中形成有中空部。 在面向中空部的底面与构件的前端面之间形成接合层，并且还形成在面向中空部的侧壁面与构件的侧面之间。 接合层具有至少含有铟金属的金属粘合剂层。

公开(公告)号：US5060011A

公开(公告)日：1991-10-22

申请号：US335492

申请日：1989-04-10

申请人： Takemi Yamamoto ,  Jun Sakai ,  Mitsuru Ohta

发明人： Takemi Yamamoto ,  Jun Sakai ,  Mitsuru Ohta

IPC分类号： G03F7/00

CPC分类号： G03F7/0025 ,  G03B2227/325

摘要： An image recording apparatus which can provide an output visible image on an ordinary sheet. The apparatus uses a photosensitive recording medium whose surface is provided with microcapsules encapsulating therein a chromogenic material or dye precursor. Developer material particles are supplied over one of the photosensitive recording medium and the ordinary sheet for generating a chromogenic reaction with the dye precursor.

公开(公告)号：US5042924A

公开(公告)日：1991-08-27

申请号：US490221

申请日：1990-03-08

申请人： Shuji Terasaki ,  Mitsuru Ohta ,  Akiyasu Ishii ,  Yuji Kojima ,  Akira Tanaka

发明人： Shuji Terasaki ,  Mitsuru Ohta ,  Akiyasu Ishii ,  Yuji Kojima ,  Akira Tanaka

IPC分类号： C08J5/18 ,  C08L27/16 ,  C08L33/12

CPC分类号： C08J5/18 ,  C08L27/16 ,  C08J2327/16 ,  C08L33/12

摘要： An optical phase plate is provided in the form of a drawn and oriented film or sheet, having a composition comprising a vinylidene fluoride resin and a methyl methacrylate resin in a mixing ratio of the former to the latter between about 65/35 and about 85/15 by weight, in which the crystal structure of the vinylidene fluoride resin consists mainly of a .beta.-form and the film or the sheet has dimensional stability and a retardation value R within a range from 500 to 650 nm. The optical phase plate is produced by uniformly kneading and melt-extruding the predetermined PVDF/PMMA mixture into a sheet and subjecting the sheet to drawing and then to heat treatment.

公开(公告)号：US4434209A

公开(公告)日：1984-02-28

申请号：US249958

申请日：1981-04-01

申请人： Tohru Sasaki ,  Mitsuru Ohta ,  Syuuzi Terasaki ,  Syozo Kakizaki

发明人： Tohru Sasaki ,  Mitsuru Ohta ,  Syuuzi Terasaki ,  Syozo Kakizaki

IPC分类号： H01B3/44 ,  H01G4/18 ,  H01G4/22 ,  B32B15/08 ,  B32B27/06

CPC分类号： H01G4/18 ,  Y10T428/31522 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31935

摘要： Capacitor having layers of dielectric material containing at least one oriented film prepared by molding a resin composition comprising polyvinylidene fluoride, polycarbonate and/or thermoplastic polyester into un-stretched film and stretching the thus molded un-stretched film as at least a part of the constituents of the layer of dielectric material is disclosed.

摘要翻译： 电容器具有包含至少一个取向膜的电介质材料层，该取向膜通过将包含聚偏二氟乙烯，聚碳酸酯和/或热塑性聚酯的树脂组合物模制成未拉伸膜并拉伸由此模制的未拉伸膜作为至少一部分组分 的介电材料层。

公开(公告)号：US4298719A

公开(公告)日：1981-11-03

申请号：US58776

申请日：1979-07-19

申请人： Toshiya Mizuno ,  Mitsuru Ohta ,  Masahiro Segawa

发明人： Toshiya Mizuno ,  Mitsuru Ohta ,  Masahiro Segawa

IPC分类号： B29C47/88 ,  B29C49/00 ,  B29C55/00 ,  B29C55/14 ,  B29K27/12 ,  B29L7/00 ,  B29L31/34 ,  C08J5/00 ,  C08J5/18 ,  H01B3/44 ,  H01G7/02 ,  H01L41/45 ,  B32B27/00 ,  B29C17/02 ,  C08F14/18

CPC分类号： C08J5/18 ,  B29C55/005 ,  B29C55/14 ,  C08J5/00 ,  H01G7/023 ,  H01L41/45 ,  B29K2027/16 ,  C08J2327/16 ,  Y10S428/91 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

摘要： Polyvinylidene fluoride film having its crystalline region occupied predominantly by form I crystals, characterized in that the crystals are substantially double oriented.

摘要翻译： 其聚偏氟乙烯膜的结晶区主要由I型晶体占据，其特征在于晶体基本上是双重取向的。

公开(公告)号：US08691368B2

公开(公告)日：2014-04-08

申请号：US12079399

申请日：2008-03-26

申请人： Mitsuru Ohta ,  Motoki Ozawa ,  Yoshiaki Okabayashi

发明人： Mitsuru Ohta ,  Motoki Ozawa ,  Yoshiaki Okabayashi

IPC分类号： B32B3/10

CPC分类号： H01L23/3735 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2224/29499 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  H01L2924/00

摘要： A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

摘要翻译： 导热片包括导热聚合物层，设置在导热聚合物层的外表面上的粘合剂层和作为设置在粘合剂层上的功能层的热扩散层。 导热聚合物层由含有聚合物基质和导热填料的导热聚合物组合物形成。 导热性聚合物层的静摩擦系数为1.0以下。 粘合剂层的外形小于导热聚合物层的外形。

公开(公告)号：US08044521B2

公开(公告)日：2011-10-25

申请号：US12379178

申请日：2009-02-13

申请人： Mitsuru Ohta ,  Tomoki Kato

发明人： Mitsuru Ohta ,  Tomoki Kato

IPC分类号： H01L21/48

CPC分类号： H01L24/48 ,  H01L23/293 ,  H01L23/3171 ,  H01L24/05 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/01006

摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

摘要翻译： 提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。 半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。 引线框架设置在引线框架的两侧。 引线框架的一部分用封装树脂封装起到内引线的作用。 封装树脂由基本上不含卤素的树脂组合物组成。 此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。

公开(公告)号：US20090152729A1

公开(公告)日：2009-06-18

申请号：US12379178

申请日：2009-02-13

申请人： Mitsuru Ohta ,  Tomoki Kato

发明人： Mitsuru Ohta ,  Tomoki Kato

IPC分类号： H01L23/52 ,  H01L21/50

CPC分类号： H01L24/48 ,  H01L23/293 ,  H01L23/3171 ,  H01L24/05 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01202 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/01006

摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

摘要翻译： 提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。 半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。 引线框架设置在引线框架的两侧。 引线框架的一部分用封装树脂封装起到内引线的作用。 封装树脂由基本上不含卤素的树脂组合物组成。 此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。