公开(公告)号：US20090167110A1

公开(公告)日：2009-07-02

申请号：US11398840

申请日：2006-04-06

申请人： Ertugrul Berkcan ,  Robert John Wojnarowski ,  Emad Andarawis Andarawis ,  Samantha Rao ,  Eladio Delgado

发明人： Ertugrul Berkcan ,  Robert John Wojnarowski ,  Emad Andarawis Andarawis ,  Samantha Rao ,  Eladio Delgado

IPC分类号： F03G7/08 ,  H02N2/18

CPC分类号： H01L41/1136 ,  H02N2/188

摘要： A broad band energy harvesting system to harvest energy from a structure and associated methods are provided. The system includes a structure carrying a plurality of environmentally produced vibration frequencies extending over a frequency range and an energy harvesting apparatus positioned in vibration receiving communication with the structure to harvest energy from the structure. Each energy harvesting apparatus includes broadly tuned energy harvesting generators having relatively low quality factor and corresponding relatively wide bandwidth. The energy harvesting generators collectively provide energy harvesting over multiple modes to thereby provide energy harvesting over a substantial portion of the frequency range. Each energy harvesting generator can include a cantilevered beam connected to a common backbone comprised of a resilient material configured to transfer energy between adjacent generators to further enhance energy harvesting.

摘要翻译： 提供了一种从结构和相关方法收集能量的宽带能量收集系统。 该系统包括承载在频率范围上延伸的多个环境产生的振动频率的结构，以及定位在振动中的能量收集装置，该振动接收与结构的通信以从结构收集能量。 每个能量收集装置包括具有相对较低质量因素和相应较宽带宽的广泛调谐的能量采集发生器。 能量收集发电机在多种模式下共同提供能量收集，从而在频率范围的大部分内提供能量收集。 每个能量收集发生器可以包括连接到公共骨架的悬臂梁，弹性材料构造成在相邻发电机之间传递能量以进一步增强能量收集。

公开(公告)号：US20090078298A1

公开(公告)日：2009-03-26

申请号：US12328788

申请日：2008-12-05

申请人： Stanton Earl Weave, JR. ,  Robert John Wojnarowski

发明人： Stanton Earl Weave, JR. ,  Robert John Wojnarowski

IPC分类号： H01L35/34

CPC分类号： H01L35/32 ,  Y10T156/1092

摘要： A device includes first and second electrically conductive substrates that are positioned opposite from one another. The device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

摘要翻译： 一种器件包括彼此相对定位的第一和第二导电衬底。 该装置还包括设置在第一和第二导电基底之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电基底之间的密封层包含。

公开(公告)号：US07498507B2

公开(公告)日：2009-03-03

申请号：US11081986

申请日：2005-03-16

申请人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

发明人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

IPC分类号： H01L35/30 ,  H02N10/00

CPC分类号： H01L35/32 ,  Y10T156/1092

摘要： A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

摘要翻译： 固态热转印装置包括彼此相对定位的第一和第二导电基板。 固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电 底物。

公开(公告)号：US07262444B2

公开(公告)日：2007-08-28

申请号：US11205903

申请日：2005-08-17

申请人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

发明人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

IPC分类号： H01L31/111 ,  H01L21/48

CPC分类号： H01L23/4822 ,  H01L23/4821 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92135 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through the one or more though holes aligned with the contact pads to electrically couple the conductive layer to the contact pads. In certain embodiments, one or more air gaps may be formed between the dielectric film and the active surface of the at least one power semiconductor chip. Methods for fabricating the semiconductor chip packaging structure are also disclosed.

摘要翻译： 一种半导体芯片封装结构，包括具有与至少一个功率半导体芯片的一个或多个接触焊盘对准的一个或多个通孔的电介质膜。 与电介质膜相邻的图案化导电层具有一个或多个导电柱，其延伸穿过与接触焊盘对准的一个或多个通孔，以将导电层电耦合到接触焊盘。 在某些实施例中，可以在介电膜和至少一个功率半导体芯片的有源表面之间形成一个或多个气隙。 还公开了制造半导体芯片封装结构的方法。

公开(公告)号：US06474860B2

公开(公告)日：2002-11-05

申请号：US09861436

申请日：2001-05-21

申请人： Robert John Wojnarowski ,  Glenn Alan Forman ,  Yung Sheng Liu

发明人： Robert John Wojnarowski ,  Glenn Alan Forman ,  Yung Sheng Liu

IPC分类号： G06B626

CPC分类号： H01L24/73 ,  G02B6/4225 ,  G02B6/43 ,  H01L23/48 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00

摘要： An optical interface for data communication that can be manufactured and aligned in a cost effective manner includes an array of optical emitters and an optical receiver are positioned within a predetermined tolerance with reference to each other so as to establish an optical data communication path. To search for and determine which of the emitters of the array achieves the best alignment, the optical emitters are individually energized in a sequence, while monitoring the output signal of the optical receiver. For subsequent data communications, the optical emitter determined to achieve the best alignment is employed.

摘要翻译： 可以以成本有效的方式制造和对准的用于数据通信的光学接口包括光发射器阵列和光学接收器相对于彼此定位在预定的公差内，以便建立光学数据通信路径。 为了搜索并确定阵列中的哪一个发射器达到最佳对准，在监视光接收机的输出信号的同时，光发射器以一个顺序分别通电。 对于随后的数据通信，采用确定达到最佳对准的光发射器。

公开(公告)号：US06396153B2

公开(公告)日：2002-05-28

申请号：US09768598

申请日：2001-01-25

申请人： Raymond Albert Fillion ,  Ernest Wayne Balch ,  Ronald Frank Kolc ,  William Edward Burdick, Jr. ,  Robert John Wojnarowski ,  Leonard Richard Douglas ,  Thomas Bert Gorczyca

发明人： Raymond Albert Fillion ,  Ernest Wayne Balch ,  Ronald Frank Kolc ,  William Edward Burdick, Jr. ,  Robert John Wojnarowski ,  Leonard Richard Douglas ,  Thomas Bert Gorczyca

IPC分类号： H01L2348

CPC分类号： H01L24/48 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/24227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/85399 ,  H01L2224/92144 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01073 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One method for packaging at least one circuit chip includes: providing an interconnect layer including insulative material having a first side and a second side, initial metallization patterned on second side metallized portions of the second side and not on second side non-metallized portions of the second side, at least one substrate via extending from the first side to one of the second side metallized portions, and at least one chip via extending from the first side to one of the second side non-metallized portions; positioning the at least one circuit chip on the second side with at least one chip pad of the at least one circuit chip being aligned with the at least one chip via; and patterning connection metallization on selected portions of the first side of the interconnect layer and in the vias so as to extend to the at least one second side metallized portion and to the at least one chip pad. In related embodiments vias are pre-metallized and coupled to chip pads of the circuit chips by an electrically conductive binder. Thin film passive components and multilayer interconnections can additionally be incorporated into the package.

摘要翻译： 一种用于封装至少一个电路芯片的方法包括：提供包括具有第一侧和第二侧的绝缘材料的互连层，在第二侧的第二侧金属化部分上而不是在第二侧非金属化部分上图案化的初始金属化 第二侧，至少一个从第一侧延伸到第二侧金属化部分之一的衬底通孔;以及至少一个芯片通孔，其从第一侧延伸到第二侧非金属化部分之一; 将所述至少一个电路芯片定位在所述第二侧上，所述至少一个电路芯片的至少一个芯片焊盘与所述至少一个芯片通孔对准; 以及在所述互连层的第一侧和所述通孔的选定部分上图案化连接金属化，以便延伸到所述至少一个第二侧金属化部分和所述至少一个芯片焊盘。 在相关实施例中，通孔被预先金属化并且通过导电粘合剂耦合到电路芯片的芯片焊盘。 薄膜无源元件和多层互连可另外包含在封装中。

公开(公告)号：US06272271B1

公开(公告)日：2001-08-07

申请号：US09301910

申请日：1999-04-29

申请人： Robert John Wojnarowski ,  Glenn Alan Forman ,  Yung Sheng Liu

发明人： Robert John Wojnarowski ,  Glenn Alan Forman ,  Yung Sheng Liu

IPC分类号： G02B626

CPC分类号： H01L24/73 ,  G02B6/4225 ,  G02B6/43 ,  H01L23/48 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00

摘要： An optical interface for data communication that can be manufactured and aligned in a cost effective manner includes an array of optical emitters and an optical receiver are positioned within a predetermined tolerance with reference to each other so as to establish an optical data communication path. To search for and determine which of the emitters of the array achieves the best alignment, the optical emitters are individually energized in a sequence, while monitoring the output signal of the optical receiver. For subsequent data communications, the optical emitter determined to achieve the best alignment is employed.

公开(公告)号：US6040226A

公开(公告)日：2000-03-21

申请号：US177908

申请日：1998-10-23

申请人： Robert John Wojnarowski ,  James Wilson Rose ,  Ernest Wayne Balch ,  Leonard Richard Douglas ,  Evan Taylor Downey ,  Michael Gdula

发明人： Robert John Wojnarowski ,  James Wilson Rose ,  Ernest Wayne Balch ,  Leonard Richard Douglas ,  Evan Taylor Downey ,  Michael Gdula

IPC分类号： H01L21/20

CPC分类号： H01L21/20

摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.

摘要翻译： 提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。 电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。 薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。 可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

公开(公告)号：US07482634B2

公开(公告)日：2009-01-27

申请号：US10950029

申请日：2004-09-24

申请人： Robert John Wojnarowski ,  Stanton Earl Weaver, Jr. ,  Abasifreke Udo Ebong ,  Xian An (Andrew) Cao ,  Steven Francis LeBoeuf ,  Larry Burton Rowland ,  Stephen D. Arthur

发明人： Robert John Wojnarowski ,  Stanton Earl Weaver, Jr. ,  Abasifreke Udo Ebong ,  Xian An (Andrew) Cao ,  Steven Francis LeBoeuf ,  Larry Burton Rowland ,  Stephen D. Arthur

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L27/153 ,  H01L33/32

摘要： The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED's. In an embodiment of the invention, the UV-LED's are characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the base structure has a mesa configuration, which mesa configuration may be rounded on a boundary surface, or which may be non-rounded, such as a mesa having an upper boundary surface that is flat. In other words, the p-type metal resides upon a mesa formed out of the base structure materials. In a more specific embodiment, the UV-LED structure includes n-type metallization layer, passivation layers, and bond pads positioned at appropriate locations of the device. In a more specific embodiment, the p-type metal layer is encapsulated in the encapsulating layer.

摘要翻译： 本发明涉及一种紫外线能量源，其中源是紫外线发射的LED。 在本发明的实施例中，UV-LED的特征在于基底层材料，其包括基底，p掺杂半导体材料，多量子阱，n掺杂半导体材料，基底材料为p型金属 并且其中基部结构具有台面构造，该台面构造可以在边界表面上圆化，或者可以是非圆形的，例如具有平坦的上边界表面的台面。 换句话说，p型金属位于由基底结构材料形成的台面上。 在更具体的实施例中，UV-LED结构包括位于设备适当位置的n型金属化层，钝化层和接合焊盘。 在更具体的实施例中，p型金属层被封装在封装层中。

公开(公告)号：US20080305582A1

公开(公告)日：2008-12-11

申请号：US11846024

申请日：2007-08-28

申请人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

发明人： Raymond Albert Fillion ,  Richard Alfred Beaupre ,  Ahmed Elasser ,  Robert John Wojnarowski ,  Charles Steven Korman

IPC分类号： H01L21/50

CPC分类号： H01L23/4821 ,  H01L23/4822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83801 ,  H01L2224/92144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor chip packaging structure is fabricated by using a dielectric film with two surfaces, and a power semiconductor chip with an active surface having contact pads. An adhesive layer is used to connect the first surface of the dielectric film and the active surface of the power semiconductor chip. A patterned electrically conductive layer is formed adjacent to the second surface of the film, extending through holes in the film to the contact pads.

摘要翻译： 通过使用具有两个表面的电介质膜和具有接触焊盘的有源表面的功率半导体芯片来制造半导体芯片封装结构。 使用粘合剂层来连接电介质膜的第一表面和功率半导体芯片的有源表面。 形成邻近膜的第二表面的图案化导电层，延伸穿过膜中的孔到接触垫。