公开(公告)号：US20120262885A1

公开(公告)日：2012-10-18

申请号：US13358540

申请日：2012-01-26

申请人： Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro IKEDA ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H05K1/18

CPC分类号： H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09227 ,  H05K2201/09772 ,  H05K2201/10545 ,  H05K2201/10689

摘要： Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.

摘要翻译： 提供了一种使用具有高包装密度的低成本电路板的信号传输电路，但是能够减少信号线之间的串扰噪声并且还减少由于短截线引起的反射噪声。 本发明的信号传输电路被配置为使得电子部件和通孔过孔的引线端子分别通过表面布线彼此连接，以便不允许从通孔过孔的中间分支。 此外，连接第一电子部件的第一布线分别布置在连接第二电子部件的相应的一对第二布线之间，并且信号通过交错传输通过第一布线和第二布线传输。

公开(公告)号：US07168242B2

公开(公告)日：2007-01-30

申请号：US10774490

申请日：2004-02-10

申请人： Yutaka Uematsu ,  Jin Yokoyama

发明人： Yutaka Uematsu ,  Jin Yokoyama

IPC分类号： F01N3/00

CPC分类号： F02D41/0275 ,  B01D53/9495 ,  F02D2200/0802

摘要： This is a method for regenerating the NOx catalyst in a NOx purifying system provided in the exhaust passage with a direct reduction type NOx catalyst which directly decomposes the NOx during lean-condition operation and is regenerated at rich-condition operation, and the method prohibiting the rich-condition control when the temperature detected by a catalyst temperature detecting means is within the predetermined temperature range.Thus, when the exhaust gas are temporarily made rich-condition for catalyst regeneration which means recovering the NOx purifying ability of the direct reduction type NOx catalyst arranged in the exhaust passage of the engine, the NOx is prohibited from being discharged into the atmospheric air, and also the purifying ability can surely be recovered.

摘要翻译： 这是在排气通路内设置的NOx净化系统中，使用直接还原型NOx催化剂再生NO x催化剂的方法，所述直接还原型NOx催化剂在稀薄状态运行中直接分解NOx并在富氧运行时再生，并且该方法禁止 当由催化剂温度检测装置检测到的温度在预定温度范围内时，进行浓缩状态控制。 因此，当废气临时处于催化剂再生的浓缩状态时，这意味着回收排放在发动机排气通道中的直接还原型NOx催化剂的NOx净化能力，可以禁止NOx排入大气中， 净化能力也可以肯定地恢复。

公开(公告)号：US5113469A

公开(公告)日：1992-05-12

申请号：US663311

申请日：1991-03-01

申请人： Genichi Hatakoshi ,  Kazutaka Terashima ,  Masaru Kawachi ,  Yutaka Uematsu

发明人： Genichi Hatakoshi ,  Kazutaka Terashima ,  Masaru Kawachi ,  Yutaka Uematsu

IPC分类号： G02F1/37 ,  G02F1/377 ,  G02F1/383

CPC分类号： G02F1/377 ,  G02F1/383 ,  G02F2001/374 ,  G02F2202/20

摘要： An optical wavelength-converting device for generating the second-harmonic wave through Cerenkov radiation has a substrate made from nonlinear optical crystal which acts as a cladding layer. Formed on the top surface of the substrate is a long, narrow optical waveguide layer, whose refractive index is larger than that of the substrate. In the substrate, multi-layered domain-inverted sections are formed. With this arrangement, the nonlinear coefficient is locally changed, thereby compensating for phase mismatching between the fundamental wave and the second-harmonic wave in the direction perpendicular to the substrate's surface. This compensation helps improve the efficiency in converting the laser input light of the fundamental wave into the second-harmonic wave.

公开(公告)号：US5065404A

公开(公告)日：1991-11-12

申请号：US551996

申请日：1990-07-12

申请人： Masaki Okajima ,  Genichi Hatakoshi ,  Masayuki Ishikawa ,  Yutaka Uematsu ,  Nawoto Motegi

发明人： Masaki Okajima ,  Genichi Hatakoshi ,  Masayuki Ishikawa ,  Yutaka Uematsu ,  Nawoto Motegi

IPC分类号： H01S5/20 ,  H01S5/22 ,  H01S5/223 ,  H01S5/32 ,  H01S5/323

CPC分类号： H01S5/2231 ,  H01S5/204 ,  H01S5/221 ,  H01S5/3211 ,  H01S5/32308 ,  H01S5/32325

摘要： A visible-light wavelength continuous oscillation laser is disclosed which has an N type GaAs substrate, an N type GaAlAs cladding layer formed on the substrate, and a non-doped GaAlAs active layer formed on the cladding layer. The laser further includes two N type GaAlAs layers, a P type GaAlAs optical guide layer, a P type cladding layer consisting of upper and lower portions, and a ridge section. The N type GaAlAs layers contact both sides of the ridge section. The optical guide layer is sandwiched between the upper and lower portions of the P type cladding layer, is located within the ridge section, and has a refractive index greater than that of the P type cladding layer. The distance between the active layer and the optical guide layer does not depend on the condition in which etching is performed to form the ridge section, but depends basically on the time required to grow crystal.

公开(公告)号：US20140103542A1

公开(公告)日：2014-04-17

申请号：US14109618

申请日：2013-12-17

申请人： Mitsuaki KATAGIRI ,  Ken Iwakura ,  Yutaka Uematsu

发明人： Mitsuaki KATAGIRI ,  Ken Iwakura ,  Yutaka Uematsu

IPC分类号： H01L23/498

CPC分类号： H01L23/498 ,  G11C5/06 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05013 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15173 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.

摘要翻译： 半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指， 以及多个第二电源电压接合指。 信号焊盘通过第一线分别连接到信号键指。 第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。 第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。

公开(公告)号：US20050153828A1

公开(公告)日：2005-07-14

申请号：US10508551

申请日：2003-03-28

申请人： Taiji Uekusa ,  Teruo Nakada ,  Kazuhiro Enoki ,  Yutaka Uematsu ,  Tetsuya Fujita ,  Yousuke Tanaka ,  Jin Yokoyama ,  Hiromi Shibuya

发明人： Taiji Uekusa ,  Teruo Nakada ,  Kazuhiro Enoki ,  Yutaka Uematsu ,  Tetsuya Fujita ,  Yousuke Tanaka ,  Jin Yokoyama ,  Hiromi Shibuya

IPC分类号： F02D43/00 ,  B01D53/94 ,  F01N3/02 ,  F01N3/022 ,  F01N3/023 ,  F01N3/035 ,  F01N3/08 ,  F01N3/20 ,  F01N3/22 ,  F01N3/24 ,  F01N3/28 ,  F01N3/30 ,  F01N11/00 ,  F01N13/02 ,  F02B29/04 ,  F02B37/00 ,  F02B37/16 ,  F02D41/04 ,  F02D45/00 ,  F02M25/07 ,  B01J29/04

CPC分类号： F02B37/164 ,  F01N3/023 ,  F01N3/035 ,  F01N3/0821 ,  F01N3/0885 ,  F01N3/20 ,  F01N3/22 ,  F01N3/30 ,  F01N11/00 ,  F01N13/0097 ,  F01N2260/04 ,  F01N2570/14 ,  F02B29/0406 ,  F02B37/00 ,  F02B37/168 ,  F02M26/05 ,  F02M26/10 ,  F02M26/28 ,  Y02A50/2344 ,  Y02T10/144

摘要： To provide an exhaust gas purifying system and a control method therefor, capable of burning and removing PM collected at the downstream side of a DPF by utilizing HC and CO generated when performing the operation for recovering the NOx direct reduction type catalyst from a catalyst deterioration due to poisoning with sulfur. The exhaust gas purifying system (10) having a NOx direct reduction type catalyst (3) for purging NOx in an exhaust gas and a DPF (4) with a catalyst for purging PM in the exhaust gas are sequentially arranged in an exhaust gas passage (2) in that order in the direction of from an upstream side to a downstream side, which further comprises an air supply system (5) for supplying air (Aa) between the NOx direct reduction type catalyst (3) and the DPF (4) with a catalyst during a operation for recovering the NOx direct reduction type catalyst (3) from a catalyst deterioration due to poisoning with sulfur by bringing the oxygen concentration in the exhaust gas to be substantially zero and raising the exhaust gas temperature.

摘要翻译： 为了提供一种废气净化系统及其控制方法，能够通过利用由催化剂劣化进行NOx还原型催化剂的回收操作而产生的HC和CO燃烧除去在DPF的下游侧收集的PM 用硫中毒。 具有用于排出废气中的NOx的NOx直接还原型催化剂（3）的排气净化系统（10）和排气中的用于除去PM的催化剂的DPF（4）排列在排气通路 2）从上游侧到下游侧的顺序，其还包括用于在NOx直接还原型催化剂（3）和DPF（4）之间供应空气（Aa）的供气系统（5） 在通过使废气中的氧浓度基本上为零并且提高废气温度的情况下，在由于硫的中毒引起的催化剂劣化的操作中，催化剂用于回收NOx直接还原型催化剂（3）。

公开(公告)号：US06725832B2

公开(公告)日：2004-04-27

申请号：US10303533

申请日：2002-11-25

申请人： Jin Yokoyama ,  Yutaka Uematsu

发明人： Jin Yokoyama ,  Yutaka Uematsu

IPC分类号： F02M2507

CPC分类号： F02D41/0052 ,  F02B3/06 ,  F02B23/0672 ,  F02B29/0406 ,  F02D35/0007 ,  F02D41/187 ,  F02D2041/0017 ,  F02D2041/2027 ,  F02D2200/0404 ,  F02M26/05 ,  F02M26/10 ,  F02M26/23 ,  F02M26/53 ,  Y02T10/125 ,  Y02T10/47

摘要： Adequate controllability is ensured when feedback control is provided to both the EGR valve and the intake throttle valve, and switching shock is prevented when control is switched from one to the other. The present apparatus comprises an EGR valve, an intake throttle valve, feedback control means for providing feedback control to the EGR valve and intake throttle valve such that the actual EGR volume approximates the target EGR volume corresponding to the running condition of the engine, and limiting means for limiting the operable opening ranges of the EGR valve and intake throttle valve in accordance with the target EGR volume. During EGR control of one valve, feedback control is provided to the other valve and the target opening is constantly calculated. The actual operations are merely limited, so these operations can start from the optimal opening and the switching shock can be prevented when a switch is made to the control of the other valve.

摘要翻译： 当向EGR阀和进气节流阀提供反馈控制时，确保了足够的可控性，并且当控制从一个切换到另一个时防止了切换冲击。 本发明的装置包括EGR阀，进气节流阀，用于向EGR阀和进气节流阀提供反馈控制的反馈控制装置，使得实际EGR体积接近于对应于发动机的运行状态的目标EGR容积，并限制 用于根据目标EGR容积限制EGR阀和进气节气门的可操作开启范围的装置。 在一个阀的EGR控制期间，向另一个阀提供反馈控制，并且不断地计算目标开度。 实际操作仅限于此，这些操作可以从最佳打开开始，并且当切换到另一个阀的控制时可以防止切换冲击。

公开(公告)号：US4893313A

公开(公告)日：1990-01-09

申请号：US323400

申请日：1989-03-14

申请人： Genichi Hatakoshi ,  Kazuhiko Itaya ,  Shigeya Naritsuka ,  Masayuki Ishikawa ,  Hajime Okuda ,  Hideo Shiozawa ,  Yukio Watanabe ,  Yasuo Ohba ,  Yoshihiro Kokubun ,  Yutaka Uematsu

发明人： Genichi Hatakoshi ,  Kazuhiko Itaya ,  Shigeya Naritsuka ,  Masayuki Ishikawa ,  Hajime Okuda ,  Hideo Shiozawa ,  Yukio Watanabe ,  Yasuo Ohba ,  Yoshihiro Kokubun ,  Yutaka Uematsu

IPC分类号： H01S5/20 ,  H01S5/223 ,  H01S5/32 ,  H01S5/323

CPC分类号： H01S5/32325 ,  H01S5/2004 ,  H01S5/2231 ,  H01S5/3211

摘要： In a semiconductor laser device, for emitting a laser beam having a wavelength .lambda., an n-type In.sub.0.5 (Ga.sub.1-x Al.sub.x)P first cladding layer is formed on an n-type GaAs substrate. An undoped InGaP active layer is formed on the first cladding layer and a p-type In.sub.0.5 (Ga.sub.1-x Al.sub.x).sub.0.5 P cladding layer is formed on the active layer. A p-type InGaP cap layer is formed on the second cladding layer and an n-type GaAs current restricting layer is formed on the second cladding layer. The aluminum composition ratio x of the cladding layer is 0.7. The active layer has a thickness of 0.06 .mu.m and the cladding layers have the same thickness H of 0.85 .mu.m. The active layer and the cladding layers have refractive indices n.sub.a and n.sub.c which satisfies the following inequalities:0.015.DELTA..sup.1/2

公开(公告)号：US08988160B2

公开(公告)日：2015-03-24

申请号：US13004609

申请日：2011-01-11

申请人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

发明人： Yasuhiro Ikeda ,  Yutaka Uematsu ,  Satoshi Muraoka

IPC分类号： H03H2/00 ,  H03H7/38 ,  H04B3/02

CPC分类号： H04B3/02

摘要： A data transmission system is provided in which it is possible to perform both of suppressing the degrading of the slew rate and suppressing the ringing even if load capacitance of an input buffer is changed.The data transmission system transmitting data from an output buffer to the input buffer through a trace is provided with first RC parallel circuits connected in series to the trace on a first Printed Circuit Board (PCB) on which the output buffer is mounted, and second RC parallel circuits connected in series to the trace on a second Printed Circuit Board (PCB) on which the input buffer is mounted, and which can be connected and separated to and from the first Printed Circuit Board (PCB).

摘要翻译： 提供了一种数据传输系统，其中即使输入缓冲器的负载电容改变，也可以同时执行抑制转换速率的降级和抑制振铃的两者。 通过轨迹将数据从输出缓冲器传输到输入缓冲器的数据传输系统提供有与其上安装有输出缓冲器的第一印刷电路板（PCB）上的迹线串联连接的第一RC并联电路，以及第二RC 并联电路与安装有输入缓冲器的第二印刷电路板（PCB）上的迹线串联连接，并且可以与第一个印刷电路板（PCB）连接和分离。

公开(公告)号：US08633596B2

公开(公告)日：2014-01-21

申请号：US13291740

申请日：2011-11-08

申请人： Mitsuaki Katagiri ,  Ken Iwakura ,  Yutaka Uematsu

发明人： Mitsuaki Katagiri ,  Ken Iwakura ,  Yutaka Uematsu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/498 ,  G11C5/06 ,  H01L23/525 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05013 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/49431 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15173 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor device including a plurality of signal pads and a plurality of auxiliary pads which are alternatively arranged in a predetermined direction, and a package board including a plurality of signal bond fingers, a plurality of first power supply voltage bond fingers, and a plurality of second power supply voltage bond fingers. The signal pads are connected respectively to the signal bond fingers by first wires. The first power supply voltage bond fingers and the second power supply voltage bond fingers are connected respectively to the auxiliary pads by second wires. The first wires are disposed between those of the second wires which are connected to the first power supply voltage bond fingers and those of the second wires which are connected to the second power supply voltage bond fingers.

摘要翻译： 半导体封装包括：半导体器件，包括多个信号焊盘和沿预定方向交替布置的多个辅助焊盘;以及封装板，包括多个信号键合指，多个第一电源电压键合指， 以及多个第二电源电压接合指。 信号焊盘通过第一线分别连接到信号键指。 第一电源电压键指和第二电源电压键合指通过第二线分别连接到辅助焊盘。 第一导线设置在连接到第一电源电压接合指的第二配线和连接到第二电源电压接合指的第二配线之间。