公开(公告)号：US5653587A

公开(公告)日：1997-08-05

申请号：US573667

申请日：1995-12-18

Applicant: David Heller ,  James Neville

Inventor： David Heller ,  James Neville

IPC: B23K1/008 ,  H01L21/677 ,  F27B9/00 ,  F27B3/00

CPC classification number: H01L21/67706 ,  B23K1/008 ,  H01L21/6776 ,  B23K2201/36

Abstract: A method of transporting an article through a processing housing while minimizing the loss of a controlled atmosphere from the process housing. This method includes the steps of placing an article on a first carriage member, then vertically displacing the article from the entry level through an entry opening of entry housing to a processing level. The article is then transferred from the first carriage member to an endless conveyor for transporting, horizontally, through the process housing. The article is then transferred to a second carriage member which moves the article vertically through a exit housing to and through an exit opening near an exit level. The processed article is then removed at the exit level. The vertical distance between the process level and the entry opening and the exit opening separates the controlled atmosphere from the ambient atmosphere exterior of the housings.

Abstract translation: 一种将制品运送通过处理壳体同时最小化来自过程壳体的受控气氛的损失的方法。 该方法包括以下步骤：将物品放置在第一托架构件上，然后将物品从入口级垂直移位通过入口壳体的入口开口到处理水平。 然后将物品从第一托架构件转移到环形输送机，用于水平地运送通过过程壳体。 然后将物品转移到第二托架构件，该第二托架构件将物品垂直地移动通过出口壳体并通过靠近出口水平的出口开口移动。 然后在出口处移除处理后的物品。 处理水平与进入开口和出口之间的垂直距离将受控气氛与壳体外部的环境大气分开。

公开(公告)号：US5616258A

公开(公告)日：1997-04-01

申请号：US515946

申请日：1995-04-16

Applicant: Edward L. Dreizin ,  William Felder

Inventor： Edward L. Dreizin ,  William Felder

IPC: B23K9/00

CPC classification number: B23K9/0008 ,  B23K2201/36

Abstract: There is disclosed a process and apparatus for generating uniform filler metal droplets of a size of from 50 to 1000 .mu.m for deposition onto small metal parts and components thereby producing localized heating and melting of the components to be joined.

Abstract translation: 公开了一种用于产生尺寸为50-1000μm的均匀填充金属液滴的方法和装置，用于沉积到小金属部件和部件上，从而产生待接合部件的局部加热和熔化。

公开(公告)号：US5614113A

公开(公告)日：1997-03-25

申请号：US437124

申请日：1995-05-05

Applicant: Ming J. Hwang ,  Harold J. Dowell

Inventor： Ming J. Hwang ,  Harold J. Dowell

IPC: B23K20/24 ,  B23K26/20 ,  B23K26/00

CPC classification number: B23K20/24 ,  B23K26/20 ,  H01L24/78 ,  H01L24/85 ,  B23K2201/32 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14

Abstract: The method and apparatus utilize a laser to heat bond pads. While the bond pads are hot, a wire is bonded to the bond pad. The method and apparatus of the present invention may also be used to heat a lead finger of an integrated circuit lead frame using a laser and to bond a wire to the lead finger while the lead finger is hot.

Abstract translation: 该方法和装置利用激光加热接合焊盘。 当接合焊盘是热的时候，导线被接合到接合焊盘。 本发明的方法和装置还可以用于使用激光加热集成电路引线框架的引线指，并且在引线指状物热时将引线键合到引线指状物。

公开(公告)号：US5565033A

公开(公告)日：1996-10-15

申请号：US448958

申请日：1995-05-24

Applicant: Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

Inventor： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

IPC: B05C5/02 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  B05C1/16

CPC classification number: H01L24/27 ,  B23K3/0692 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/83 ,  H05K3/1233 ,  H05K3/3484 ,  B23K2201/36 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K3/321 ,  H05K3/3452 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.

Abstract translation: 在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。 具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。 导电垫对应于芯片附接位置。 使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。 然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。 然后将注射头从掩模的表面去除。 如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。 如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。 当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

公开(公告)号：US5556024A

公开(公告)日：1996-09-17

申请号：US315319

申请日：1994-09-29

Applicant: David C. Olson ,  Robert Phillips, III

Inventor： David C. Olson ,  Robert Phillips, III

IPC: B23K1/018 ,  G01R1/04 ,  G01R31/28 ,  H01L21/60 ,  H05K13/04 ,  H05K3/30 ,  B23K3/00

CPC classification number: H05K13/0486 ,  B23K1/018 ,  G01R1/0483 ,  G01R31/2867 ,  H01L24/799 ,  H01L24/98 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/131 ,  H01L2224/75703 ,  H01L2224/7999 ,  H01L2224/98 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T156/19

Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.

公开(公告)号：US5551626A

公开(公告)日：1996-09-03

申请号：US394482

申请日：1995-02-27

Applicant: Yo Hasegawa ,  Masahiro Nagasawa ,  Masahide Tsukamoto

Inventor： Yo Hasegawa ,  Masahiro Nagasawa ,  Masahide Tsukamoto

IPC: B23K20/16 ,  B23K35/00 ,  B23K35/02 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H05K3/34

CPC classification number: B23K20/16 ,  B23K35/007 ,  H05K3/4069 ,  B23K2201/36 ,  B23K35/025 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/1461 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623

Abstract: The present invention relates to a diffusion joining method of Cu or Cu alloy surface and a conductive paste used therefor, especially applied to a method for preparing a multilayer printed wiring board. The present invention is characterized by providing the contacting surfaces with a layer selected from the group comprising a noble metal thin layer, a metal oxide remover layer and a conductive paste layer mainly consisting of a Cu or Cu alloy particles and the metal oxide remover; and pressing the contacting metal surfaces at a temperature higher than 170.degree. C. more or less whereat the Cu atom at interface of the Cu or Cu alloy surfaces to be joined becomes to be able to diffuse, to give a joined metal body.

Abstract translation: 本发明涉及Cu或Cu合金表面的扩散接合方法及其用途的导电糊，特别适用于制备多层印刷线路板的方法。 本发明的特征在于，使接触表面具有选自贵金属薄层，金属氧化物去除层和主要由Cu或Cu合金颗粒和金属氧化物去除剂组成的导电浆料层的层; 并且在Cu或Cu合金表面的接合处的Cu原子变得能够扩散的情况下，或多或少地在高于170℃的温度下压接接触的金属表面，从而形成接合的金属体。

公开(公告)号：US5520323A

公开(公告)日：1996-05-28

申请号：US244996

申请日：1994-06-20

Applicant: Franz Hauner ,  Manfred Schneider

Inventor： Franz Hauner ,  Manfred Schneider

IPC: B23K1/002 ,  B23K1/20 ,  B23K35/00 ,  H01H1/02 ,  H01H1/025 ,  H01H11/04 ,  B23K37/06

CPC classification number: B23K35/007 ,  B23K1/002 ,  B23K1/20 ,  B23K2201/36 ,  B23K2201/40 ,  Y10T29/49213 ,  Y10T428/12229 ,  Y10T428/12611

Abstract: Contacts such as contact points, contact strips, or contact sections are usually provided with hard solder on a copper-silver basis in the form of a flat solder layer. The contact is then connected over this solder layer with a contact carrier. The solder layer is melted, whereupon the free surface of the solder layer (13, 130) is covered during melting with a material (1, 5, 15) that has no solubility with silver or copper. The material can, during melting of the solder, form a covering (1, 15) beneath the contact (10, 12, 100) provided on its solder side with the solder layer (13, 130) or can also form a covering over the contact (10, 12, 100) provided on its solder side with the solder layer (13, 130). As materials for covering the solder layer (13, 130), high-melting metals, preferably tantalum, or a ceramic are used. In the case of a semi-finished product for use as a contact, the solder layer (13, 130) is in intimate contact over its entire surface with the solder side of the contact (10, 12, 100 ) and has the structure of a melt.

Abstract translation: PCT No.PCT / DE92 / 01073 Sec。 371日期：1994年6月20日 102（e）日期1994年6月20日PCT提交1992年12月21日PCT公布。 第WO93 / 13535号公报 日期为1993年7月8日。接触点，接触片或接触部分的接触通常以铜 - 银为基础，以平坦焊料层的形式提供硬焊料。 接触件然后通过该焊料层与接触载体连接。 焊料层熔化，于是熔化期间用与银或铜不溶解的材料（1,5,15）覆盖焊料层（13,130）的自由表面。 在焊料熔化期间，该材料可以在其焊料侧上设置有焊料层（13,130）的接触件（10,12,100）下面形成覆盖物（1,15），或者也可形成覆盖物 在其焊料侧设置有焊料层（13,130）的接触（10,12,100）。 作为用于覆盖焊料层（13,130）的材料，使用高熔点金属，优选钽或陶瓷。 在用作接触的半成品的情况下，焊料层（13,130）在其整个表面上与触点（10,12,100）的焊料侧紧密接触，并且具有 一个熔体。

公开(公告)号：US5516032A

公开(公告)日：1996-05-14

申请号：US341057

申请日：1994-11-16

Applicant: Shoji Sakemi ,  Tadahiko Sakai

Inventor： Shoji Sakemi ,  Tadahiko Sakai

IPC: B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B23K1/00 ,  B23K3/00

CPC classification number: H01L24/12 ,  B23K3/0623 ,  H01L21/4853 ,  H01L24/11 ,  H05K3/3478 ,  B23K2201/36 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/014 ,  H05K2203/0278 ,  H05K2203/0415 ,  H05K2203/082

Abstract: The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.

Abstract translation: 本发明涉及在诸如芯片或基板的电子部件上形成凸块电极的方法。 用于形成凸块电极的常规方法具有导致成本高的因素，但是通过本发明，代替焊球，使用低成本的焊丝，即，将焊丝切割成预定长度，将切割的焊丝真空吸引 将其转移到芯片的下表面，然后将转印的焊料片加热熔化，然后冷却固化，形成半球状的凸块电极。

公开(公告)号：US5499756A

公开(公告)日：1996-03-19

申请号：US383145

申请日：1995-02-03

Applicant: Kingshuk Banerji ,  Edwin L. Bradley, III ,  Francisco Da Costa Alves

Inventor： Kingshuk Banerji ,  Edwin L. Bradley, III ,  Francisco Da Costa Alves

IPC: B23K1/00 ,  H05K3/12 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/0016 ,  H05K3/1225 ,  H05K3/3489 ,  B23K2201/36 ,  H05K2203/0143 ,  H05K2203/0191 ,  H05K2203/0264

Abstract: A method of applying a tacking agent to a printed circuit board. The printed circuit board (10) has a number of solder pads (12), and each solder pad is preclad with a layer of solder (14) between 0.02 and 0.3 mm thick. A plastic film (16) is temporarily adhered to the printed circuit board by a pressure sensitive adhesive. The plastic film has a number of apertures (22) that correspond to the solder pads, and is positioned so that the apertures in the film expose the solder coated pads. There is a breakaway tab (20) on the plastic film that is used to peel the film from the printed circuit board in a later operation. The film is roller coated with a high viscosity tacking agent (30) so that a layer of the tacking agent is applied to the exposed interconnect pads. The plastic film is then peeled cleanly away from the printed circuit board using the breakaway tab, leaving the tacking agent only on the solder pads. An electronic component (35) can then be placed on the printed circuit board in contact with the coated solder pads. The printed circuit board and the electronic component can then be heated to reflow the clad solder and form a solder joint between the solder pads and the component.

Abstract translation: 一种将印染电路板施加到印刷电路板上的方法。 印刷电路板（10）具有多个焊盘（12），并且每个焊盘预先具有0.02-0.3mm厚的焊料层（14）。 通过压敏粘合剂将塑料膜（16）暂时粘附到印刷电路板上。 塑料膜具有与焊盘相对应的多个孔（22），并且被定位成使得膜中的孔露出焊料涂覆的焊盘。 在塑料膜上有一个分离片（20），用于在稍后的操作中从印刷电路板剥离膜。 该薄膜用高粘度粘合剂（30）辊涂，以便将一层粘合剂施加到暴露的互连垫上。 然后使用分离片将塑料膜从印刷电路板上干净地剥离，仅将粘合剂留在焊盘上。 然后可以将电子部件（35）放置在与涂覆的焊盘接触的印刷电路板上。 然后可以加热印刷电路板和电子部件以回流包覆焊料并在焊盘和部件之间形成焊接接头。

公开(公告)号：US5497938A

公开(公告)日：1996-03-12

申请号：US299520

申请日：1994-09-01

Applicant: John F. McMahon ,  George Chiu

Inventor： John F. McMahon ,  George Chiu

IPC: B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H05K3/34 ,  B23K3/08

CPC classification number: H01L24/16 ,  B23K3/0623 ,  B23K3/0692 ,  B23K35/0222 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/27438 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/303 ,  Y02P70/613

Abstract: A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms may be shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.

Abstract translation: 公开了一卷带有焊料形式的胶带以及用于仅将焊料形成或将两种焊料形式和带的部分两者转移到电子部件的方法。 电子元件可以是集成电路芯片，芯片封装和印刷电路板中的任何一种。 将焊料形式转移到电子部件是一个两步的过程：（a）焊料形式定位并离线放置在一卷胶带上，（b）胶带上的焊料形式被转移到电子部件中 一条装配线。 焊料形式可能暂时或永久性地附着在磁带上。 首先，仅传送焊料形式。 在后一种情况下，带部分被转移到具有焊料形式的电子部件。 焊料形式可以使用UV敏感粘合剂或冷粘合剂（例如助焊剂）附接到带的一侧或带中的通孔中。 可以通过将焊料形式压在电子部件上，将UV敏感粘合剂暴露于UV光或使用“指甲床”来消除焊料形式。 此外，焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。 胶带是导热和耐热的，并且可以具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。