公开(公告)号：US20140000650A1

公开(公告)日：2014-01-02

申请号：US13979914

申请日：2012-02-09

Applicant: Neal Wood ,  Dirk Tews

Inventor： Neal Wood ,  Dirk Tews

IPC: H05K3/26

CPC classification number: H05K3/26 ,  C23F1/40 ,  H01L21/32115 ,  H01L21/32134 ,  H01L21/7684 ,  H05K3/3473 ,  H05K2203/054 ,  H05K2203/0793

Abstract: The invention discloses a process for planarization of recessed structures filled with tin or a tin alloy which avoids the formation of dimples. Such structures can serve as solder deposits for stable and reliable solder joints in electronic devices.

Abstract translation: 本发明公开了一种用于平坦化填充有锡或锡合金的凹陷结构的方法，其避免形成凹坑。 这种结构可以用作电子器件中稳定且可靠的焊点的焊料沉积物。

公开(公告)号：US20130087370A1

公开(公告)日：2013-04-11

申请号：US13617366

申请日：2012-09-14

Applicant: Masatoshi INABA ,  Hiroshi MIYATA ,  Hirohito WATANABE

Inventor： Masatoshi INABA ,  Hiroshi MIYATA ,  Hirohito WATANABE

IPC: B32B38/10 ,  H05K1/00

CPC classification number: H05K3/244 ,  H05K1/118 ,  H05K3/26

Abstract: A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles α1 and α2 between the polishing direction of the exposed portion of the copper layer and the bending lines C1 and C2 satisfy the following formula (1): 30[°]≦α1 and α2≦150[°]  (1).

Abstract translation: 制造印刷电路板的方法包括：在基膜上形成互连图形的铜层; 将盖层叠在基膜上，以便从覆盖层露出铜层的一部分，并通过覆盖层覆盖铜层; 至少机械抛光铜层的暴露部分; 对铜层的露出部进行电镀处理，在铜层上形成镀层，铜层的露出部的研磨方向和弯曲线C1，C2的角度α1，α2 满足下列公式（1）：30 [°]＆nlE;α1和α2＆nlE; 150 [°]（1）。

公开(公告)号：US20130079267A1

公开(公告)日：2013-03-28

申请号：US13667169

申请日：2012-11-02

Applicant: Solvay Fluor GmbH

Inventor： Michael MARHOLD ,  Helge RAU ,  Karsten BORNER ,  Christoph MEURER

IPC: C11D7/60

CPC classification number: C23G5/02803 ,  C11D7/5059 ,  C23G5/02809 ,  C23G5/02864 ,  C23G5/02887 ,  H05K3/26

Abstract: Nonflammable compositions comprising fluorinated compounds selected from the group consisting of hydrofluoroalkanes, hydrofluoroalkenes, partially or perfluorinated aromatic compounds, hydrofluoroethers, and fluoroketones; 1,2-dichloroethylene, especially trans-1,2-dichloroethylene; and a stabilizer. These non-flammable compositions which preferably contain 1,1,1,3,3-pentafluorobutane, can be used especially as solvents for cleaning and defluxing electronic components and for degreasing metals. The compositions further may comprise a propellant, e.g. 1,1,1,2-tetrafluoroethane. These compositions are especially suitable as flushing agent.

Abstract translation: 包含选自氢氟烷烃，氢氟烯烃，部分或全氟化芳族化合物，氢氟醚和氟代酮的氟化化合物的不可燃组合物; 1,2-二氯乙烯，特别是反式-1,2-二氯乙烯; 和稳定剂。 优选含有1,1,1,3,3-五氟丁烷的这些不易燃组合物可特别用作洗涤和去除电子元件以及用于脱脂金属的溶剂。 组合物还可以包含推进剂，例如 1,1,1,2-四氟乙烷。 这些组合物特别适合作为冲洗剂。

公开(公告)号：US08402648B2

公开(公告)日：2013-03-26

申请号：US12364036

申请日：2009-02-02

Applicant: Daita Tsubamoto ,  Hitoshi Yokemura ,  Masaki Tosaka

Inventor： Daita Tsubamoto ,  Hitoshi Yokemura ,  Masaki Tosaka

IPC: H01K3/10

CPC classification number: B23K26/106 ,  B23K2101/42 ,  H05K1/115 ,  H05K3/0088 ,  H05K3/027 ,  H05K3/043 ,  H05K3/26 ,  H05K3/423 ,  H05K3/429 ,  H05K3/4688 ,  H05K2201/0761 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2203/0257 ,  H05K2203/0746 ,  H05K2203/0763 ,  H05K2203/107 ,  H05K2203/1173 ,  H05K2203/175 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board includes a through hole constituted by a hole penetrating through the front and rear surfaces of the printed circuit board. A fabrication method of the printed circuit board, includes applying conductive material plating to the inner wall surface of the hole to form a through hole electrically connecting the front and rear surfaces of the printed circuit board, and removing the conductive material plated on the hole inner wall surface at least at a portion between the front and rear surfaces of the printed circuit board is carried out to thereby fabricate a printed circuit board having a through hole electrically isolates the front surface of the printed circuit board from the rear surface thereof.

Abstract translation: 印刷电路板包括由穿过印刷电路板的前表面和后表面的孔构成的通孔。 一种印刷电路板的制造方法，包括将导电材料镀敷到孔的内壁表面，以形成电连接印刷电路板的前表面和后表面的通孔，以及去除镀在孔内部的导电材料 至少在印刷电路板的前表面和后表面之间的部分上的壁表面被进行，从而制造具有通孔的印刷电路板，将印刷电路板的前表面与其后表面电隔离。

公开(公告)号：US08372792B2

公开(公告)日：2013-02-12

申请号：US12668798

申请日：2008-08-08

Applicant: Takashi Tanaka ,  Kazutaka Zenfuku

Inventor： Takashi Tanaka ,  Kazutaka Zenfuku

IPC: C11D7/50

CPC classification number: C11D7/265 ,  C11D7/263 ,  C11D7/3227 ,  C11D7/5022 ,  C11D11/0041 ,  H05K3/26

Abstract: The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.

Abstract translation: 本发明的目的是提供一种新颖的清洁剂组合物，其不仅可以通过火焰降低点火并且对环境的影响较小，而且还具有优异的性质，即溶解粘附在窄部分上的焊剂残余物或者在 用无铅焊料进行焊接的待清洁物体，并且可以减少水洗过程中物体的再污染。 本发明使用由特定的式表示的无卤素的有机溶剂（A） 由特定的式表示的胺系化合物（B） 不含氨基的螯合剂（C）; 并根据需要提供水。

公开(公告)号：US08361340B2

公开(公告)日：2013-01-29

申请号：US12433108

申请日：2009-04-30

Applicant: Chun Christine Dong ,  Richard E. Patrick ,  Gregory Khosrov Arslanian ,  Ranajit Ghosh

Inventor： Chun Christine Dong ,  Richard E. Patrick ,  Gregory Khosrov Arslanian ,  Ranajit Ghosh

IPC: C25F1/00 ,  C25F7/00

CPC classification number: B23K1/008 ,  B23K1/206 ,  B23K35/268 ,  B23K35/38 ,  B23K2101/40 ,  C23G5/00 ,  H01J37/32431 ,  H01J37/32706 ,  H01L21/02068 ,  H01L21/67069 ,  H01L2924/0002 ,  H05K3/26 ,  H05K3/3489 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/105 ,  H05K2203/1157 ,  H01L2924/00

Abstract: Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.

Abstract translation: 这里描述了一种用于从目标区域内的衬底表面去除金属氧化物的方法和装置。 在一个特定实施例中，该方法和装置具有通电电极，该激励电极具有突出的导电尖端的阵列，该阵列通过导线电连接并分离成第一电连接组和第二电连接组，其中至少一部分 导电尖端被直流电压源激活，所述直流电压源被负偏压以在目标区域内产生电子，所述电极附着到存在于目标区域中的至少一部分还原气体，以形成与处理表面接触的带负电荷的还原气体 以还原基材的处理表面上的金属氧化物。

公开(公告)号：US08211845B2

公开(公告)日：2012-07-03

申请号：US12999471

申请日：2009-08-17

Applicant: Keita Tanaka ,  Takashi Tanaka

Inventor： Keita Tanaka ,  Takashi Tanaka

IPC: C11D7/16 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  B08B3/04

CPC classification number: B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

Abstract: An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

Abstract translation: 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US20110094545A1

公开(公告)日：2011-04-28

申请号：US12999471

申请日：2009-08-17

Applicant: Keita Tanaka ,  Takashi Tanaka

Inventor： Keita Tanaka ,  Takashi Tanaka

IPC: B08B3/04 ,  C11D3/60

CPC classification number: B23K1/206 ,  B23K3/08 ,  C11D7/16 ,  C11D7/265 ,  C11D7/3227 ,  C11D11/0047 ,  H05K3/26

Abstract: An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid.The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

Abstract translation: 本发明的目的是提供一种清洁剂组合物，其具有理想的清洁性能，并且即使在清洁通过使用无铅焊剂产生的物体时也容易与预漂洗水分离; 以及使用可以减少废液量的预漂洗方法的无铅助焊剂去除系统。 本发明使用清洁剂组合物用于无铅助焊剂，其包含（A）特定的二醇醚; （B）特定的聚氧化烯胺; 和（C）螯合剂，其为选自（c1）脂肪族羟基羧酸螯合剂和（c2）（多）磷酸螯合剂中的至少一种的螯合剂。

公开(公告)号：US07922918B2

公开(公告)日：2011-04-12

申请号：US11872215

申请日：2007-10-15

Applicant: Yasuo Matsui ,  Shunji Araki

Inventor： Yasuo Matsui ,  Shunji Araki

IPC: H01B13/00

CPC classification number: H05K3/244 ,  C23C28/023 ,  C25D5/12 ,  C25D5/34 ,  H01H1/023 ,  H01H1/403 ,  H05K1/11 ,  H05K3/26 ,  H05K2203/025 ,  H05K2203/0392 ,  Y10T29/49155 ,  Y10T29/4916

Abstract: There is provided a method of manufacturing a circuit board having a first fixed contact and a second fixed contact that extend substantially orthogonal to each other on the same surface, the life span required for the first fixed contact being longer than that required for the second fixed contact. The method includes: etching a copper foil formed on the entire surface of an insulating substrate to form the patterns of the first and second fixed contacts; polishing the surface of the insulating substrate with buff to remove an oxide film adhered to the copper foil; and sequentially forming a nickel layer having a thickness of about 1 to about 5 μm and a gold layer having a thickness of about 0.01 to about 0.5 μm on each of the first and second fixed contacts. In the method, the buffing direction is substantially aligned with a direction in which a first movable contact slides on the first fixed contact.

Abstract translation: 提供了一种制造电路板的方法，该电路板具有第一固定触点和第二固定触点，该第一固定触点和第二固定触点在同一表面上基本上彼此正交延伸，第一固定触点所需的寿命比第二固定触点所需的寿命长 联系。 该方法包括：蚀刻形成在绝缘基板的整个表面上的铜箔，以形成第一和第二固定触点的图案; 用抛光抛光绝缘基板的表面以去除附着在铜箔上的氧化膜; 并且在第一和第二固定触头中的每一个上依次形成厚度为约1至约5μm的镍层和厚度为约0.01至约0.5μm的金层。 在该方法中，抛光方向基本上与第一可动触头在第一固定触点上滑动的方向对准。

公开(公告)号：US20110051387A1

公开(公告)日：2011-03-03

申请号：US12852522

申请日：2010-08-09

Applicant: Kenya TACHIBANA ,  Teppei ITO ,  Yasuaki MITSUI

Inventor： Kenya TACHIBANA ,  Teppei ITO ,  Yasuaki MITSUI

IPC: H05K1/09 ,  H05K7/00 ,  H05H1/00

CPC classification number: C23C18/1607 ,  C23C18/1844 ,  C23C18/50 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/244 ,  H05K3/26 ,  H05K2201/0761 ,  H05K2201/10378 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/095 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An object of the present invention is to provide an electroless nickel-palladium-gold plating method which is able, when performed on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components, and other resin substrates with a fine metal pattern, to prevent abnormal metal deposition on a resin surface which is an undercoat and to provide a high-quality plated surface. Another object of the present invention is to provide a plated product with a high-quality plated surface, particularly such as an interposer and motherboard, and a semiconductor apparatus using the same. These objects were achieved by the electroless nickel-palladium-gold plating method of the present invention, which is a method for plating target objects such as terminals of a printed wiring board and in which at least one surface treatment selected from a treatment with a solution of pH 10 to 14 and a plasma treatment is performed at an optional step after the step of providing a palladium catalyst and before the step of performing electroless palladium plating.

Abstract translation: 本发明的目的在于提供一种无电解镍 - 钯 - 金电镀方法，其能够在电镀目标表面上进行印刷电路板的端子，其他电子部件的端子和其它树脂基板 精细的金属图案，以防止在作为底涂层的树脂表面上异常金属沉积并提供高质量的电镀表面。 本发明的另一个目的是提供一种具有高质量电镀表面的电镀产品，特别是内插器和母板，以及使用该电镀产品的半导体装置。 这些目的是通过本发明的化学镀镍 - 钯 - 金镀覆方法来实现的，该方法是用于对印刷电路板的端子等目标物体进行电镀的方法，其中至少一种选自溶液处理的表面处理 的pH为10〜14，并且在提供钯催化剂的步骤之后和进行无电镀钯的步骤之前的任选步骤进行等离子体处理。