公开(公告)号：US11794219B2

公开(公告)日：2023-10-24

申请号：US16912754

申请日：2020-06-26

Applicant: SEMES CO., LTD.

Inventor： Seungtae Yang ,  Buyoung Jung ,  Seung Hwan Cho

IPC: B08B3/10 ,  H01L21/67

CPC classification number: B08B3/10 ,  H01L21/67051

Abstract: The inventive concept relates to an apparatus for treating a substrate. According to an embodiment, the substrate treating apparatus includes a housing having a process space therein, a support unit that supports the substrate in the housing, a nozzle that dispenses a treatment liquid onto the substrate supported on the support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle, in which the liquid supply unit includes a container having a storage space in which the treatment liquid is stored, a liquid supply tube that causes the treatment liquid to flow from the container to the nozzle, and a microwave applying member that applies microwaves to the treatment liquid before the treatment liquid is supplied to the nozzle.

公开(公告)号：US20230327595A1

公开(公告)日：2023-10-12

申请号：US18091372

申请日：2022-12-30

Applicant: SEMES CO., LTD.

Inventor： Jun Beom LEE ,  Yeong Jae CHOE ,  Dong Hoon YANG ,  Byung Kwon LEE

IPC: H02P23/14 ,  H01L21/677 ,  B65G43/02

CPC classification number: H02P23/14 ,  B65G43/02 ,  H01L21/6773 ,  H01L21/67733

Abstract: Provided is a transport system to minimize an interference between motors of a transport vehicle. The transport system comprises: a first motor controller corresponding to a first wheel and configured to generate a first current value; a first motor system configured to move based on the first current value and provide a first position value according to the movement; a disturbance observer configured to receive the first current value and the first position value and calculate a first disturbance value affecting the first motor system; a second motor controller corresponding to a second wheel and configured to generate a second current value; a compensation current generator configured to generate a second compensation current value based on the second current value and the first disturbance value; and a second motor system configured to move by the second compensation current value and provide a second position value according to the movement.

公开(公告)号：US20230317504A1

公开(公告)日：2023-10-05

申请号：US18086633

申请日：2022-12-21

Applicant: SEMES CO., LTD.

Inventor： Tae Hoon LEE

IPC: H01L21/687 ,  B25J18/00

CPC classification number: H01L21/68707 ,  B25J18/00

Abstract: Provided is a robotic arm includes an arm body; and a plurality of pads connected to the arm body and in contact with a substrate, wherein the arm body includes a ceramic plate and an antistatic coating layer disposed on an external surface of the ceramic plate, wherein the pad includes a first conductive layer, and wherein a conductive portion connecting the pad to the antistatic coating layer on an external side of the pad is provided.

公开(公告)号：US20230317436A1

公开(公告)日：2023-10-05

申请号：US18192304

申请日：2023-03-29

Applicant: Semes Co., Ltd.

Inventor： Dukhyun Son ,  Jihun Kim ,  Yeonghun Wi

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01J37/32807 ,  H01L21/68742 ,  H01J37/32715 ,  H01L21/68721 ,  H01J37/32642 ,  H01L21/6831 ,  H01J2237/3343 ,  H01J2237/024 ,  H01J2237/2007

Abstract: The disclosure provides a substrate processing apparatus including an electrostatic chuck disposed on a base to support a substrate, a focus ring disposed on the base to surround an outer circumference of the electrostatic chuck, and a lift pin configured to lift the focus ring, wherein the focus ring includes a lower ring and an upper ring disposed on the lower ring, the upper ring and/or the lower ring are configured to be simultaneously lifted according to a height of the lift pin, the lower ring includes an insertion groove, the upper ring includes a main body unit, a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring, and a second protrusion extending downward from the main body unit, contacting an outer circumference of the lower ring, and directly contacting the lift pin.

公开(公告)号：US20230317428A1

公开(公告)日：2023-10-05

申请号：US18190442

申请日：2023-03-27

Applicant: SEMES CO., LTD.

Inventor： Dukhyun SON ,  Jaewon SHIN ,  Hyungjoon KIM

IPC: H01J37/32

CPC classification number: H01J37/32669 ,  H01J37/3244 ,  H01J37/32458 ,  H01J2237/334

Abstract: According to an aspect of the inventive concept, there is provided a plasma processing apparatus including a housing including a space accommodating a wafer therein, a gas supply member configured to supply gas into the housing, a plasma source generating a plasma from the gas supplied into the housing, and a magnetic field generating member disposed on the housing and configured to generate a magnetic field inside the housing, wherein the magnetic field generating member includes a first magnet unit disposed on the housing, and a second magnet unit disposed on the first magnet unit, wherein the second magnet unit is rotatable to change the magnetic pole of the upper portion and lower portion of the second magnet unit.

公开(公告)号：US20230314948A1

公开(公告)日：2023-10-05

申请号：US18108655

申请日：2023-02-12

Applicant: SEMES CO., LTD.

Inventor： Youngjun Son ,  Byoungdoo Choi

IPC: G03F7/16

CPC classification number: G03F7/162

Abstract: Provided are a nozzle having a double pipe structure in which multi-suck-back is possible without driving a nozzle arm, and also, a reduced resist consumption (RRC) operation and a nozzle tip rinsing operation are possible without moving the nozzle arm, and a photoresist (PR) dispenser and a spin coater, each including the nozzle. The nozzle includes an inner pipe having a conical shape gradually narrowing downward, through which PR is transferred, and having a tip through which the PR is ejected, and an outer pipe surrounding the inner pipe, having a conical shape gradually narrowing downward, through which thinner is transferred, and having a tip through which the thinner is ejected, wherein the nozzle is coupled to a nozzle arm and moved, and multi-suck-back is performed without driving the nozzle arm.

公开(公告)号：US20230313039A1

公开(公告)日：2023-10-05

申请号：US18189427

申请日：2023-03-24

Applicant: SEMES CO., LTD.

Inventor： Kyungseok MIN ,  Hyunjong SHIM ,  Sangmin MUN ,  Sunjoo PARK ,  Hwan JUNG ,  Nayeon LEE

IPC: C09K13/00 ,  H01L21/311

CPC classification number: C09K13/00 ,  H01L21/31116 ,  H01L21/31144

Abstract: An etching gas composition includes at least two types of organofluorine compounds of carbon number C3 or carbon number C4, wherein the at least two types of organofluorine compounds are isomeric to each other.

公开(公告)号：US20230311153A1

公开(公告)日：2023-10-05

申请号：US18101121

申请日：2023-01-25

Applicant: SEMES CO., LTD.

Inventor： Sung Hun EOM ,  Tae Won YUN ,  Yun Hwa HONG ,  Jong Kook BAE

IPC: B05C5/00 ,  B05C11/08 ,  B05D1/00

CPC classification number: B05C5/001 ,  B05C11/08 ,  B05D1/005

Abstract: A substrate processing apparatus, which may suppress occurrence of temperature deviation caused by an air current, is provided. The substrate processing apparatus includes a chamber including an upper body and a lower body and having a processing space formed therein by the upper body and the lower body, a substrate support unit disposed in the processing space and having a support surface on which the substrate is supported, a heater disposed to heat gas in the processing space, an introduction unit configured to supply gas toward an edge of the support surface, and a discharge unit configured to discharge the gas in the processing space. The discharge unit may include a plurality of outlets spaced apart from a centerline of the support surface in the upper body and disposed to be closer to the centerline of the support surface than to the introduction unit.

公开(公告)号：US20230311028A1

公开(公告)日：2023-10-05

申请号：US17702088

申请日：2022-03-23

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Kuk Saeng KIM ,  Do-Youn LIM ,  Wan Hee JEONG

IPC: B01D21/28 ,  B01D21/00 ,  B01D35/06 ,  B01D21/34

CPC classification number: B01D21/283 ,  B01D21/0012 ,  B01D21/34 ,  B01D35/06

Abstract: The present invention provides a liquid supplying unit, including: a nozzle; a liquid supply pipe configured to supply a treatment liquid to the nozzle; and an impurity removing unit installed in the liquid supply pipe to remove an impurity in the treatment liquid, in which the impurity removing unit includes: a measuring unit configured to measure a characteristic of the impurity in the treatment liquid and form impurity data; a vibrating unit configured to apply vibration to the treatment liquid; a capturing unit configured to adsorb the impurity in the treatment liquid to which the vibration is applied; and a control unit configured to control the measuring unit and the vibration unit, and when the impurity data exceeds a reference data range, the control unit operates the vibrating unit.

公开(公告)号：US20230311026A1

公开(公告)日：2023-10-05

申请号：US18152485

申请日：2023-01-10

Applicant: SEMES CO.,LTD.

Inventor： Arah CHO ,  Jung Suk GOH ,  Jae Hoon PARK ,  Hojin JANG ,  Jung Yul LEE ,  Kyungjin SEO ,  Woo Sin JUNG

IPC: B01D19/00 ,  H01L21/67

CPC classification number: B01D19/0042 ,  H01L21/67017

Abstract: The present invention relates to a liquid trap tank and a method for trapping liquid, the liquid trap tank may include a tank body configured to have an accommodation space formed therein capable of accommodating a liquid, have an inflow unit formed in one portion thereof, and have a discharge unit formed in the other portion thereof, a first accommodation portion formed inside the tank body and configured to primarily and temporarily accommodate the liquid so that air bubbles are separated from the liquid introduced through the inflow unit, and a second accommodation portion formed inside the tank body and configured to secondarily and temporarily accommodate the liquid moved from the first accommodation portion or to discharge the moved liquid to the outside through the discharge unit.