公开(公告)号：US20080116546A1

公开(公告)日：2008-05-22

申请号：US11984762

申请日：2007-11-21

Applicant: Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

Inventor： Hyo-Jae Bang ,  Heui-Seog Kim ,  Seong-Chan Han ,  Jung-Hyeon Kim ,  Sung-Hwan Kim

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/3107 ,  H01L23/49541 ,  H01L23/49558 ,  H01L23/49586 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A lead frame unit, a semiconductor package having a lead frame unit, a stacked semiconductor package having a semiconductor package, and methods of manufacturing the same are provided. The lead frame unit in a stacked semiconductor package may include a die pad supporting a semiconductor chip, an inner lead electrically connected to the semiconductor chip, an outer lead extending from the inner lead, and a heat-resistant insulation member surrounding the connection portion. The outer lead may include a connection portion connected to the inner lead and a junction portion connected to the connection portion and a circuit board. An external signal may be applied to the junction portion. If the lead frame unit is used in the stacked semiconductor package, the outer lead and a dummy outer lead in the stacked semiconductor package may have substantially the same shape.

Abstract translation: 提供引线框单元，具有引线框单元的半导体封装，具有半导体封装的堆叠半导体封装及其制造方法。 层叠半导体封装中的引线框架单元可以包括：支撑半导体芯片的管芯焊盘，与半导体芯片电连接的内部引线;从内部引线延伸的外部引线;以及围绕连接部分的耐热绝缘构件。 外引线可以包括连接到内引线的连接部分和连接到连接部分的接合部分和电路板。 外部信号可以施加到接合部分。 如果在叠层半导体封装中使用引线框架单元，则堆叠半导体封装中的外引线和虚外外引线可以具有基本相同的形状。

公开(公告)号：US20080079118A1

公开(公告)日：2008-04-03

申请号：US11862521

申请日：2007-09-27

Applicant: Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Hyo-jae BANG ,  Dong-chun Lee ,  Seong-chan Han ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: H01L29/00 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/09981 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  H01L2224/0401

Abstract: A reworkable passive element embedded printed circuit board (PCB) including a board member, first and second fillings, and a first passive element. The board member has first and second through holes which are spaced apart from each other. The first and second fillings are buried in the first and second through holes, respectively, and formed of a reflowable conductive material. The first passive element includes first and second electrodes. A first insertion groove is formed in a portion of a surface of the board member between the first and second through holes and portions of the first and second fillings. The first passive element is mounted on the first insertion groove. The first electrode includes a bottom surface and a side contacting the first filling and an exposed upper surface. The second electrode comprises a bottom surface and a side contacting the second filling and an exposed upper surface.

Abstract translation: 一种可重复操作的无源元件嵌入式印刷电路板（PCB），其包括板构件，第一和第二填充物以及第一无源元件。 板构件具有彼此间隔开的第一和第二通孔。 第一和第二填充物分别埋在第一和第二通孔中，并由可回流的导电材料形成。 第一无源元件包括第一和第二电极。 第一插入槽形成在第一和第二通孔之间的板构件的表面的一部分中，以及第一和第二填充物的一部分。 第一无源元件安装在第一插入槽上。 第一电极包括底表面和接触第一填充物的一侧和暴露的上表面。 第二电极包括底表面和接触第二填充物的一侧和暴露的上表面。

公开(公告)号：US20080042279A1

公开(公告)日：2008-02-21

申请号：US11842858

申请日：2007-08-21

Applicant: Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

Inventor： Hyo-Jae BANG ,  Wha-Su SIN ,  Sung-Yeol LEE ,  Yung-Hyun KIM ,  Seong-Chan HAN ,  Jung-Hyeon KIM

IPC: H01L23/488 ,  H01L21/60 ,  H01L21/66

CPC classification number: H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1369 ,  H01L2224/16 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K3/4015 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.

Abstract translation: 提供半导体器件的安装结构和安装半导体器件的方法。 安装结构包括具有终端焊盘的电路基板。 器件衬底位于电路衬底上方，该衬底具有面向电路衬底的端子焊盘的球垫。 在电路基板和器件基板之间形成导电球，以将电路基板的端子焊盘连接到器件基板的球垫。 包括环氧基树脂的第一助焊剂将导电球连接到器件基板的球垫。 在电路基板和器件基板之间形成底部填充层，以便埋入导电球和第一焊剂。 使用环氧树脂，即使当器件基板由于温度变化而发生热变形时，第一焊剂可以基本上防止在导电球和球垫之间的焊接接头中产生裂纹。

公开(公告)号：US20070089263A1

公开(公告)日：2007-04-26

申请号：US11436535

申请日：2006-05-19

Applicant: Hwa-gyu Song ,  Hyun-ju Lee ,  Dong-houn Yang ,  Jae-sun You ,  Jung-hyeon Kim ,  Jun-young Lee

Inventor： Hwa-gyu Song ,  Hyun-ju Lee ,  Dong-houn Yang ,  Jae-sun You ,  Jung-hyeon Kim ,  Jun-young Lee

IPC: A47L9/02

CPC classification number: A47L9/0081 ,  A47L9/02

Abstract: A suction nozzle of a vacuum cleaner includes jet units for jetting air into positions where air streams collide with each other as air is drawn into a suction port of the nozzle from both side portions thereof, so as to prevent substantially the collision of air streams.

Abstract translation: 真空吸尘器的吸嘴包括喷射单元，用于将空气从空气流从其两侧部分吸入喷嘴的吸入口而相互碰撞的空气流相互碰撞的位置，以便基本上防止空气流的碰撞。

公开(公告)号：US20070081274A1

公开(公告)日：2007-04-12

申请号：US11358415

申请日：2006-02-22

Applicant: Jun-young Kim ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Jun-young Kim ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: G11B5/54

CPC classification number: G11B15/29

Abstract: A pinch roller driving mechanism for a magnetic recording/reproducing apparatus, includes a main deck mounting a shaft of a capstan motor, a sub-deck that is loaded and unloaded with respect to the main deck, a pivot lever that is pivotably mounted to the main deck and supports a pinch roller that presses a magnetic tape into contact with the capstan shaft as the sub-deck is loaded, and an association unit that pivots the pivot lever so that the pinch roller contacts the shaft when the sub-deck is loaded, and returns the pivot lever to its initial position when the sub-deck is unloaded.

Abstract translation: 一种用于磁记录/再现装置的夹送辊驱动机构，包括安装主导轴马达的轴的主甲板，相对于主甲板装载和卸载的副甲板，枢转杆，其可枢转地安装到 主甲板，并且支撑夹紧辊，当夹层装载时，压紧磁带与主导轴接触;以及关联单元，其枢转枢转杆，使得夹紧辊在副甲板装载时接触轴 ，并且当副甲板卸载时，将枢轴杠杆返回到其初始位置。

公开(公告)号：US20070067946A1

公开(公告)日：2007-03-29

申请号：US11363032

申请日：2006-02-28

Applicant: Hwa-gyu Song ,  Hyun-ju Lee ,  Dong-houn Yang ,  Jae-sun You ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Hwa-gyu Song ,  Hyun-ju Lee ,  Dong-houn Yang ,  Jae-sun You ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: A47L9/04

CPC classification number: A47L9/02 ,  A47L9/009

Abstract: A suction brush of a vacuum cleaner includes: a body configured to communicate with a dust collection device and including at least one suction port; a cover configured to cover a top of the body; and at least one rolling pin configured to be rotatably coupled at a bottom of the body.

Abstract translation: 真空吸尘器的吸刷器包括：主体，被配置为与灰尘收集装置连通并且包括至少一个吸入口; 被构造成覆盖所述主体的顶部的盖; 以及构造成可旋转地联接在所述主体的底部的至少一个滚销。

公开(公告)号：US20070064444A1

公开(公告)日：2007-03-22

申请号：US11514879

申请日：2006-09-05

Applicant: Su-gun Kim ,  Jae-hyun Park ,  Joon-chan Park ,  Kye-hoon Lee ,  Jun-young Lee ,  Jung-hyeon Kim

Inventor： Su-gun Kim ,  Jae-hyun Park ,  Joon-chan Park ,  Kye-hoon Lee ,  Jun-young Lee ,  Jung-hyeon Kim

IPC: F21V7/04

CPC classification number: G02B6/0031 ,  G02B6/0068

Abstract: A liquid crystal display device comprising an LCD panel, a light guiding plate disposed in back of the LCD panel and a plurality of LEDs disposed on a plane in parallel with the LCD panel along a lateral side of the light guiding plate and arranged in two rows or more is provided. With this configuration, color mixing efficiency is enhanced while size of the display device is kept to a minimum.

Abstract translation: 一种液晶显示装置，包括LCD面板，设置在LCD面板背面的导光板和沿着导光板的侧面与LCD面板平行设置的多个LED，并且布置成两列 或更多。 利用这种配置，在显示装置的尺寸保持最小的同时增强了混色效率。

公开(公告)号：US08633405B2

公开(公告)日：2014-01-21

申请号：US12573787

申请日：2009-10-05

Applicant: Jin-Soo Shin ,  Jin-Yong Park ,  Jun-Hee Son ,  Jung-Hyeon Kim ,  Se-Ki Park

Inventor： Jin-Soo Shin ,  Jin-Yong Park ,  Jun-Hee Son ,  Jung-Hyeon Kim ,  Se-Ki Park

IPC: H05K7/14 ,  G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G02F1/1333

CPC classification number: G02F1/133308 ,  G02F2001/133317

Abstract: A display device comprises: a display panel including a first insulating substrate and a second insulating substrate that is arranged so as to deviate from the first insulating substrate; and an intermediate frame, wherein the intermediate frame includes: side walls that are arranged so as to correspond to four side surface of the display panel; a mounting portion which protrudes from the side walls inward and on which the first insulating substrate is mounted; and a supporting protrusion that protrudes from the mounting portion to the second insulating substrate and is arranged below the second insulating substrate and on the side of the first insulating substrate.

Abstract translation: 显示装置包括：显示面板，包括第一绝缘基板和布置成偏离所述第一绝缘基板的第二绝缘基板; 和中间框架，其中所述中间框架包括：侧壁，其布置成对应于所述显示面板的四个侧表面; 安装部，其从所述侧壁向内突出，并且所述第一绝缘基板安装在所述安装部上; 以及从所述安装部向所述第二绝缘基板突出并配置在所述第二绝缘基板的下方并且在所述第一绝缘基板的一侧的支撑突起。

公开(公告)号：US08624823B2

公开(公告)日：2014-01-07

申请号：US12274738

申请日：2008-11-20

Applicant: Se-Ki Park ,  Gi-Cherl Kim ,  Sang-Il Park ,  Jung-Hyeon Kim

Inventor： Se-Ki Park ,  Gi-Cherl Kim ,  Sang-Il Park ,  Jung-Hyeon Kim

IPC: G09G3/36

CPC classification number: G09G3/3607 ,  G02F1/133609 ,  G09G3/3413 ,  G09G2320/064 ,  G09G2320/0666 ,  G09G2360/145

Abstract: A light source assembly includes a light source which emits light; a detector which detects the light and generates a light signal based on a property of the light; an operator operably connected to the detector and which receives the light signal and calculates a color coordinate of the light source based on the light signal; a comparator operably connected to the operator and which compares the color coordinate of the light source to a predetermined reference color coordinate; and a control unit operably connected to the comparator and which controls a pulse width modulation signal transmitted to the light source based on a result of the comparison of the comparator.

Abstract translation: 光源组件包括发光的光源; 检测器，其基于所述光的特性来检测所述光并产生光信号; 可操作地连接到检测器的操作器，其接收光信号并且基于光信号计算光源的颜色坐标; 比较器，可操作地连接到操作者，并将光源的颜色坐标与预定的参考颜色坐标进行比较; 以及控制单元，其可操作地连接到所述比较器，并且其基于所述比较器的比较结果来控制传输到所述光源的脉宽调制信号。

公开(公告)号：US08339794B2

公开(公告)日：2012-12-25

申请号：US12713282

申请日：2010-02-26

Applicant: Hyo-Jae Bang ,  Jung-Hyeon Kim

Inventor： Hyo-Jae Bang ,  Jung-Hyeon Kim

IPC: H05K5/00

CPC classification number: H05K1/18 ,  H01G9/08 ,  H01G9/155 ,  H01L2224/16227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K3/325 ,  H05K3/403 ,  H05K5/0091 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/10515 ,  H01L2224/0401

Abstract: A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.

Abstract translation: 用于支撑其中的固态器件SSD的壳体和其中的超级电容器以电子方式连接在一起。