公开(公告)号：US20100006325A1

公开(公告)日：2010-01-14

申请号：US12495860

申请日：2009-07-01

Applicant: Masayuki KITAJIMA ,  Takeshi Ishitsuka ,  Satoshi Emoto

Inventor： Masayuki KITAJIMA ,  Takeshi Ishitsuka ,  Satoshi Emoto

IPC: H05K1/09 ,  H01B1/00 ,  H01B1/22 ,  H01B1/24 ,  H05K3/00 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K3/249 ,  H05K1/118 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2203/1105

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract translation: 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料的颗粒更细的第二导电材料。

公开(公告)号：US07565739B2

公开(公告)日：2009-07-28

申请号：US11430052

申请日：2006-05-09

Applicant: Masayuki Kitajima ,  Ryoji Matsuyama

Inventor： Masayuki Kitajima ,  Ryoji Matsuyama

IPC: H01K3/10

CPC classification number: H05K3/4038 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/426 ,  H05K2203/128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn—Al alloy. Heat is then applied to the conductor and the wiring. A chemical reaction is accelerated between the conductor and the wiring based on the heat treatment. This allows oxygen to get released out of the conductor and the wiring. Deoxidation is thus realized on the joint surfaces of the conductor and the wiring. Electric resistance is decreased. Electric conduction can thus be established between the conductor and the wiring.

Abstract translation: 导体至少部分地暴露在身体的表面上。 形成用于连接到导体的布线。 导体由Zn-Al合金制成。 然后将热量施加到导体和布线。 基于热处理，在导体和布线之间加速化学反应。 这允许氧气从导体和布线中释放出来。 因此，在导体和布线的接合表面上实现脱氧。 电阻降低。 因此，可以在导体和布线之间建立导电。

公开(公告)号：US20090175470A1

公开(公告)日：2009-07-09

申请号：US12349265

申请日：2009-01-06

Applicant: Shunichi Aikawa ,  Masayuki Kitajima ,  Keiji Tsuda

Inventor： Shunichi Aikawa ,  Masayuki Kitajima ,  Keiji Tsuda

IPC: H04R25/00 ,  H04R31/00

CPC classification number: H04R31/00 ,  H01L2224/11 ,  H04R17/00 ,  H04R2499/11 ,  Y10T29/49005

Abstract: An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post.

Abstract translation: 声波装置包括：基板; 设置在基板上的声波元件; 设置在所述基板上并且电耦合到所述声波元件的端子; 第一绝缘层，其设置在所述基板上，并且在其与所述端子的至少一部分重叠的区域具有第一开口; 第二绝缘层，其在与第一开口的至少一部分重叠的区域处具有第二开口，并且设置在第一绝缘层和声波元件上，使得在声波元件上形成空腔; 第三绝缘层，其具有包括第一开口和第二开口彼此重叠的区域的第三开口，并且设置在第二绝缘层上; 电连接到端子并设置在第一开口，第二开口和第三开口中的金属柱; 以及设置在金属柱上的焊球。

公开(公告)号：US20050104477A1

公开(公告)日：2005-05-19

申请号：US11006340

申请日：2004-12-07

Applicant: Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

Inventor： Masanao Fujii ,  Toru Okada ,  Masayuki Kitajima ,  Hidehiko Kobayashi ,  Seiichi Shimoura

IPC: G11B5/596 ,  G11B5/55 ,  G11B21/10 ,  G11B21/21 ,  H01L41/09 ,  H02N2/00 ,  H01L41/08

CPC classification number: G11B5/5552 ,  H01L41/0993 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Abstract translation: 在制造微致动器的方法中，将第一粘合剂施加到可动板上，并且可移动的电极和可动电极被放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。

公开(公告)号：US06786385B1

公开(公告)日：2004-09-07

申请号：US09533365

申请日：2000-03-22

Applicant: Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

Inventor： Masayuki Kitajima ,  Masakazu Takesue ,  Yoshitaka Muraoka

IPC: B23K108

CPC classification number: H01L24/742 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L21/6835 ,  H01L24/81 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11901 ,  H01L2224/12 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract translation: 半导体器件包括具有电极的半导体元件和附接到电极的金属凸块。 金属凸块包括铜芯和覆盖芯的金表面层。 此外，金属凸块可以包括连接在一起的金突起元件和焊料凸块元件。

公开(公告)号：US06596094B2

公开(公告)日：2003-07-22

申请号：US09993615

申请日：2001-11-27

Applicant: Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

Inventor： Masayuki Ochiai ,  Yasuo Yamagishi ,  Hiroki Uchida ,  Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono

IPC: B23K35363

CPC classification number: B23K35/025 ,  B23K35/0244 ,  B23K35/262 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/10689 ,  H05K2203/0545 ,  Y10T428/12063 ,  Y10T428/12882

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

公开(公告)号：US06467141B2

公开(公告)日：2002-10-22

申请号：US09820553

申请日：2001-03-29

Applicant: Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

Inventor： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

IPC: H04R1710

CPC classification number: G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

Abstract translation: 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。