公开(公告)号：US20190103270A1

公开(公告)日：2019-04-04

申请号：US15958635

申请日：2018-04-20

Applicant: Mattson Technology, Inc.

Inventor： Michael X. Yang ,  Hua Chung ,  Xinliang Lu

IPC: H01L21/02 ,  H01J37/32 ,  H01L21/027 ,  H01L21/768

Abstract: Surface treatment processes for treating low-k dielectric materials are provided. One example implementation can include a method for processing a workpiece. The workpiece can include a silicon and carbon containing film material. The method can include treating the workpiece with a surface treatment process. The surface treatment process can include generating one or more species in a first chamber; mixing one or more hydrocarbon molecules with the species to create a mixture comprising one or more organic radicals; and exposing the silicon and carbon containing layer on the workpiece to the mixture in a second chamber.

公开(公告)号：US20180286640A1

公开(公告)日：2018-10-04

申请号：US15936764

申请日：2018-03-27

Applicant: Mattson Technology, Inc.

Inventor： Jeffrey Cue ,  Martin L. Zucker

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: Focus ring assemblies for plasma processing apparatus are provided. In one example implementation, an apparatus includes a plasma source configured to generate a plasma. The apparatus includes a chamber configured to receive a workpiece. The apparatus includes a workpiece support contained in the chamber and configured to support the workpiece. The apparatus includes a focus ring assembly. The focus ring assembly includes a focus ring having an upper tier and a lower tier. An inner edge of the upper tier can be separated a lateral distance of at least about 3 mm from an outer edge of the workpiece located on the workpiece support.

公开(公告)号：US10037867B2

公开(公告)日：2018-07-31

申请号：US14581348

申请日：2014-12-23

Applicant: Mattson Technology, Inc.

Inventor： Valery Godyak

IPC: C23C16/00 ,  H01L21/306 ,  H01J37/32 ,  H05H1/46

CPC classification number: H01J37/32119 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32137 ,  H01J37/32449 ,  H01J37/3266 ,  H05H1/46

Abstract: A method and apparatus are provided for processing a substrate with a radiofrequency inductive plasma in the manufacture of a device. The inductive plasma is maintained with an inductive plasma applicator having one or more inductive coupling elements. There are thin windows between the inductive coupling elements and the interior of the processing chamber. Various embodiments have magnetic flux concentrators in the inductive coupling element and feed gas holes interspersed among the inductive coupling elements. The thin windows, magnetic flux concentrators, and interspersed feed gas holes are useful to effectuate uniform processing, high power transfer efficiency, and a high degree of coupling between the applicator and plasma. In some embodiments, capacitive current is suppressed using balanced voltage to power an inductive coupling element.

公开(公告)号：US20170243721A1

公开(公告)日：2017-08-24

申请号：US15589127

申请日：2017-05-08

Applicant: Mattson Technology, Inc.

Inventor： Vladimir Nagorny ,  Dongsoo Lee ,  Andreas Kadavanich

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/321 ,  H01J37/32119 ,  H01J37/32449 ,  H01J37/32651 ,  H01J37/32669 ,  H01J37/32715 ,  H01J2237/334

Abstract: Plasma processing apparatus and methods are disclosed. Embodiments of the present disclosure include a processing chamber having an interior space operable to receive a process gas, a substrate holder in the interior of the processing chamber operable to hold a substrate, and at least one dielectric window. A metal shield is disposed adjacent the dielectric window. The metal shield can have a peripheral portion and a central portion. The processing apparatus includes a primary inductive element disposed external to the processing chamber adjacent the peripheral portion of the metal shield. The processing apparatus can further include a secondary inductive element disposed between the central portion of the metal shield and the dielectric window. The primary and secondary inductive elements can perform different functions, can have different structural configurations, and can be operated at different frequencies.

公开(公告)号：US20170207077A1

公开(公告)日：2017-07-20

申请号：US15403455

申请日：2017-01-11

Applicant: Mattson Technology, Inc.

Inventor： Vladimir Nagorny ,  Shawming Ma ,  Vijay M. Vaniapura ,  Ryan M. Pakulski

IPC: H01L21/02 ,  H01L21/027 ,  B08B7/00 ,  H01J37/32

CPC classification number: H01L21/0206 ,  B08B7/0035 ,  H01J37/32009 ,  H01J37/32357 ,  H01J37/32449 ,  H01J37/32651 ,  H01J2237/334 ,  H01L21/0273

Abstract: Systems, methods, and apparatus for processing a substrate in a plasma processing apparatus using a variable pattern separation grid are provided. In one example implementation, a plasma processing apparatus can have a plasma chamber and a processing chamber separated from the plasma chamber. The apparatus can further include a variable pattern separation grid separating the plasma chamber and the processing chamber. The variable pattern separation grid can include a plurality grid plates. Each grid plate can have a grid pattern with one or more holes. At least one of the plurality of grid plates is movable relative to the other grid plates in the plurality of grid plates such that the variable pattern separation grid can provide a plurality of different composite grid patterns.

公开(公告)号：US20170194177A1

公开(公告)日：2017-07-06

申请号：US15377032

申请日：2016-12-13

Applicant: Mattson Technology, Inc.

Inventor： Joseph Cibere

IPC: H01L21/67 ,  G06F17/50 ,  H01L21/66 ,  G01N25/72 ,  H01L21/324

CPC classification number: H01L21/67288 ,  G01N25/72 ,  G06F17/5009 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67248 ,  H01L22/20

Abstract: Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation, a process can include: accessing data indicative of a plurality of temperature measurements for a substrate, the plurality of measurements obtained during a cool down period of a thermal process; estimating one or more metrics associated with a cooling model based at least in part on the data indicative of the plurality of temperature measurements; and determining a breakage detection signal based at least in part on the one or more metrics associated with the cooling model. The breakage detection signal is indicative of whether the substrate has broken during thermal processing.

公开(公告)号：US20170194133A1

公开(公告)日：2017-07-06

申请号：US15380221

申请日：2016-12-15

Applicant: Mattson Technology, Inc.

Inventor： Markus Lieberer ,  Christian Seifert ,  Rolf Bremensdorfer

IPC: H01J61/073 ,  H01L21/268 ,  H05H1/48 ,  H05B3/00 ,  H05B3/03 ,  H01L21/67 ,  H01J61/52

CPC classification number: H01J61/0732 ,  H01J61/28 ,  H01J61/526 ,  H01L21/268 ,  H01L21/67115 ,  H01L21/6719 ,  H05B3/0047 ,  H05B3/03 ,  H05H1/48 ,  H05H2001/488

Abstract: Electrode tips for arc lamps for use in, for instance, a millisecond anneal system are provided. In one example implementation, an electrode for an arc lamp can have an electrode tip. The surface of the electrode tip can have one or more grooves to reduce the transportation of molten material across the surface of the electrode tip. The electrode can include an interface between the electrode tip and a heat sink. The interface can have a shape designed to have a desired lateral temperature distribution across the surface of the electrode tip.

公开(公告)号：US20150092813A1

公开(公告)日：2015-04-02

申请号：US14567631

申请日：2014-12-11

Applicant: Mattson Technology, Inc.

Inventor： Paul Janis Timans

IPC: G01J5/08

CPC classification number: G01J5/0896 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/0285 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0803 ,  G01J5/0821 ,  G01J5/0831 ,  G01J5/0846 ,  G01J5/089 ,  G01J5/522 ,  G01J5/58 ,  G01J2005/0048 ,  G01J2005/065 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/67248

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract translation: 公开了一种在热处理室中校准温度测量装置，例如高温计的方法和系统。 根据本发明，该系统包括将光能发射到包含在热处理室中的基板上的校准光源。 然后光检测器检测正在透过基板的光量。 然后使用检测到的光能量来校准在系统中使用的温度测量装置。

公开(公告)号：US08918303B2

公开(公告)日：2014-12-23

申请号：US13625161

申请日：2012-09-24

Applicant: Mattson Technology, Inc.

Inventor： Paul Janis Timans

IPC: G01J5/02 ,  G01J5/08 ,  G01J5/52 ,  G01J5/58 ,  H01L21/67 ,  H01L21/324 ,  G01J5/06 ,  G01J5/00

CPC classification number: G01J5/0896 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/0285 ,  G01J5/06 ,  G01J5/08 ,  G01J5/0803 ,  G01J5/0821 ,  G01J5/0831 ,  G01J5/0846 ,  G01J5/089 ,  G01J5/522 ,  G01J5/58 ,  G01J2005/0048 ,  G01J2005/065 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/67248

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract translation: 公开了一种在热处理室中校准温度测量装置，例如高温计的方法和系统。 根据本发明，该系统包括将光能发射到包含在热处理室中的基板上的校准光源。 然后光检测器检测正在透过基板的光量。 然后使用检测到的光能量来校准在系统中使用的温度测量装置。

公开(公告)号：US12261073B2

公开(公告)日：2025-03-25

申请号：US18654429

申请日：2024-05-03

Applicant: Beijing E-Town Semiconductor Technology Co., Ltd. ,  Mattson Technology, Inc.

Inventor： Maolin Long

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/683

Abstract: An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.