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371 条记录 (耗时 0.039 秒)

    Pressure-activated electrical interconnection by micro-transfer printing
    41.
    发明授权
    Pressure-activated electrical interconnection by micro-transfer printing 有权

    公开(公告)号：US10103069B2

    公开(公告)日：2018-10-16

    申请号：US15461703

    申请日：2017-03-17

    申请人： X-Celeprint Limited

    发明人： Christopher Andrew Bower ,  Ronald S. Cok ,  Matthew Meitl ,  Carl Ray Prevatte, Jr.

    IPC分类号： H01L33/00 ,  H01L21/66 ,  H01L33/56 ,  H01L33/62 ,  H01L25/00 ,  H01L27/12 ,  H01L27/32 ,  H01L23/00

    摘要： A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

    Layers of safety and failsafe capability for operation of class IV laser in consumer electronics devices
    42.
    发明授权
    Layers of safety and failsafe capability for operation of class IV laser in consumer electronics devices 有权

    公开(公告)号：US10027181B2

    公开(公告)日：2018-07-17

    申请号：US15280584

    申请日：2016-09-29

    申请人： X-Celeprint Limited

    发明人： Brent Fisher ,  Brian Cox ,  Matthew Meitl ,  Scott Burroughs ,  Joseph Carr

    IPC分类号： H02J50/30 ,  H02J7/02 ,  H02J7/35

    摘要： An optical power transfer device includes a transmitter circuit, including a laser light source that is configured to emit coherent light responsive to operation above a lasing threshold, and is configured to emit incoherent light responsive operation below the lasing threshold. A proximity sensor circuit is coupled to the transmitter circuit and is configured to output a detection signal therefrom responsive to authentication of an optical receiver including at least one photovoltaic cell having surface area of about 4 square millimeters or less within a proximity thereof. The transmitter circuit is configured to operate the laser light source below the lasing threshold to emit the incoherent light responsive to an absence of the detection signal from the proximity sensor circuit. Related devices and methods of operation are also discussed.

    Small-aperture-ratio display with electrical component
    43.
    发明授权
    Small-aperture-ratio display with electrical component 有权

    公开(公告)号：US09991163B2

    公开(公告)日：2018-06-05

    申请号：US14754573

    申请日：2015-06-29

    申请人： X-Celeprint Limited

    发明人： Christopher Bower ,  Robert R. Rotzoll ,  Matthew Meitl ,  Ronald S. Cok

    IPC分类号： H01L21/77 ,  G09F9/33

    CPC分类号： H01L21/77 ,  G09F9/33 ,  H01L25/0753 ,  H01L25/167

    摘要： A small-aperture-ratio display includes a display substrate and a plurality of spatially separated pixel elements distributed over the display substrate. Each pixel element includes one or more light emitters. An active electrical component is electrically connected to each of the pixel elements and each active electrical component is located on the display substrate at least partly between the pixel elements. The display substrate has a contiguous display substrate area that includes the pixel elements, the light emitters each have a light-emissive area, and the substrate area is greater than or equal to one-quarter the combined light-emissive areas of the light emitters.

    Serial row-select matrix-addressed system
    44.
    发明授权
    Serial row-select matrix-addressed system 有权

    公开(公告)号：US09930277B2

    公开(公告)日：2018-03-27

    申请号：US15003721

    申请日：2016-01-21

    申请人： X-Celeprint Limited

    发明人： Ronald S. Cok

    IPC分类号： H04N5/376 ,  G09G3/36 ,  G09G3/3208

    CPC分类号： H04N5/376 ,  G09G3/20 ,  G09G3/3208 ,  G09G3/3611 ,  G09G2300/0426 ,  G09G2310/0221 ,  G09G2310/0267 ,  G09G2310/0286 ,  H01L27/14601

    摘要： A matrix-addressed system includes a system substrate and an array of pixels arranged in rows and columns disposed on the system substrate. A column-control circuit provides information to or receives information from the pixels. The column-control circuit includes a separate column-driver circuit connected to each column of pixels that provides information in common to all of the pixels in the column or receives information in common from all of the pixels in the column. A row-select circuit likewise disposed on the system substrate includes a serial shift register having a number of row storage elements equal to or larger than the number of rows in the array of pixels. Each row storage element in the shift register has a row-select line connected to all of the pixels in a row.

    ELECTRICALLY PARALLEL FUSED LEDS
    46.
    发明申请
    ELECTRICALLY PARALLEL FUSED LEDS 审中-公开

    公开(公告)号：US20180007750A1

    公开(公告)日：2018-01-04

    申请号：US15704630

    申请日：2017-09-14

    申请人： X-Celeprint Limited

    发明人： Matthew Meitl ,  Ronald S. Cok ,  Christopher Bower

    IPC分类号： H05B33/08 ,  H01L21/66 ,  H01L27/15 ,  H01L33/62

    CPC分类号： H05B33/089 ,  G09G3/3406 ,  G09G2300/0426 ,  G09G2330/045 ,  G09G2330/08 ,  H01L22/24 ,  H01L27/0288 ,  H01L27/153 ,  H01L33/62 ,  H01L2933/0066

    摘要： An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.