公开(公告)号：US06353268B1

公开(公告)日：2002-03-05

申请号：US09274128

申请日：1999-03-22

申请人： Chad A. Cobbley ,  Tongbi Jiang ,  Ed A. Schrock

发明人： Chad A. Cobbley ,  Tongbi Jiang ,  Ed A. Schrock

IPC分类号： H01L2328

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method for attaching a semiconductor die to a leadframe is provided. Also provided are an improved semiconductor package, and a system for performing the method. The method includes applying an instant curing adhesive, such as a cyanoacrylate monomer or anaerobic adhesive, to the leadframe or die, and then polymerizing the adhesive at room temperature and ambient atmosphere, to form a cured adhesive layer between the die and lead frame. A catalyst can be applied to the leadframe, to the die or to the adhesive, to initiate polymerization. In addition, fillers can be added to the adhesive to improve various electrical and physical characteristics of the resultant adhesive layer. The system includes a dispensing mechanism for dispensing the instant curing adhesive on the leadframe or die, and a die attach mechanism for positioning and placing the die in contact with the dispensed adhesive.

摘要翻译： 提供了一种用于将半导体管芯附接到引线框架的方法。 还提供了改进的半导体封装以及用于执行该方法的系统。 该方法包括将即时固化粘合剂，例如氰基丙烯酸酯单体或厌氧粘合剂施加到引线框架或模具，然后在室温和环境气氛下聚合粘合剂，以在模头和引线框架之间形成固化的粘合剂层。 催化剂可以应用于引线框架，模具或粘合剂，以引发聚合。 此外，可以向粘合剂中加入填料以改善所得粘合剂层的各种电学和物理特性。 该系统包括用于在引线框架或模具上分配即时固化粘合剂的分配机构，以及用于定位和放置模具与分配的粘合剂接触的管芯附接机构。

公开(公告)号：US06268275B1

公开(公告)日：2001-07-31

申请号：US09168621

申请日：1998-10-08

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3478 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49211 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/532 ,  H01L2224/05599

摘要： Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire though-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

摘要翻译： 使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置和方法。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球漏斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。

公开(公告)号：US08716849B2

公开(公告)日：2014-05-06

申请号：US13438306

申请日：2012-04-03

申请人： Chad A. Cobbley ,  Cary J. Baerlocher

发明人： Chad A. Cobbley ,  Cary J. Baerlocher

IPC分类号： H01L23/495

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49558 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. A stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模塑）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。

公开(公告)号：US08629558B2

公开(公告)日：2014-01-14

申请号：US13490082

申请日：2012-06-06

申请人： Todd O. Bolken ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Chad A. Cobbley

IPC分类号： H01L21/00

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.

摘要翻译： 制造多器件组件的技术。 具体地，涉及用于制造包括至少一个I / C模块和多芯片封装的堆叠封装的技术。 多芯片封装包括耦合到载体的多个集成电路芯片。 骰子被封装，使得导电元件通过密封剂暴露。 导电元件电耦合到芯片。 I / C模块包括具有设置在其上的多个集成电路芯片的插入器。 I / C模块的裸片通过焊丝电耦合到插入器。 插入器被配置为使得通孔与多芯片封装上的导电元件对准。 多芯片封装和I / C模块可以单独制造，然后耦合在一起以形成堆叠封装。

公开(公告)号：US20120187552A1

公开(公告)日：2012-07-26

申请号：US13438306

申请日：2012-04-03

申请人： Chad A. Cobbley ,  Cary J. Baerlocher

发明人： Chad A. Cobbley ,  Cary J. Baerlocher

IPC分类号： H01L23/31

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49558 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

摘要翻译： 提供了模制到诸如引线框架的半导体衬底的加强件以及将加强件模制到基底的方法。 加强件被模制到基底上以为基底提供刚性和支撑。 加强材料可以包括通过模制技术（例如传递模塑，注模和喷射模制）或使用封装材料模制到基底上的聚合物材料。 可以在衬底上设置一个或多个管芯，芯片或其它半导体或微电子器件以形成管芯组件。 加强件可以模制到包括一个或多个管芯的基底上，在其上可以施加封装材料以制造半导体管芯封装。

公开(公告)号：US08115296B2

公开(公告)日：2012-02-14

申请号：US12579187

申请日：2009-10-14

申请人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20100264532A1

公开(公告)日：2010-10-21

申请号：US12579187

申请日：2009-10-14

申请人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

发明人： Todd O. Bolken ,  Cary J. Baerlocher ,  Steven W. Heppler ,  Chad A. Cobbley

IPC分类号： H01L23/10

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US07755204B2

公开(公告)日：2010-07-13

申请号：US10672750

申请日：2003-09-25

申请人： Chad A. Cobbley ,  Timothy L. Jackson

发明人： Chad A. Cobbley ,  Timothy L. Jackson

IPC分类号： H01L23/02 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L25/50 ,  H01L22/20 ,  H01L23/481 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a second die via the stacking tip. The second die is coupled to the first die via the adhesive on the underside of the first die. The second die is coated with an adhesive coating on the underside of the die. The second die is then brought in contact with a third die via the stacking tip. The third die is coupled to the second die via the adhesive on the underside of the second die, and so forth. Die stacks are formed without being coupled to a substrate. The die stacks may be functionally and/or environmentally tested before attaching the die stack to a substrate.

摘要翻译： 一种用于形成模具叠层的技术。 具体地，提供了堆叠顶端以便于以期望的构造堆叠模具。 第一个模具被堆垛顶部拾起。 第一个模具在模具的下侧涂有粘合剂。 第一模具通过堆叠顶端与第二模具接触。 第二管芯通过第一管芯的下侧上的粘合剂与第一管芯相连。 第二个模具在模具的下侧涂有粘合剂涂层。 然后通过堆叠顶端将第二模具与第三模具接触。 第三模具通过第二模具的下侧上的粘合剂连接到第二模具，等等。 在不耦合到衬底的情况下形成管芯堆叠。 在将管芯堆叠连接到衬底之前，管芯堆叠可以是功能和/或环境测试的。

公开(公告)号：US07635079B1

公开(公告)日：2009-12-22

申请号：US09576727

申请日：2000-05-23

申请人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

发明人： Chad A. Cobbley ,  Michael B. Ball ,  Marjorie L. Waddel

IPC分类号： B23K35/12 ,  B23K1/00 ,  B23K35/14

CPC分类号： H01L24/12 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3478 ,  H05K2203/0126 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49211 ,  Y10T29/49222 ,  Y10T29/53178 ,  Y10T29/532 ,  H01L2224/05599

摘要： System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

摘要翻译： 用于使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在基底的预先焊接的焊盘上的系统。 导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。 在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。 在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。

公开(公告)号：US07476277B2

公开(公告)日：2009-01-13

申请号：US10701140

申请日：2003-11-04

申请人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

发明人： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC分类号： B05C11/00

CPC分类号： B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

摘要： A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

摘要翻译： 公开了一种用于改进模板/丝网印刷质量的方法和装置。 在片上（LOC）包装过程中，模板或屏幕有助于将可印刷材料施加到基底上，例如对半导体晶片的半导体管芯的粘合剂。 在一个实施例中，模板包括施加到模板或筛网的图案的至少一个表面上的涂层，以阻止可印刷材料运动到表面上。 在另一个实施例中，模板或丝网包括施加到图案的至少一个其他表面的第二涂层，以促进可印刷材料在基底上的铺展。