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69 条记录 (耗时 0.034 秒)

    System and method for capturing contaminants within a disk drive
    41.
    发明授权
    System and method for capturing contaminants within a disk drive 失效
    用于捕获磁盘驱动器内的污染物的系统和方法

    公开(公告)号：US06980392B2

    公开(公告)日：2005-12-27

    申请号：US10409748

    申请日：2003-04-08

    申请人： Mark V. Pierson

    发明人： Mark V. Pierson

    IPC分类号： G11B25/04 ,  G11B33/14 ,  G11B5/54

    CPC分类号： G11B25/043 ,  G11B33/1446

    摘要： Under the present invention, a contaminant capturing material is positioned within a disk drive. Specifically, the contaminant capturing material is positioned on a suspension, adjacent a slider that hovers proximate a disk within the disk drive when the disk is in rotation. The contaminant capturing material will prevent contaminants from contacting the disk and thereby causing damage. In addition, a set of porous, open celled filters that are coated with the contaminant capturing material can also be provided. If used, the open celled filters are positioned adjacent the disk within an air stream created by a rotation of the disk.

    摘要翻译： 在本发明中，污染物捕获材料位于盘驱动器内。 具体而言，当盘旋转时，污染物捕获材料位于悬挂件的附近，该盘片靠近磁盘驱动器内的磁盘。 污染物捕获材料将防止污染物接触盘，从而造成损坏。 此外，还可以提供涂覆有污染物捕获材料的一组多孔，开孔式过滤器。 如果使用，开放式过滤器通过由盘的旋转产生的空气流中定位在盘附近。

    Fiber optic attachment method, structure, and system
    42.
    发明授权
    Fiber optic attachment method, structure, and system 有权
    光纤连接方法，结构和系统

    公开(公告)号：US06917728B2

    公开(公告)日：2005-07-12

    申请号：US10608057

    申请日：2003-06-27

    申请人： Michael S. Lemmon ,  Mark V. Pierson

    发明人： Michael S. Lemmon ,  Mark V. Pierson

    IPC分类号： G02B6/255 ,  G02B6/42 ,  G02B6/12

    CPC分类号： G02B6/4202 ,  G02B6/2552

    摘要： An attachment structure, and an associated method and system for forming the attachment structure. An end of an optical fiber is melted while the end is above, but not touching, an exposed surface of a substrate such that said end becomes molten. The optical fiber is substantially optically transparent to laser radiation of a given wavelength. The molten end is moved toward the exposed surface of the substrate until the end makes physical contact with the exposed surface of the substrate. The moving is performed sufficiently fast so that the end is still molten when the end initially makes the physical contact with the exposed surface of the substrate. The physical contact is maintained for a sufficient length of time to enable the end to bond to the exposed surface of the substrate with no intervening matter between the end and the exposed surface of the substrate.

    摘要翻译： 附件结构以及用于形成附接结构的相关联的方法和系统。 光纤的端部熔化，而端部在基板的暴露表面上方但不接触，使得端部熔化。 光纤对于给定波长的激光辐射基本上是光学透明的。 熔融端朝向衬底的暴露表面移动，直到端部与衬底的暴露表面物理接触为止。 移动足够快地进行，使得当端部最初与衬底的暴露表面物理接触时，端部仍然熔化。 保持物理接触足够长的时间，以使端部能够在衬底的端部和暴露表面之间没有中间物质结合到衬底的暴露表面。

    Method and device for semiconductor testing using electrically conductive adhesives
    44.
    发明授权
    Method and device for semiconductor testing using electrically conductive adhesives 失效
    使用导电胶粘剂进行半导体测试的方法和装置

    公开(公告)号：US06559666B2

    公开(公告)日：2003-05-06

    申请号：US09875246

    申请日：2001-06-06

    申请人： William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

    发明人： William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

    IPC分类号： G01R3102

    CPC分类号： G01R31/2886 ,  H01L2224/45144 ,  H01L2224/81385 ,  H01L2224/83101 ,  H05K3/321 ,  H01L2924/00

    摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.

    摘要翻译： 一种用于测试和燃烧半导体电路的方法和装置。 该方法和装置允许通过使用导电粘合剂（ECA）将晶片临时附接到测试基板来测试整个晶片。 ECA符合晶片和测试基板的接触点的共平面偏差，同时在每个点提供质量电连接。 ECA材料可以沉积在晶片触点或衬底焊盘上。 此外，ECA可以沉积在C4凸点或锡盖铅基上。 该方法和装置的变化包括用ECA填充非导电插入件的通孔。 可以通过在测试焊盘上形成导电枝晶而增加电连接，同时将ECA沉积在晶片触点上。 为了进一步增强电连接，可以对ECA材料进行等离子体蚀刻以除去其一些聚合物基质并使一面上的导电颗粒暴露，然后用钯镀覆。 在镀钯的ECA与铝焊盘，钯涂覆的铝焊盘或甚至C4焊料凸块接触之后，在钯处理的ECA凸块上形成导电枝晶。

    Dockable interface airlock between process enclosure and interprocess transfer container
    50.
    发明授权
    Dockable interface airlock between process enclosure and interprocess transfer container 失效
    过程外壳和过程间转移容器之间的可对接界面气闸

    公开(公告)号：US5451131A

    公开(公告)日：1995-09-19

    申请号：US901041

    申请日：1992-06-19

    申请人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    发明人： Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

    IPC分类号： H01L21/02 ,  F24F7/06 ,  H01L21/00 ,  H01L21/677 ,  B65G1/00 ,  B23B29/24 ,  B65G65/34 ,  C23C14/00

    CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14 ,  Y10T29/53191

    摘要： Disclosed is a manufacturing system having isolated islands of "clean room" environment connected by inter-process transfer containers for transfering in-process workpieces. The system has airlock transfer ports between the process enclosures and the inter-process transfer containers. The make and break airlock transfer ports have facing sealable doors in the process enclosure and the transfer container. These doors are in air sealable facing recesses of the process enclosure and the transfer container. At least one peripheral gasket surrounds the recesses and the pair of doors. This provides a substantially clean room environment in the airlock. The sealable door in the interprocess transfer container is fabricated of a ferromagnetic material and is seated on a ferromagnetic gasket, while the sealable door in the process enclosure has a controllable electromagnetic clamp. After establishment of an airtight seal between the two recesses, the doors are opened by activating the electromagnetic clamp in the process enclosure door to pull the ferromagnetic door in the interprocess transfer container away from the ferromagnetic gasket. The results in the simultaneous opening of the of the process enclosure door and the ferromagnetic interprocess transfer container door, while avoiding contamination inside either of the containers.

    摘要翻译： 公开了一种具有通过过程间转移容器连接的隔离岛“洁净室”环境的制造系统，用于转移过程中的工件。 该系统在进程外壳和进程间转移容器之间具有气闸传送端口。 制造和拆卸气闸传输端口在处理外壳和转移容器中具有面对的可密封的门。 这些门在处理外壳和转移容器的空气密封面对的凹部中。 至少一个外围垫圈围绕凹槽和一对门。 这在气闸中提供了基本洁净的房间环境。 处理间转移容器中的可密封的门由铁磁材料制成并且位于铁磁性垫圈上，而过程外壳中的可密封的门具有可控的电磁夹。 在两个凹口之间建立密封密封之后，通过启动过程外壳门中的电磁夹具来打开门，以将处理间转移容器中的铁磁门拉离铁磁垫圈。 结果是同时打开过程外壳门和铁磁过程转移容器门，同时避免了任何一个容器内的污染。