公开(公告)号：US07154189B2

公开(公告)日：2006-12-26

申请号：US11035986

申请日：2005-01-18

申请人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

发明人： Kenji Maeda ,  Takashi Takata ,  Takao Ochi ,  Hiroki Naraoka ,  Takeshi Kawabata ,  Yoshiyuki Arai ,  Shigeru Nonoyama ,  Hajime Homma

IPC分类号： H01L23/29 ,  H01L23/31

CPC分类号： H05K1/186 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15787 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

公开(公告)号：US20060231939A1

公开(公告)日：2006-10-19

申请号：US11405478

申请日：2006-04-18

申请人： Takeshi Kawabata ,  Motoaki Satou ,  Toshiyuki Fukuda ,  Toshio Tsuda ,  Kazuhiro Nobori ,  Seiichi Nakatani

发明人： Takeshi Kawabata ,  Motoaki Satou ,  Toshiyuki Fukuda ,  Toshio Tsuda ,  Kazuhiro Nobori ,  Seiichi Nakatani

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor module is formed by alternately stacking resin boards and sheet members. Each of the resin boards includes first buried conductors. A semiconductor chip is mounted on the upper face of each of the resin boards. Each of the sheet members having an opening for accommodating the semiconductor chip and including second buried conductors electrically connected to the first buried conductors. A first resin board located at the bottom is thicker than second resin boards. Each of the sheet members includes an adhesive member covering the upper and side faces of the semiconductor chip.

公开(公告)号：US08940471B2

公开(公告)日：2015-01-27

申请号：US12895300

申请日：2010-09-30

申请人： Takeshi Kawabata ,  Tomotaka Tsuchimura ,  Takayuki Ito

发明人： Takeshi Kawabata ,  Tomotaka Tsuchimura ,  Takayuki Ito

IPC分类号： G03F7/004 ,  G03F7/028 ,  G03F7/039

CPC分类号： G03F7/0045 ,  G03F7/0046 ,  G03F7/028 ,  G03F7/0397 ,  Y10S430/12 ,  Y10S430/122 ,  Y10S430/126

摘要： According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below, in which W1 represents an optionally substituted alkylene group, W2 represents a bivalent connecting group, W3 represents an optionally substituted organic group having 15 or more carbon atoms, and Z represents a hydroxyl group or a fluoroalkylsulfonamido group having at least one fluorine atom introduced therein as a substituent.

摘要翻译： 根据一个实施方案，光化射线或辐射敏感性树脂组合物包括当暴露于光化射线或辐射时产生下列通式（I）的任何酸的化合物，其中W 1表示任选取代的亚烷基， W2表示二价连接基团，W3表示具有15个或更多个碳原子的任选取代的有机基团，Z表示其中引入有至少一个氟原子的羟基或氟烷基亚磺酰氨基作为取代基。

公开(公告)号：US08893377B2

公开(公告)日：2014-11-25

申请号：US13321163

申请日：2011-04-26

申请人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

发明人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

IPC分类号： H01L21/67 ,  H01L23/00

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/753 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75801 ,  H01L2224/75821 ,  H01L2224/759 ,  H01L2224/7592 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2933/0033 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

摘要： When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light-emitting element 2 to emit light, the optical properties of the semiconductor light-emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light-emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.

摘要翻译： 半导体发光元件2的凸块电极26和安装基板3的电极部21彼此接合时，向安装基板3的电极部21供电，使半导体发光元件2 发光，检测出具有发光的半导体发光元件2的光学特性，并且对光学特性的检测值进行处理，以获得半导体发光元件2的凸块电极26和电极的接合状态 安装板3的部分21，从而确定接合的完成。 因此，半导体发光元件可以通过形成在半导体发光元件上的金属电极令人满意地接合到安装板上的电极部分。

公开(公告)号：US08619976B2

公开(公告)日：2013-12-31

申请号：US12747944

申请日：2008-12-11

申请人： Tomoyasu Suzaki ,  Yukiyasu Tsunoo ,  Hiroyasu Kubo ,  Maki Shigeri ,  Teruo Saito ,  Takeshi Kawabata ,  Hiroki Nakashima

发明人： Tomoyasu Suzaki ,  Yukiyasu Tsunoo ,  Hiroyasu Kubo ,  Maki Shigeri ,  Teruo Saito ,  Takeshi Kawabata ,  Hiroki Nakashima

IPC分类号： H04K1/00

CPC分类号： H04L9/002 ,  H04L9/0625

摘要： An encryption/decryption method comprises by using a generalized Feistel structure in which data is divided into n pieces and mixing processing with key data is performed, diffusion processing, in which data transformation via linear operation is executed, is performed at least once between rounds of the generalized Feistel structure, wherein. As the diffusion processing, linear transformation is performed in which each of n pieces of output data is operated on by two or more pieces of input data. The method is adapted for encryption or decryption.

摘要翻译： 一种加密/解密方法包括：通过使用将数据划分成n个并且进行与密钥数据的混合处理的广义Feistel结构，其中执行通过线性操作进行数据变换的扩散处理在轮之间进行至少一次 广义Feistel结构，其中。 作为扩散处理，执行线性变换，其中n个输出数据中的每一个通过两个或更多个输入数据进行操作。 该方法适用于加密或解密。

公开(公告)号：US08552549B2

公开(公告)日：2013-10-08

申请号：US13404116

申请日：2012-02-24

申请人： Masatoshi Shinagawa ,  Takeshi Kawabata

发明人： Masatoshi Shinagawa ,  Takeshi Kawabata

IPC分类号： H01L23/053

CPC分类号： H01L22/34 ,  G01R31/2853 ,  G01R31/318513 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In a substrate for a stacking-type semiconductor device including a connection terminal provided for a connection with a semiconductor chip to be stacked and an external terminal connected to the connection terminal through a conductor provided in a substrate, connection terminals of a power supply, a ground and the like, which terminals have an identical node, are electrically continuous with each other. Thus, it is possible to facilitate an inspection of electrical continuity between each connection terminal and an external terminal corresponding to each connection terminal by minimum addition of inspecting terminals. Further, it is possible to improve reliability of a stacking-type semiconductor module.

摘要翻译： 在用于堆叠型半导体器件的衬底中，其包括设置用于与要堆叠的半导体芯片的连接的连接端子和通过设置在衬底中的导体连接到连接端子的外部端子，电源的连接端子， 接地等，这些端子具有相同的节点，彼此是电连续的。 因此，可以通过检查终端的最小的添加来便于检查每个连接端子与对应于每个连接端子的外部端子之间的电连续性。 此外，可以提高层叠型半导体模块的可靠性。

公开(公告)号：US08159061B2

公开(公告)日：2012-04-17

申请号：US12710025

申请日：2010-02-22

申请人： Takeshi Kawabata ,  Toshiyuki Fukuda

发明人： Takeshi Kawabata ,  Toshiyuki Fukuda

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00011

摘要： A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.

摘要翻译： 层叠半导体模块通过将具有第二半导体芯片的第二半导体器件堆叠在第一半导体器件的顶表面上方的第二半导体衬底的顶表面上，该第二半导体器件具有安装在第一半导体衬底上的第一半导体芯片。 第一半导体衬底的顶表面设置有第一连接端子，并且第一半导体衬底的底表面设置有外部连接端子。 与第二半导体芯片相对的第二半导体衬底的底表面的区域设置有第二连接端子。 导电连接构件将第一连接端子连接到第二连接端子。

公开(公告)号：US08008766B2

公开(公告)日：2011-08-30

申请号：US12645256

申请日：2009-12-22

申请人： Takeshi Kawabata ,  Toshiyuki Fukuda

发明人： Takeshi Kawabata ,  Toshiyuki Fukuda

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06558 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00011

摘要： A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal.

摘要翻译： 层叠半导体模块通过将具有第二半导体芯片的第二半导体器件堆叠在第一半导体器件的顶表面上方的第二半导体衬底的顶表面上，该第二半导体器件具有安装到第一半导体衬底的第一半导体芯片。 第一半导体衬底的顶表面设置有第一连接端子，并且第一半导体衬底的底表面设置有外部连接端子。 与第二半导体芯片相对的第二半导体衬底的底表面的区域设置有第二连接端子。 导电连接构件将第一连接端子连接到第二连接端子。

公开(公告)号：US20100266122A1

公开(公告)日：2010-10-21

申请号：US12747944

申请日：2008-12-11

申请人： Tomoyasu Suzaki ,  Yukiyasu Tsunoo ,  Hiroyasu Kubo ,  Maki Shigeri ,  Teruo Saito ,  Takeshi Kawabata ,  Hiroki Nakashima

发明人： Tomoyasu Suzaki ,  Yukiyasu Tsunoo ,  Hiroyasu Kubo ,  Maki Shigeri ,  Teruo Saito ,  Takeshi Kawabata ,  Hiroki Nakashima

IPC分类号： H04L9/28

CPC分类号： H04L9/002 ,  H04L9/0625

摘要： An encryption/decryption method comprises by using a generalized Feistel structure in which data is divided into n pieces and mixing processing with key data is performed, diffusion processing, in which data transformation via linear operation is executed, is performed at least once between rounds of the generalized Feistel structure, wherein. As the diffusion processing, linear transformation is performed in which each of n pieces of output data is operated on by two or more pieces of input data. The method is adapted for encryption or decryption.

摘要翻译： 一种加密/解密方法包括：通过使用将数据划分成n个并且进行与密钥数据的混合处理的广义Feistel结构，其中执行通过线性操作进行数据变换的扩散处理在轮之间进行至少一次 广义Feistel结构，其中。 作为扩散处理，执行线性变换，其中n个输出数据中的每一个通过两个或更多个输入数据进行操作。 该方法适用于加密或解密。

公开(公告)号：US20080067661A1

公开(公告)日：2008-03-20

申请号：US11878538

申请日：2007-07-25

申请人： Takeshi Kawabata

发明人： Takeshi Kawabata

IPC分类号： H01L23/48 ,  H05K7/00

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L23/538 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83051 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： On a surface of a resin base material (11), a first resin coating film (19) having a larger thickness and a larger area than a second resin coating film (20) formed on the other surface of the resin base material (11) is continuously formed. The second resin coating film (20) is formed so as to be separated into a plurality of portions.

摘要翻译： 在树脂基材（11）的表面上，具有比在树脂基材（11）的另一面上形成的第二树脂涂膜（20）更大的面积的面积的第一树脂涂膜（19） 不断形成。 第二树脂涂膜（20）形成为分离成多个部分。