POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS
    47.
    发明申请
    POST METAL CHEMICAL-MECHANICAL PLANARIZATION CLEANING PROCESS 有权
    后金属化学机械平面清洁过程

    公开(公告)号:US20140256133A1

    公开(公告)日:2014-09-11

    申请号:US13786970

    申请日:2013-03-06

    IPC分类号: H01L21/02

    摘要: A post metal chemical-mechanical planarization (CMP) cleaning process for advanced interconnect technology is provided. The process, which follows CMP, combines an acidic clean and a basic clean in sequence. The process can achieve a more than 60% reduction in CMP defects, such as polish residues, foreign materials, slurry abrasives, scratches, and hollow metal, relative to an all-basic clean process. The process also eliminates the circular ring defects that occur intermittently during roller brush cleans within a roller brush clean module.

    摘要翻译: 提供了一种用于先进互连技术的后金属化学 - 机械平面化(CMP)清洁工艺。 遵循CMP的方法依次组合了酸性清洁剂和碱性清洁剂。 相对于全基础清洁工艺,该方法可以实现CMP缺陷的减少60%以上,例如抛光残渣,异物,浆料磨料,划痕和中空金属。 该过程还消除了在辊刷清洁模块内的辊刷清洁过程中间歇性发生的圆环缺陷。

    MAGNETIC RANDOM ACCESS MEMORY WITH PERMANENT PHOTO-PATTERNABLE LOW-K DIELECTRIC

    公开(公告)号:US20200066792A1

    公开(公告)日:2020-02-27

    申请号:US16671976

    申请日:2019-11-01

    发明人: Qinghuang Lin

    摘要: A method of forming a device that includes encapsulating a magnetic resistive access memory (MRAM) stack with a first patternable low-k dielectric material that is patterned by an exposure to produce a via pattern that extends to circuitry to logic devices. The via pattern is developed forming a via opening. The method further includes forming a second patternable low-k dielectric material over first patternable low-k dielectric material and filling the via opening. The second patternable low-k dielectric material is patterned by a light exposure to produce a first line pattern to the MRAM stack and a second line pattern to the via opening. The first line pattern and the second line pattern are developed to form trench openings. Thereafter, electrically conductive material is formed in the trench openings and the via opening.