公开(公告)号：US07759754B2

公开(公告)日：2010-07-20

申请号：US10579542

申请日：2004-10-27

申请人： Ewald Gunther ,  Jorg-Erich Sorg ,  Karl Weidner ,  Jorg Zapf

发明人： Ewald Gunther ,  Jorg-Erich Sorg ,  Karl Weidner ,  Jorg Zapf

IPC分类号： H01L31/113

CPC分类号： H01L33/486 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T428/24331 ,  H01L2224/82 ,  H01L2924/00

摘要： An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner.

摘要翻译： 提供了一种用于LED和其他光电子模块的经济型小型化组装和连接技术。 根据该技术的制造物品包括具有以平面方式接触的光电子部件的基板。

公开(公告)号：US20090109024A1

公开(公告)日：2009-04-30

申请号：US11988131

申请日：2005-06-30

申请人： Karl Weidner ,  Anton Wimmer

发明人： Karl Weidner ,  Anton Wimmer

IPC分类号： G08B21/00

CPC分类号： H05K1/0275 ,  G06F21/86 ,  H05K1/0268 ,  H05K1/0284 ,  H05K1/144 ,  H05K2201/10151

摘要： A circuit which is to be protected contains a substrate which includes a recoiling area is surrounded by protruding areas. A hardware protection system is provided as half-shells and includes conductor structures arranged on and/or in the substrate to detect access to the circuit which is protected.

摘要翻译： 要被保护的电路包含一个衬底，该衬底包括一个反冲区域被突出区域包围。 硬件保护系统被提供为半壳，并且包括布置在衬底上和/或衬底中的导体结构，以检测对被保护电路的访问。

公开(公告)号：US07427532B2

公开(公告)日：2008-09-23

申请号：US10547119

申请日：2004-01-23

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/50 ,  H01L21/48

CPC分类号： H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

摘要翻译： 根据本发明，将由电绝缘材料制成的层施加到基板和其上配置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US20080128710A1

公开(公告)日：2008-06-05

申请号：US11816186

申请日：2005-12-21

申请人： Karl Weidner ,  Robert Weinke

发明人： Karl Weidner ,  Robert Weinke

IPC分类号： H01L29/24 ,  H01L21/66 ,  H01L21/768

CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

公开(公告)号：US07208347B2

公开(公告)日：2007-04-24

申请号：US10547173

申请日：2004-01-26

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/072 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/01004 ,  H01L2924/00015

摘要： A layer of electrically insulating material is applied to a substrate and a component located thereon, in such a way that said layer follows the surface contours.

摘要翻译： 将一层电绝缘材料施加到基板和位于其上的部件，使得所述层遵循表面轮廓。

公开(公告)号：US20060252253A1

公开(公告)日：2006-11-09

申请号：US10547119

申请日：2004-01-23

申请人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

发明人： Norbert Seliger ,  Karl Weidner ,  Jörg Zapf

IPC分类号： H01L21/4763

CPC分类号： H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15798 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48

摘要： According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

摘要翻译： 根据本发明，将由电绝缘材料制成的层施加到基板和其上布置的部件，使得所述层遵循由基板和部件形成的表面轮廓。

公开(公告)号：US20060248716A1

公开(公告)日：2006-11-09

申请号：US10547174

申请日：2004-01-15

申请人： Karl Weidner ,  Prof. Eckhard Wolfgang ,  Jörg Zapf

发明人： Karl Weidner ,  Prof. Eckhard Wolfgang ,  Jörg Zapf

IPC分类号： H01L21/84

CPC分类号： H01L23/4822 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/82001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

摘要翻译： 通过将由非导电材料制成的层和由导电材料制成的层施加到组件和支撑件上并随后从其中除去这些层而直接在不具有外壳的部件上产生自支撑接触结构 说支持。

公开(公告)号：US06504104B2

公开(公告)日：2003-01-07

申请号：US09845378

申请日：2001-04-30

申请人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

发明人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

IPC分类号： H05K100

CPC分类号： H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

摘要翻译： 将具有边缘触点的IC衬底转换成球栅阵列是使用柔性电路来实现的，所述柔性电路具有平面地布置在底面上用于接收可熔化焊料凸起的端子，并且其从端子向外引出的导体具有暴露端。 柔性电路的上侧与基板的下侧连接，于是柔性电路的边缘区域向上弯曲并围绕基板，并且导体的端部与基板的边缘触点电接触。

公开(公告)号：US5321625A

公开(公告)日：1994-06-14

申请号：US802890

申请日：1991-12-06

申请人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

发明人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

IPC分类号： B65G1/127 ,  B65G1/137 ,  B65G47/10 ,  G07F5/18 ,  G07F11/58 ,  G06F15/20

CPC分类号： G07F11/002 ,  G07F11/58 ,  G07F5/18

摘要： The apparatus is provided for delivering assembly and machining expendable materials or tools. It comprises an internal continuous lift mechanism with different compartment rows arranged in rotary manner to move past a removal door row. An inputting keyboard for the positioning of the particular compartment row in front of the removal door row also controls the unlocking of door in the door row associated with the selected compartment.The delivery unit is connected by means of a long-range transmission means to a data processing unit, which records the removal of materials and optionally initiates reloading, billing, etc.

摘要翻译： 该设备用于提供装配和加工消耗性材料或工具。 它包括具有以旋转方式布置的不同隔间列的内部连续提升机构以移动通过拆卸门排。 用于将特定隔室排定位在拆卸门排前面的输入键盘还控制与所选隔间相关联的门排中的门的解锁。 传送单元通过远程传输装置连接到数据处理单元，该数据处理单元记录材料的去除并可选地启动重新加载，计费等。

公开(公告)号：US09331010B2

公开(公告)日：2016-05-03

申请号：US12996738

申请日：2009-06-03

申请人： Wolfgang Pahl ,  Karl Weidner

发明人： Wolfgang Pahl ,  Karl Weidner

IPC分类号： H01L23/495 ,  H01L23/498 ,  B81B7/00 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/4985 ,  B81B7/0048 ,  B81B2207/07 ,  H01L23/498 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

摘要： A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.

摘要翻译： 芯片（2,3）布置在柔性支撑件（1）的顶侧上方并且与支撑件机械地分离。 使用平面连接技术来实现芯片的电连接（8,11）。 芯片可以通过气隙或由软或可压缩材料构成的基层（7）与支撑体分离。